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AMD XC3S700A-5FGG484C
- Part No.:
- XC3S700A-5FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700A-5FGG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,652
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Product details
Overview
XC3S700A-5FGG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It operates at -5 speed grade (1.56 ns CLB delay), supports 3.3V/2.5V/1.2V I/Os, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S700A-5FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded block RAM capacity, and supported configuration modes (JTAG, Master Serial, Slave SelectMAP).
Technical Context
The XC3S700A-5FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and eighteen 18×18 multipliers. It integrates eight Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction across multiple domains.
Configuration is performed via external PROM or processor-controlled slave parallel mode. The device supports IEEE 1149.1 JTAG boundary-scan testing and includes dedicated SelectIO™ technology for LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - determines maximum combinational/sequential logic capacity per design |
| System Gates | 700,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 576 kbits - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| I/O Pins | 373 user I/Os - supports high-pin-count interface bridging (e.g., parallel bus to serial protocol) |
| DCMs | 8 - provides jitter-tolerant clock management for multi-clock domain systems |
| Speed Grade | -5 (1.56 ns CLB delay) - defines worst-case propagation timing for synchronous logic paths |
Pinout & Package
XC3S700A-5FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and thermal pad. Pin functions are defined per Xilinx DS312 v2.5 and include dedicated configuration pins (INIT_B, PROGRAM_B, DONE), JTAG TDI/TDO/TCK/TMS, dual-purpose I/O banks, and dedicated global clock inputs (GCLK0–GCLK7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Resets internal configuration logic and clears SRAM contents on falling edge |
| INIT_B | Active-Low Configuration Status | Indicates readiness to accept configuration data; driven low during CRC error or reconfiguration |
| DONE | Configuration Completion Flag | Open-drain output pulled high externally; signals successful bitstream load completion |
| GCLK0–GCLK7 | Dedicated Global Clock Inputs | Bypass local routing for lowest-skew clock distribution to all CLBs and I/Os |
| VCCO_0–VCCO_6 | I/O Bank Power Supplies | Independent voltage rails per bank enable mixed-voltage I/O (e.g., 3.3V and 1.8V on same device) |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 19 I/O standards including LVCMOS, LVTTL, PCI, and SSTL-2 with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Eight independent DCMs provide frequency synthesis, phase alignment, and duty cycle correction without external PLL components |
| Embedded Multipliers | Eighteen 18×18 signed/unsigned multipliers accelerate DSP functions like FIR filtering and motor control algorithms |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic functionality |
Applications
| Industrial PLC Interface Module | Video Signal Converter Board |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between legacy fieldbus and modern Ethernet-based controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel-to-serial bridges; DCMs synchronize sensor sampling and actuator update cycles. Use Value: Enables deterministic latency under 2 µs for safety-critical motion control loops using internal timing resources. | Use Scenario: Conversion of HDMI 1.3a video streams to MIPI D-PHY for display driver integration in portable medical imaging devices. IC Role / Device Role / Timing Role: Configurable logic processes pixel clock domain crossing; embedded multipliers perform real-time color space transformation (YUV to RGB). Use Value: Eliminates need for external video processor IC by integrating timing-critical pixel pipeline logic and arithmetic units. |
| Automotive Diagnostic Tool Adapter | Test Equipment Pattern Generator |
Use Scenario: Protocol gateway between UDS-over-CAN and proprietary ECU debug interfaces in Tier-1 vehicle diagnostics hardware. IC Role / Device Role / Timing Role: Implements CAN FD physical layer handshaking and message filtering; I/O banks interface directly with 5V automotive microcontrollers. Use Value: Supports mixed-voltage operation (5V tolerant I/Os + 1.2V core) without level shifters, reducing BOM count and board area. | Use Scenario: High-speed digital stimulus generation for validating DDR2 memory controller timing margins in ATE platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel test vectors with sub-nanosecond skew control via dedicated global clocks and DCM phase alignment. Use Value: Achieves <±150 ps channel-to-channel skew across 32-bit data bus using on-chip clock routing resources. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FGG484C | Higher logic density (20,160 CLBs), same package and pinout, increased block RAM (720 kbits) | Suitable for larger state machines and deeper FIFO buffering in protocol stack implementations | Select when design requires >17K logic cells or >576 kbits on-chip RAM without changing PCB layout |
| XC6SLX9-2TQG144C | Lower density (9,152 LUTs), smaller 144-pin TQFP package, Spartan-6 architecture with improved power efficiency | Better suited for cost-sensitive, space-constrained designs where 3.3V-only I/O suffices | Choose for new designs prioritizing lower static power and simplified thermal management over legacy bitstream compatibility |
Compared with XC3S700A-5FGG484C, XC3S1000-5FGG484C offers scalable logic headroom within identical mechanical and thermal constraints, while XC6SLX9-2TQG144C trades density and I/O flexibility for reduced footprint and active power-making it viable only where migration from Spartan-3A architecture is acceptable.
Availability
XC3S700A-5FGG484C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and automotive diagnostic applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3S700A-5FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Spartan family as part of its adaptive computing portfolio for cost-optimized, high-volume embedded systems.
The Spartan-3A product line was designed specifically for non-volatile, low-power, high-I/O-count applications in industrial control, video processing, and communications infrastructure where predictable timing and mature toolchain support are critical.
FAQ
What is the maximum operating frequency of the XC3S700A-5FGG484C?
The XC3S700A-5FGG484C has a -5 speed grade specifying a 1.56 ns CLB propagation delay. Its maximum system clock frequency depends on design topology but typically reaches 280 MHz for fully pipelined logic paths. DCM outputs can generate up to 320 MHz clocks with jitter below 200 ps RMS, validated per Xilinx DS312 timing reports.
Does the XC3S700A-5FGG484C support JTAG boundary-scan testing?
Yes, the XC3S700A-5FGG484C fully complies with IEEE 1149.1 and includes dedicated TDI, TDO, TCK, and TMS pins. Boundary-scan capability enables PCB-level interconnect testing and in-system programming without requiring external configuration PROMs.
Can the XC3S700A-5FGG484C be configured via SPI flash memory?
No-XC3S700A-5FGG484C does not support native SPI master configuration. It requires either Master Serial (using XCFxxP PROMs), Slave SelectMAP (processor-controlled parallel loading), or JTAG programming. External SPI flash must be interfaced through user logic and GPIOs.
What I/O standards are supported by the XC3S700A-5FGG484C?
The XC3S700A-5FGG484C supports 19 I/O standards via SelectIO™ technology, including LVCMOS 3.3V/2.5V/1.8V/1.5V, LVTTL, PCI, PCI-X, HSTL Class I/II, and SSTL-2 Class I/II. Each I/O bank is independently powered, enabling mixed-voltage operation across the device.
Is bitstream encryption available for the XC3S700A-5FGG484C?
Yes, the XC3S700A-5FGG484C supports optional AES-128 bitstream encryption. When enabled, configuration data is decrypted on-the-fly during loading, preventing unauthorized readback or cloning of the programmed logic design.
XC3S700A-5FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700A-5FGG484C FAQ
1.How can I place an order for XC3S700A-5FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-5FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-5FGG484C reliable?
The price and inventory of XC3S700A-5FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-5FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S700A-5FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-5FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-5FGG484C?
XC3S700A-5FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-5FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-5FGG484C?
For technical support, including XC3S700A-5FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-5FGG484C requirements.
6.How does Aetrix verify that XC3S700A-5FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-5FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-5FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S700A-5FGG484C?
All XC3S700A-5FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-5FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-5FGG484C part is unused and in its original packaging.
Return procedure for XC3S700A-5FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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