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AMD XC3S700AN-4FG484C
- Part No.:
- XC3S700AN-4FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700AN-4FG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,359
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Product details
Overview
XC3S700AN-4FG484C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 700,000 system gates, 17,280 logic cells, and integrated flash memory for single-chip configuration. It features 376 user I/Os, operates at -4 speed grade (1.11 ns CLB delay), and supports 3.3V/2.5V/1.2V I/O standards. It is used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S700AN-4FG484C datasheet, pinout, applications, or equivalent options, key selection factors include integrated flash retention (20 years), I/O voltage flexibility, deterministic startup timing, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S700AN-4FG484C implements a fully SRAM-based logic fabric with embedded block RAM (1,843 kbits), digital clock managers (DCMs), and SelectIO™ technology supporting LVCMOS, LVTTL, PCI, and SSTL standards. Its on-chip flash eliminates external configuration PROMs and enables instant-on operation.
It uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 376 user-configurable I/O pins distributed across 16 banks. Configuration occurs via Master Serial, Slave Serial, or JTAG modes, with full IEEE 1149.1 boundary-scan support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic capacity for medium-complexity control and datapath functions |
| System Gates | 700,000 - indicates total equivalent ASIC gate count for architectural sizing and resource estimation |
| User I/O Pins | 376 - supports high-density peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 1,843 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Speed Grade | -4 - guarantees maximum 1.11 ns CLB propagation delay under worst-case conditions |
| Integrated Flash | 20-year retention - allows single-chip, power-cycle-ready configuration without external PROM |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL - enables direct interfacing to microcontrollers, DDR SDRAM, and legacy buses |
Pinout & Package
XC3S700AN-4FG484C is housed in a 484-ball Fine-Pitch BGA (FG484) package with 376 user I/Os, 10 dedicated configuration pins, 8 global clock inputs, and power/ground distribution optimized for signal integrity and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status output confirming successful configuration completion |
| P2 | PROGRAM_B | Active-low input initiating FPGA reconfiguration and clearing internal SRAM |
| T1 | CCLK | Configuration clock input driving serial bitstream loading from external source |
| V1 | DONE | Open-drain output indicating final configuration phase completion and enabling I/O release |
| R1 | TCK | JTAG test clock input for boundary-scan and debug operations per IEEE 1149.1 |
| R2 | TMS | JTAG test mode select controlling TAP controller state transitions |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash Memory | Enables single-chip, zero-PROM configuration with guaranteed 20-year data retention |
| Digital Clock Managers (DCMs) | Provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate control |
| IEEE 1149.1 Boundary Scan | Allows in-system verification of PCB interconnects and JTAG-based programming |
| Instant-On Operation | Permits full functional readiness within microseconds after power application |
Applications
| Industrial PLC Logic | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Reconfigurable logic core in modular programmable logic controllers handling real-time I/O scanning and ladder logic execution. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic scan cycles; DCMs generate precise 1–10 MHz system clocks synchronized to fieldbus timing. Use Value: Integrated flash ensures reliable cold-start behavior in unattended factory environments without boot PROM failure risk. | Use Scenario: Protocol translation bridge between UDS/OBD-II diagnostic tools and proprietary vehicle ECUs over CAN and UART. IC Role / Device Role / Timing Role: Configurable logic implements multi-protocol state machines; SelectIO supports both 3.3V CAN transceivers and 5V legacy UART peripherals. Use Value: Single-chip integration reduces board area and eliminates external configuration memory, easing automotive qualification. |
| Medical Imaging Control | Test Equipment Pattern Generator |
Use Scenario: Timing and sequencing engine for ultrasound beamforming modules requiring precise channel synchronization. IC Role / Device Role / Timing Role: FPGA generates sub-nanosecond-aligned trigger pulses and manages DDR2 memory buffers for echo data capture. Use Value: Deterministic startup and on-chip RAM enable repeatable initialization critical for FDA-cleared device consistency. | Use Scenario: High-speed digital pattern generator in automated test equipment generating custom stimulus waveforms up to 100 MHz. IC Role / Device Role / Timing Role: Logic fabric synthesizes parallel test vectors; DCMs provide low-jitter sampling clocks for output timing validation. Use Value: -4 speed grade ensures setup/hold margin for 10 ns minimum pulse widths in production test fixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG484C | Higher logic density (19,536 LCs), same package and speed grade, no integrated flash | Requires external configuration PROM; suited for designs needing more resources but not instant-on | Choose when additional logic capacity is required and external configuration is acceptable |
| XC3S500E-4FG320C | Lower density (11,152 LCs), smaller 320-ball FBGA, no flash, -4 speed grade | Reduced I/O count (232) and footprint; lacks on-chip nonvolatile storage | Choose for cost-sensitive, space-constrained applications where flash is unnecessary |
Compared with XC3S700AN-4FG484C, XC3S1000-4FG484C offers higher logic capacity but requires external configuration, while XC3S500E-4FG320C trades density and flash for lower cost and smaller footprint-making each suitable only where those specific trade-offs align with system requirements.
