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AMD XC3S700AN-4FG484I
- Part No.:
- XC3S700AN-4FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700AN-4FG484I.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,982
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Product details
Overview
XC3S700AN-4FG484I from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array featuring 700,000 system gates, 17,280 logic cells, and integrated 16 Mbit platform flash memory. It operates at -4 speed grade (1.13 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with I/O voltage support up to 3.3 V. It targets reconfigurable embedded control and interface bridging in industrial automation systems.
For engineers reviewing the XC3S700AN-4FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash configuration, single-chip solution capability, I/O bank voltage flexibility, and -4 speed grade timing compliance for deterministic logic paths.
Technical Context
The XC3S700AN-4FG484I implements a fully SRAM-based FPGA architecture with embedded Block RAM (up to 576 Kbits), Digital Clock Managers (DCMs) for clock synthesis and phase alignment, and SelectIO technology supporting LVCMOS, LVTTL, PCI, and SSTL standards. Its integrated flash eliminates external configuration PROMs and enables instant-on operation.
It supports JTAG boundary-scan (IEEE 1149.1), in-system programming of flash, and dual-boot capability via dedicated M[2:0] pins. Configuration occurs automatically on power-up using internal flash, with optional fallback to external source if flash fails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - defines maximum combinational and sequential logic capacity for custom digital functions |
| System Gates | 700,000 - indicates relative logic density benchmarked against ASIC gate count equivalents |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| Speed Grade | -4 - guarantees 1.13 ns CLB propagation delay, enabling 88 MHz system clock operation under worst-case conditions |
| Core Voltage | 1.2 V ± 3% - requires tight-regulation power supply; impacts dynamic power and thermal design |
| I/O Standards | LVCMOS/LVTTL/PCI/SSTL - allows direct interfacing with microcontrollers, memory, and peripheral ICs across voltage domains |
| Integrated Flash | 16 Mbit - stores full bitstream and user data; enables secure, single-chip, no-PROM boot |
Pinout & Package
XC3S700AN-4FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. The package supports thermal dissipation up to 1.8 W and includes dedicated configuration, JTAG, and multi-voltage I/O bank pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for logic fabric and DCMs |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and JTAG interface |
| T14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| R15 | INIT_B | Open-drain status output indicating configuration completion or error condition |
| U16 | DONE | Open-drain output signaling successful configuration load and enabling I/O release |
| Y17 | TCK | JTAG test clock input for boundary-scan and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 16 Mbit Flash | Eliminates external configuration PROM, reduces BOM count, and enables instant-on after power application |
| Dual-Boot Capability | Allows storage of two independent bitstreams; enables field firmware rollback or feature-set switching |
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division without external PLL ICs |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) on same device, simplifying interface to heterogeneous peripherals |
| JTAG Boundary-Scan | Enables PCB-level interconnect testing and in-system programming without requiring dedicated debug headers |
Applications
| Industrial PLC Interface Module | Medical Imaging Data Preprocessor |
|---|---|
Use Scenario: Real-time protocol translation between legacy RS-485 fieldbus and modern Ethernet backbone in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA acts as deterministic bridge logic with cycle-accurate timing control and configurable I/O voltage per port. Use Value: Integrated flash ensures reliable cold-start operation; -4 speed grade meets 100 µs response deadline for safety-critical I/O scanning. | Use Scenario: On-the-fly pixel data formatting and compression preprocessing before transmission to host GPU in portable ultrasound systems. IC Role / Device Role / Timing Role: Configurable logic handles parallel-to-serial conversion, histogram calculation, and Huffman encoding pipelines. Use Value: 576 Kbits Block RAM buffers full frame lines; 1.2 V core lowers active power during battery-operated imaging sessions. |
| Avionics Sensor Fusion Hub | Test Equipment Pattern Generator |
Use Scenario: Synchronizing and fusing inertial measurement unit (IMU), GPS, and barometric sensor streams in UAV flight controllers. IC Role / Device Role / Timing Role: FPGA implements time-stamped sensor arbitration, Kalman filter acceleration, and ARINC 429 output framing. Use Value: DCM-generated precise clocks align sensor sampling; integrated flash secures certified flight software bitstream against corruption. | Use Scenario: Generating high-fidelity digital stimulus waveforms for ATE validation of mixed-signal SoCs. IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern sequencer with sub-cycle timing resolution and multi-channel skew control. Use Value: -4 speed grade ensures <1.2 ns timing uncertainty across 128-bit parallel vectors; LVCMOS33 I/O drives standard logic-level test loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Higher logic density (1M gates, 19,440 logic cells), no integrated flash, 456-pin FBGA | Requires external configuration PROM; suited for designs needing more logic but not instant-on boot | Choose when additional LUTs and BRAM are required and external flash is acceptable |
| XC6SLX75-2FGG484C | Spartan-6 generation; 74,880 logic cells, 3.1 Mb block RAM, 1.2 V core, no integrated flash | Lacks on-chip flash; offers higher performance and lower static power but needs external configuration | Prefer for new designs requiring higher bandwidth or lower quiescent current where flash integration is secondary |
Compared with XC3S700AN-4FG484I, the XC3S1000-4FG456C trades flash integration for greater logic resources, while the XC6SLX75-2FGG484C represents a newer architecture with improved DSP slices and memory bandwidth but requires external configuration infrastructure.
