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AMD XC3S700AN-5FGG484C
- Part No.:
- XC3S700AN-5FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700AN-5FGG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,141
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Product details
Overview
XC3S700AN-5FGG484C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 700,000 system gates, 17,280 logic cells, and embedded flash configuration memory. It features 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at -5 speed grade (118 MHz system clock), and supports single-chip configuration without external PROM. It is used in industrial control logic, reconfigurable I/O interfaces, and legacy protocol bridging.
For engineers reviewing the XC3S700AN-5FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded flash retention time, I/O bank voltage flexibility (1.2 V to 3.3 V), JTAG boundary-scan compliance, and availability of migration paths within the Spartan-3AN family.
Technical Context
The XC3S700AN-5FGG484C integrates non-volatile flash memory for instant-on configuration and supports in-system programming via JTAG or SelectMAP interface. Its architecture includes dedicated digital clock managers (DCMs) for phase alignment and frequency synthesis, and configurable I/O banks supporting LVCMOS, LVTTL, PCI, and SSTL standards.
It implements 24 multipliers (18 × 18-bit), 484 user I/O pins, and up to 232 KB of distributed RAM. Configuration security includes bitstream encryption and readback protection, and the device meets IEEE 1149.1 JTAG boundary-scan test standard.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic capacity for medium-complexity digital control and glue logic functions |
| System Gates | 700,000 - indicates overall logic density suitable for replacing multiple discrete ASICs or CPLDs |
| Embedded Flash | Integrated 2 MB flash - enables single-chip, zero-configuration boot without external memory devices |
| I/O Pins | 484 - supports high-pin-count peripheral interfacing with per-bank voltage assignment |
| DCM Units | 4 - delivers deterministic clock deskew, frequency synthesis, and duty-cycle correction for synchronous design |
| Speed Grade | -5 - guarantees timing closure up to 118 MHz system clock frequency under worst-case conditions |
| Distributed RAM | 232 KB - usable as shift registers, FIFOs, or small lookup tables without block RAM resource consumption |
Pinout & Package
XC3S700AN-5FGG484C uses a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 23 × 23 ball array, 1.0 mm pitch, and 27 mm × 27 mm body size. The package supports lead-free (Pb-free) soldering and thermal dissipation via exposed thermal pad on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, DCMs, and JTAG interface |
| VCCO_0–VCCO_5 | I/O bank power | Independent 1.2–3.3 V supplies per I/O bank enabling mixed-voltage interface support |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test and programming access without requiring configuration mode pins |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status | Open-drain output indicating successful configuration completion or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables instant-on operation and eliminates external configuration PROM, reducing BOM count and board space |
| Multi-Voltage I/O Banks | Allows direct interfacing with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level-shifters |
| Digital Clock Managers (DCMs) | Provides jitter-tolerant clock synthesis, phase shifting, and frequency multiplication for precise timing control |
| Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of configured logic |
| In-System Programming (ISP) | Supports field firmware updates via JTAG or parallel SelectMAP interface without device removal |
Applications
| Industrial Motion Control | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements custom motion profiles, position interpolation, and safety monitoring logic with sub-microsecond latency. Use Value: Embedded flash ensures deterministic startup and eliminates boot delay from external configuration memory. | Use Scenario: Bridging RS-485 Modbus RTU to SPI-based microcontroller subsystems in building automation panels. IC Role / Device Role / Timing Role: Protocol translation engine with configurable baud rate generation and CRC validation logic. Use Value: Multi-voltage I/O banks allow direct connection to both 3.3 V MCU and 5 V transceiver without level-shifting components. |
| Reconfigurable Digital I/O Module | Test Equipment Signal Conditioning |
Use Scenario: Field-upgradable digital input/output card for programmable logic controllers handling 24 V DC sensors and solenoids. IC Role / Device Role / Timing Role: Configurable I/O controller managing isolation, debounce, and state-machine-driven output sequencing. Use Value: In-system programming enables remote firmware updates to adapt to new sensor types or control algorithms. | Use Scenario: High-speed digital pattern generator and analyzer in automated test equipment for semiconductor wafer probing. IC Role / Device Role / Timing Role: Timing-critical pattern sequencer synchronized to external reference clock via DCM-based phase alignment. Use Value: Four DCM units provide independent clock domains for stimulus generation, capture sampling, and data serialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Higher logic density (1M gates, 21,600 logic cells), no integrated flash, requires external PROM | Suitable where larger logic capacity is needed but instant-on boot is not required | Select when design requires more LUTs/flip-flops and can accommodate external configuration memory |
| XC3S500E-4FGG320C | Lower density (500K gates, 11,520 logic cells), no flash, smaller 320-ball FBGA package | Better fit for cost-sensitive, space-constrained designs with reduced I/O and logic needs | Choose when footprint and BOM cost are prioritized over embedded configuration and I/O count |
Compared with XC3S700AN-5FGG484C, XC3S1000-4FGG456C offers greater logic resources but adds external memory dependency, while XC3S500E-4FGG320C reduces size and cost at the expense of flash integration and I/O count-making each viable only where those trade-offs align with system requirements.