Availability
XC3S700AN-4FG484C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S700AN-4FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-3AN family was designed by Xilinx to deliver cost-effective, flash-integrated FPGA solutions for high-volume embedded applications demanding reliability, fast startup, and reduced bill-of-materials.
FAQ
What is the configuration method supported by XC3S700AN-4FG484C?
XC3S700AN-4FG484C supports Master Serial, Slave Serial, and JTAG configuration modes. Its integrated flash enables Master Serial mode with automatic power-on loading, eliminating external PROM. JTAG is used for programming, debugging, and IEEE 1149.1 boundary-scan testing. The XC3S700AN-4FG484C does not require external configuration devices for basic operation.
Does XC3S700AN-4FG484C support 5V-tolerant I/Os?
No, XC3S700AN-4FG484C does not support 5V-tolerant I/Os. Its I/O banks operate at 3.3V, 2.5V, 1.8V, or 1.2V signaling levels. Direct connection to 5V logic requires level-shifting circuitry. This limitation is specified in the XC3S700AN-4FG484C datasheet Table 12 and applies across all I/O standards supported by the device.
What is the maximum operating junction temperature for XC3S700AN-4FG484C?
The maximum operating junction temperature for XC3S700AN-4FG484C is 85°C, as defined in the commercial temperature grade ('C' suffix). This rating assumes proper PCB thermal design, including adequate copper pour and airflow. Exceeding 85°C may cause timing violations or configuration loss. The XC3S700AN-4FG484C datasheet specifies derating curves starting at 70°C ambient for sustained operation.
How many Digital Clock Managers (DCMs) does XC3S700AN-4FG484C include?
XC3S700AN-4FG484C includes four Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, duty cycle correction, and jitter reduction. These are essential for generating multiple synchronized clocks in systems such as video timing controllers or communication interfaces. The XC3S700AN-4FG484C documentation confirms this count in the "Clock Resources" section of the device specification.
Is XC3S700AN-4FG484C RoHS compliant?
Yes, XC3S700AN-4FG484C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC JS-066 standards. The 'N' in the part number denotes lead-free packaging. This compliance is verified in AMD's official product change notices and applies to all units shipped after the transition date. The XC3S700AN-4FG484C packaging uses matte tin finish on solder balls.
XC3S700AN-4FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700AN-4FG484C FAQ
1.How can I place an order for XC3S700AN-4FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700AN-4FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700AN-4FG484C reliable?
The price and inventory of XC3S700AN-4FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-4FG484C is usually 5 days.
3.What payment methods are accepted for XC3S700AN-4FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-4FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700AN-4FG484C?
XC3S700AN-4FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700AN-4FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700AN-4FG484C?
For technical support, including XC3S700AN-4FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-4FG484C requirements.
6.How does Aetrix verify that XC3S700AN-4FG484C is sourced from the original manufacturer or authorized distributors?
All XC3S700AN-4FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-4FG484C meets industry standards.
7.What is the process for return or replacement of XC3S700AN-4FG484C?
All XC3S700AN-4FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-4FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700AN-4FG484C part is unused and in its original packaging.
Return procedure for XC3S700AN-4FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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