Availability
XC3S700AN-4FG484I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S700AN-4FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3AN family was originally designed by Xilinx to deliver cost-optimized, flash-integrated FPGAs for space-constrained, instant-on embedded applications where reliability and single-chip simplicity are critical.
FAQ
What is the configuration method supported by XC3S700AN-4FG484I?
The XC3S700AN-4FG484I supports master serial, slave serial, and JTAG configuration modes. Its integrated 16 Mbit flash enables master serial mode as default, allowing autonomous power-on configuration without external PROM. JTAG is used for in-system programming and debugging. XC3S700AN-4FG484I also supports dual-boot via M[2:0] pins for fail-safe firmware updates.
Does XC3S700AN-4FG484I require external configuration memory?
No, XC3S700AN-4FG484I does not require external configuration memory due to its on-chip 16 Mbit flash. This flash stores the configuration bitstream and user data, enabling instant-on operation and eliminating the need for external SPI PROMs or configuration controllers. XC3S700AN-4FG484I retains configuration through power cycles without auxiliary storage.
What I/O standards are supported on XC3S700AN-4FG484I banks?
XC3S700AN-4FG484I supports LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, PCI, and SSTL18 I/O standards across independently powered I/O banks. Each bank accepts a single VCCO voltage (1.2–3.3 V), and XC3S700AN-4FG484I enforces strict bank-level voltage compatibility to prevent I/O damage. No level-shifting ICs are needed when interfacing with mixed-voltage peripherals.
What is the operating temperature range for XC3S700AN-4FG484I?
XC3S700AN-4FG484I is rated for industrial temperature operation from –40 °C to +100 °C case temperature. This rating applies to the I-grade version denoted by the "I" suffix in the part number. Thermal design must ensure junction temperature remains within limits using appropriate PCB copper area and airflow, especially under sustained 1.8 W power dissipation.
How many Digital Clock Managers (DCMs) does XC3S700AN-4FG484I include?
XC3S700AN-4FG484I includes four Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, duty cycle correction, and jitter reduction. These DCMs operate independently and support global clock networks, enabling precise timing control for multiple synchronous domains within XC3S700AN-4FG484I-based designs.
XC3S700AN-4FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700AN-4FG484I FAQ
1.How can I place an order for XC3S700AN-4FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700AN-4FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700AN-4FG484I reliable?
The price and inventory of XC3S700AN-4FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-4FG484I is usually 5 days.
3.What payment methods are accepted for XC3S700AN-4FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-4FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700AN-4FG484I?
XC3S700AN-4FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700AN-4FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700AN-4FG484I?
For technical support, including XC3S700AN-4FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-4FG484I requirements.
6.How does Aetrix verify that XC3S700AN-4FG484I is sourced from the original manufacturer or authorized distributors?
All XC3S700AN-4FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-4FG484I meets industry standards.
7.What is the process for return or replacement of XC3S700AN-4FG484I?
All XC3S700AN-4FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-4FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700AN-4FG484I part is unused and in its original packaging.
Return procedure for XC3S700AN-4FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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