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AMD XC3S700A-5FGG400C
- Part No.:
- XC3S700A-5FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S700A-5FGG400C.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,129
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Product details
Overview
XC3S700A-5FGG400C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,920 logic cells, and 432 I/O pins in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 500 MHz system clock speed with embedded block RAM and DSP slices, targeting low-cost, high-volume consumer and industrial control applications.
For engineers reviewing the XC3S700A-5FGG400C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, embedded memory depth, supply voltage tolerance, and configuration interface compatibility with SPI or JTAG.
Technical Context
The XC3S700A-5FGG400C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology for LVCMOS, LVTTL, PCI, and SSTL I/O standards across all banks.
Configuration is performed via master serial mode using an external PROM or through JTAG boundary-scan. The device includes internal oscillator for startup and supports full IEEE 1149.1 compliance for test and debug.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,920 - defines maximum combinational/sequential logic capacity for RTL implementation |
| System Gates | 700,000 - indicates relative logic density benchmarked against ASIC gate count |
| I/O Pins | 432 - supports high-pin-count interfaces including parallel buses and multi-channel ADC/DAC |
| Block RAM | 576 Kbits - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| Max System Clock | 500 MHz - determines highest synchronous operation frequency for timing-critical logic paths |
| Supply Voltage | 1.2 V core / 3.3 V I/O - requires dual-rail power design with separate regulation and decoupling |
| Configuration Mode | Master Serial, JTAG - enables boot from external SPI PROM or direct programming via boundary-scan chain |
Pinout & Package
XC3S700A-5FGG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size and 0.8 mm ball pitch. Thermal pad on underside requires solder paste stencil design per Xilinx packaging guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial mode; must be driven by external PROM or microcontroller |
| DIN | Configuration Data Input | Serial data input from PROM or configuration controller; synchronized to CCLK edge |
| PROG_B | Program Initiate | Active-low signal that resets configuration logic and clears internal SRAM before new bitstream load |
| INIT_B | Configuration Status Output | Open-drain output indicating configuration status; pulled high externally when ready or during error |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port used for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports mixed-voltage I/O banks with independent VCCO per bank, enabling interface to multiple logic families |
| Dedicated Multiplier Blocks | 16 × 16-bit hard multipliers accelerate arithmetic-intensive functions like filtering and motor control |
| Embedded Block RAM | 18-Kbit blocks configurable as dual-port RAM, ROM, or shift register for flexible on-die memory |
| Internal Oscillator | ~4 MHz RC oscillator provides clock source for configuration state machine and startup sequencing |
| MultiBoot Support | Allows up to two configuration images stored in external PROM for field-upgradable firmware selection |
Applications
| Industrial PLC Controller | Video Interface Bridge |
|---|---|
Use Scenario: Real-time logic execution for ladder logic scanning, motion profiling, and I/O scanning in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan cycles with sub-millisecond latency and synchronized I/O updates. Use Value: Enables single-chip replacement of discrete glue logic and microcontroller peripherals while supporting custom instruction extensions. | Use Scenario: Conversion between HDMI 1.3a pixel data and parallel RGB/YUV signals for display driver integration in digital signage systems. IC Role / Device Role / Timing Role: Pixel-rate video processing engine handling color space conversion, timing alignment, and format adaptation. Use Value: Eliminates need for external frame buffers by leveraging 576 Kbits of block RAM for line buffering and phase correction. |
| Automotive Camera Preprocessor | Medical Sensor Hub |
Use Scenario: Front-end image conditioning for ADAS cameras, including black level calibration, lens distortion correction, and noise filtering prior to SoC ingestion. IC Role / Device Role / Timing Role: Real-time pixel pipeline processor with precise clock domain crossing between sensor MIPI CSI-2 and parallel output interfaces. Use Value: Provides deterministic latency under 2 lines of video, meeting ASIL-B timing constraints without software intervention. | Use Scenario: Aggregation and preprocessing of analog sensor inputs (ECG, SpO₂, temperature) in portable patient monitors with USB HID output. IC Role / Device Role / Timing Role: Mixed-signal interface hub managing simultaneous SAR ADC sampling, digital filtering, and protocol translation. Use Value: Reduces BOM count by integrating 432 I/Os, 17,920 logic cells, and embedded RAM into one reprogrammable platform. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FGG400C | Higher logic density (21,248 CLBs), same package and I/O count | Better suited for designs requiring larger state machines or more complex datapaths | Select when additional logic resources are needed without changing PCB layout |
| XC3S500E-4FGG320C | Fewer I/O (232), smaller 320-pin FBGA, lower gate count (500K) | Targeted at cost-sensitive, lower-complexity embedded control with reduced board area | Choose for simplified designs where 432 I/O and 700K gates are unnecessary |
Compared with XC3S700A-5FGG400C, XC3S1000-5FGG400C offers headroom for future feature expansion within identical footprint, while XC3S500E-4FGG320C trades I/O count and logic capacity for lower unit cost and smaller board area.
Availability
XC3S700A-5FGG400C is available at Aetrix Electronics and suitable for industrial automation, video processing, and medical instrumentation requiring stable component supply and long-term production support.
Supply support for XC3S700A-5FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized programmable logic solutions.
The Spartan-3A product line was designed for high-volume, price-sensitive applications requiring reliable reconfigurable logic with integrated memory and I/O flexibility.
FAQ
What is the configuration method supported by XC3S700A-5FGG400C?
The XC3S700A-5FGG400C supports master serial configuration using an external SPI PROM and IEEE 1149.1 JTAG boundary-scan for programming and debugging. It does not support slave parallel or BPI modes. Configuration bitstream is loaded into volatile SRAM upon power-up, requiring persistent storage off-chip.
Does XC3S700A-5FGG400C include built-in clock management resources?
No, XC3S700A-5FGG400C lacks dedicated digital clock managers (DCMs) or PLLs. Timing control relies on external oscillators or the internal 4 MHz RC oscillator for configuration startup only. High-precision clock synthesis requires external clock ICs or routing through logic fabric.
What is the maximum operating temperature range for XC3S700A-5FGG400C?
XC3S700A-5FGG400C is rated for commercial temperature range (0 °C to +85 °C ambient). It is not qualified for extended or industrial temperature grades. Thermal derating applies above 70 °C ambient depending on power dissipation and PCB thermal design.
Can XC3S700A-5FGG400C interface directly with DDR SDRAM?
XC3S700A-5FGG400C does not support DDR SDRAM interfaces natively. Its I/O standards include LVCMOS and SSTL-2, but lack dedicated DDR timing control or DQS capture logic. Reliable DDR interfacing requires external PHY or careful manual timing closure with significant margin loss.
Is XC3S700A-5FGG400C still in active production?
XC3S700A-5FGG400C is in legacy status with last-time-buy availability. AMD maintains limited inventory and supports existing designs through authorized distributors, but no new silicon fabrication is scheduled. Long-term projects should evaluate migration paths to Spartan-7 or Artix-7 families.
XC3S700A-5FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S700A-5FGG400C FAQ
1.How can I place an order for XC3S700A-5FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-5FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-5FGG400C reliable?
The price and inventory of XC3S700A-5FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-5FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S700A-5FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-5FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-5FGG400C?
XC3S700A-5FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-5FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-5FGG400C?
For technical support, including XC3S700A-5FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-5FGG400C requirements.
6.How does Aetrix verify that XC3S700A-5FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-5FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-5FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S700A-5FGG400C?
All XC3S700A-5FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-5FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-5FGG400C part is unused and in its original packaging.
Return procedure for XC3S700A-5FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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