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AMD XC3S700A-5FTG256C
- Part No.:
- XC3S700A-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S700A-5FTG256C.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,998
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Product details
Overview
XC3S700A-5FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 17,920 logic cells, 576 Kbits of block RAM, and operates at -5 speed grade (1.58 ns CLB delay). It is used in industrial control logic, video interface bridging, and embedded reconfigurable I/O subsystems.
For engineers reviewing the XC3S700A-5FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (195 user I/Os), differential signaling support (LVDS, RSDS), single-ended standards (LVTTL, LVCMOS), and configuration via Master Serial mode using external PROM.
Technical Context
The XC3S700A-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, dedicated multipliers (18×18), and digital clock managers (DCMs) for phase alignment and frequency synthesis. It supports up to four DCMs per device.
Configuration is performed through JTAG, Master Serial, or Slave SelectMAP modes. The device uses internal voltage regulation (VCCINT = 1.2 V) and supports dual-supply I/O banks (VCCO = 1.2–3.3 V) with independent bank voltage assignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,920 - provides combinational and sequential logic capacity for medium-complexity digital control and protocol processing |
| System Gates | 700,000 - indicates overall logic density suitable for bridging and peripheral interface functions |
| Block RAM | 576 Kbits - enables on-chip buffering for video line storage, FIFOs, or small lookup tables |
| User I/O Pins | 195 - supports high-pin-count parallel interfaces such as LCD controllers or memory-mapped peripherals |
| DCMs | 4 - allows independent clock domain management for video timing, data capture, and system synchronization |
| Speed Grade | -5 - guarantees 1.58 ns CLB propagation delay, enabling 630 MHz DCM output and 250 MHz system clock operation |
| VCCINT | 1.2 V ±3% - requires tightly regulated core supply; low-voltage operation reduces dynamic power |
Pinout & Package
XC3S700A-5FTG256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTG) package with 0.5 mm pitch, 17 × 17 mm body size, and exposed thermal pad. Pinout conforms to Xilinx DS312 (v2.5) specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLBs and DCMs; must be decoupled locally |
| P4 | VCCO_0 | I/O bank 0 supply (1.2–3.3 V); sets voltage level for pins A1–D12 |
| T14 | PROGRAM_B | Active-low asynchronous reset for configuration logic; pulls device into initialization state |
| R15 | DONE | Open-drain status output indicating successful configuration completion |
| U16 | CCLK | Configuration clock input during Master Serial mode; drives external PROM read timing |
| Y16 | M0/M1/M2 | Mode select inputs determining configuration method (JTAG/Serial/SelectMAP) |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 multipliers | Four hardwired arithmetic units enable real-time FIR filtering and motor control loop computation without LUT resource consumption |
| Digital Clock Managers (DCMs) | Four fully independent DCMs provide jitter reduction, duty-cycle correction, and frequency multiplication/division for synchronous system design |
| SelectIO technology | Supports 195 user I/Os with programmable drive strength, slew rate, and on-chip termination across 12 I/O standards including LVDS and LVCMOS |
| Master Serial configuration | Enables single-PROM boot with automatic loading at power-up; eliminates need for external microcontroller coordination |
| Multi-voltage I/O banks | Twelve independently powered I/O banks allow interfacing with mixed-voltage peripherals (e.g., 3.3 V ADC + 1.8 V sensor) without level shifters |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, quadrature decoder, and 16-bit PWM generator with deterministic sub-microsecond latency. Use Value: XC3S700A-5FTG256C delivers 195 I/Os for axis expansion and four DCMs for synchronized PWM and encoder sampling clocks. | Use Scenario: Converting HDMI 1.3a pixel data to LVDS panel interface for industrial displays. IC Role / Device Role / Timing Role: XC3S700A-5FTG256C performs format translation, color space conversion, and source-synchronous LVDS serialization. Use Value: XC3S700A-5FTG256C supports LVDS differential I/O and 1.58 ns CLB delay for reliable 720p60 pixel clock recovery and alignment. |
| Programmable Logic Controller (PLC) | Medical Imaging Data Acquisition |