Availability
XC3S700AN-5FGG484C is available at Aetrix Electronics and suitable for industrial motion control, legacy bus interface bridge, and reconfigurable digital I/O modules requiring stable component supply and long-term obsolescence management.
Supply support for XC3S700AN-5FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA product families originally introduced by Xilinx.
The Spartan-3AN series was designed for cost-sensitive, high-volume applications requiring instant-on capability, embedded configuration, and flexible I/O interfacing in industrial and communications infrastructure.
FAQ
What is the configuration method supported by XC3S700AN-5FGG484C?
XC3S700AN-5FGG484C supports master serial, slave serial, JTAG, and SelectMAP configuration modes. Its integrated flash enables master serial mode with no external memory required. JTAG is used for programming and boundary-scan testing, while SelectMAP allows high-speed parallel configuration via microprocessor interface. All methods are documented in Xilinx UG332.
Does XC3S700AN-5FGG484C require external configuration memory?
No, XC3S700AN-5FGG484C does not require external configuration memory due to its on-chip 2 MB flash. This enables single-chip, instant-on operation after power-up and supports in-system programming without modifying hardware. External memory is optional only for advanced use cases like dual-image storage or fallback configuration.
What I/O standards are supported by XC3S700AN-5FGG484C?
XC3S700AN-5FGG484C supports LVCMOS, LVTTL, PCI, SSTL18, SSTL2, HSTL, and differential standards including LVDS and RSDS across its 484-user I/O pins. Each of the six I/O banks is independently configurable for voltage levels from 1.2 V to 3.3 V, enabling mixed-signaling environments without external level shifters.
Is XC3S700AN-5FGG484C pin-compatible with other Spartan-3AN devices?
XC3S700AN-5FGG484C shares the same 484-ball FBGA package footprint with XC3S1000AN-5FGG484C and XC3S1500AN-5FGG484C, but pin functions differ across densities due to variations in I/O bank allocation and internal routing. Direct pin-to-pin compatibility is not guaranteed; migration requires verification of I/O placement and DCM usage per Xilinx UG331.
What is the maximum operating junction temperature for XC3S700AN-5FGG484C?
The maximum operating junction temperature for XC3S700AN-5FGG484C is 85 °C for commercial-grade (-C) devices. Thermal design must ensure adequate PCB copper area, airflow, or heatsinking to maintain this limit under full logic utilization and worst-case ambient conditions, as specified in Xilinx DS225.
XC3S700AN-5FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700AN-5FGG484C FAQ
1.How can I place an order for XC3S700AN-5FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700AN-5FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700AN-5FGG484C reliable?
The price and inventory of XC3S700AN-5FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-5FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S700AN-5FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-5FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700AN-5FGG484C?
XC3S700AN-5FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700AN-5FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700AN-5FGG484C?
For technical support, including XC3S700AN-5FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-5FGG484C requirements.
6.How does Aetrix verify that XC3S700AN-5FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S700AN-5FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-5FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S700AN-5FGG484C?
All XC3S700AN-5FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-5FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700AN-5FGG484C part is unused and in its original packaging.
Return procedure for XC3S700AN-5FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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