Use Scenario: Modular I/O expansion module handling 32-channel digital input/output with isolation and diagnostics. IC Role / Device Role / Timing Role: XC3S700A-5FTG256C serves as central logic sequencer, managing scan cycles, watchdog timers, and communication protocol stacks (Modbus RTU). Use Value: XC3S700A-5FTG256C provides 576 Kbits block RAM for protocol buffer storage and 17,920 logic cells for concurrent ladder logic execution. | Use Scenario: High-speed acquisition of 12-bit ADC streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: XC3S700A-5FTG256C implements time-interleaved sampling control, channel multiplexing, and DMA-ready data packing. Use Value: XC3S700A-5FTG256C supports 195 user I/Os for parallel ADC bus capture and four DCMs for precise sampling clock derivation and skew compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FTG256C | Higher density: 20,160 logic cells, 960 Kbits block RAM, same package and pinout | Supports larger state machines and deeper pipeline stages; requires more configuration memory | Choose when additional logic resources or RAM are needed without changing PCB layout |
| XC3S500E-5FG320C | Different package (320-pin FBGA), lower density (11,072 logic cells), same -5 speed grade | Offers higher I/O count (232) but incompatible footprint; suited for new designs prioritizing I/O over cost | Consider only for new board designs where extra I/O and thermal performance justify package change |
Compared with XC3S700A-5FTG256C, XC3S1000-5FTG256C offers direct pin-compatible scalability, while XC3S500E-5FG320C trades footprint compatibility for increased I/O and thermal headroom-neither is drop-in, but both serve adjacent design points in the Spartan-3A family.
Availability
XC3S700A-5FTG256C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and video interface bridging requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S700A-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-3A family was designed by Xilinx for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated clock management and multi-standard I/O-targeting industrial automation and embedded vision.
FAQ
What configuration modes does the XC3S700A-5FTG256C support?
The XC3S700A-5FTG256C supports three primary configuration modes: JTAG for debugging and programming, Master Serial using an external SPI PROM, and Slave SelectMAP for microprocessor-controlled loading. Mode selection is determined by M0–M2 pin states at power-up. All modes use the same bitstream format, and configuration data integrity is verified via CRC check during startup.
Does the XC3S700A-5FTG256C include on-chip memory for data buffering?
Yes, the XC3S700A-5FTG256C integrates 576 Kbits of block RAM distributed across 32 blocks, each configurable as 18 Kbits or split into two 9 Kbit sections. This memory supports true dual-port operation, enabling simultaneous read/write access for applications like FIFOs, frame buffers, or coefficient storage in digital filters-without consuming logic cell resources.
Can the XC3S700A-5FTG256C generate multiple synchronized clock domains?
Yes, the XC3S700A-5FTG256C contains four Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty-cycle correction. These DCMs operate independently and can drive separate clock networks, enabling precise timing control for video pixel clocks, ADC sampling, and system buses-all derived from a single input oscillator.
What I/O standards are supported by the XC3S700A-5FTG256C?
The XC3S700A-5FTG256C supports 12 single-ended and differential I/O standards including LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, and RSDS. Each of its 12 I/O banks can be independently assigned a VCCO voltage (1.2 V to 3.3 V), allowing direct interfacing with mixed-voltage peripherals without external level shifters.
Is the XC3S700A-5FTG256C RoHS compliant and lead-free?
Yes, the XC3S700A-5FTG256C is manufactured in a lead-free, RoHS-compliant process. The FTG256 package uses matte tin finish on all leads, meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), and is qualified for industrial temperature range (0°C to 85°C ambient).
XC3S700A-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 161
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S700A-5FTG256C FAQ
1.How can I place an order for XC3S700A-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-5FTG256C reliable?
The price and inventory of XC3S700A-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S700A-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-5FTG256C?
XC3S700A-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-5FTG256C?
For technical support, including XC3S700A-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-5FTG256C requirements.
6.How does Aetrix verify that XC3S700A-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S700A-5FTG256C?
All XC3S700A-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S700A-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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