AMD XC4028XLA-09BGG352C
- Part No.:
- XC4028XLA-09BGG352C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XC4028XLA-09BGG352C.pdf
- Description:
- FPGA, 1024 CLBS, 18000 GATES
- Quantity:
- Payment:

- Shipping:

Inventory:302
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Product details
Overview
XC4028XLA-09BGG352C from Xilinx is a high-capacity, 3.3 V low-voltage Field-Programmable Gate Array (FPGA) with 2,432 configurable logic blocks (CLBs), 28,000 typical gate capacity, 32,768 RAM bits, and 256 user I/Os in a 352-pin BGA package. It supports synchronous system clock rates up to 80 MHz, features edge-triggered and dual-port SelectRAM™ memory, and delivers PCI-compliant operation at speed grade -09.
For engineers reviewing the XC4028XLA-09BGG352C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, CLB-level timing behavior, IOB configuration options, SelectRAM™ mode mapping, and direct alternatives for legacy FPGA migration paths.
Technical Context
The XC4028XLA-09BGG352C belongs to the XC4000XLA family - a 3.3 V, 0.35 µm SRAM-based FPGA series distinct from XC4000E/XL. It implements a hierarchical interconnect architecture with eight global low-skew clock networks, dedicated carry logic, and VersaRing™ I/O interconnect supporting 5 V-tolerant inputs. Its CLBs contain three function generators (F, G, H), dual storage elements configurable as flip-flops or latches (XC4000XLA variant), and programmable input thresholds (1.6 V).
Configuration occurs via master parallel, slave serial, or peripheral modes using external PROMs; bitstream loading enables unlimited reprogramming. The device supports IEEE 1149.1 boundary scan, individual output slew-rate control, and programmable pull-up/pull-down resistors on all IOBs - with soft start-up to mitigate ground bounce during power-on initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 28,000 typical gates (including RAM resources); enables medium-complexity digital systems without external glue logic. |
| CLB Count | 1,024 CLBs arranged in 32×32 matrix; each CLB provides two 4-input LUTs, one 3-input LUT, dual storage elements, and carry chain. |
| RAM Resources | 32,768 total bits; each CLB supports 16×2, 32×1, or 16×1 dual-port RAM configurations with synchronous write capability. |
| Max System Clock | 80 MHz (speed grade -09); validated for PCI-compliant bus interfaces with deterministic setup/hold timing. |
| I/O Count | 256 user I/O pins in BGG352 package; supports mixed-voltage operation with 5 V-tolerant inputs and 3.3 V outputs. |
| Supply Voltage | 3.0–3.6 V core; enables lower power consumption vs. 5 V families while maintaining compatibility with 3.3 V system rails. |
| Process Technology | 0.35 µm SRAM process; delivers improved speed/power trade-off over earlier XC4000E 0.5 µm implementations. |
Pinout & Package
XC4028XLA-09BGG352C is housed in a 352-ball plastic ball grid array (BGA) package with 256 user I/Os, 8 global clock inputs, dedicated configuration pins (PROGRAM, INIT, DONE), JTAG boundary-scan interface (TCK/TMS/TDI/TDO), and power/ground distribution optimized for signal integrity in high-speed digital systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_Lxx | User-configurable bidirectional I/O | Supports TTL/CMOS levels; individually programmable for slew rate, pull-up/down, and 5 V tolerance. |
| CLK_xx | Global clock input | Connects to low-skew clock network; drives all CLBs and IOBs with minimal skew (<1.5 ns). |
| PROGRAM_B | Active-low configuration reset | Forces device into configuration mode; initiates reinitialization of internal SRAM cells. |
| INIT_B | Configuration status indicator | Open-drain output signals successful configuration completion or error condition. |
| DONE | Configuration completion flag | High-Z during config; driven high when bitstream load completes and device enters user mode. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant testing, programming, and debug without dedicated test fixtures. |
Key Features
| Feature | Design Value |
|---|---|
| SelectRAM™ Memory | On-chip synchronous RAM per CLB enables FIFOs, buffers, and register files without external memory access latency. |
| Dual-Port RAM Mode | 16×1 dual-port configuration allows simultaneous read/write to same address - critical for ping-pong buffering in video/audio pipelines. |
| Edge-Triggered Write | Write Enable (WE) synchronized to CLB clock edge eliminates metastability in pipelined memory controllers. |
| Flexible IOB Control | Per-pin slew-rate control, programmable pull-ups/downs, and 5 V-tolerant inputs simplify mixed-voltage board design. |
| Soft Start-Up | Automatic slew-rate limiting at power-on prevents ground bounce across all 256 I/Os during initial output activation. |
| Boundary Scan Support | Full IEEE 1149.1 compliance enables in-system testability and debugging without physical probe access. |
Applications
| PCI Interface Controller | Digital Signal Processing Accelerator |
|---|---|
|
Use Scenario: Implementation of a single-chip PCI target interface for embedded data acquisition cards operating at 33 MHz. IC Role / Device Role / Timing Role: Configurable logic handles PCI protocol state machine, address/data multiplexing, and burst transaction arbitration; SelectRAM™ stores command queues and status registers. Use Value: Eliminates need for discrete PCI bridge IC and external SRAM, reducing BOM count and PCB area by 35%. |
Use Scenario: Real-time FIR filter engine for industrial motor control requiring 12-bit coefficient updates and 100 kSPS throughput. IC Role / Device Role / Timing Role: CLBs implement parallel MAC units and pipeline stages; dual-port RAM buffers coefficients and sample streams independently. Use Value: Achieves deterministic 8-cycle latency per sample with no external memory wait states, meeting real-time jitter requirements <100 ns. |
| Legacy System Emulator | Configurable Protocol Bridge |
|
Use Scenario: Replacement of obsolete ASICs in telecom line cards using field-upgradable logic for T1/E1 framing and CRC generation. IC Role / Device Role / Timing Role: Replicates original gate-level functionality with identical pinout; CLB carry chains accelerate CRC-32 computation. Use Value: Enables continued production of legacy hardware without redesign; bitstream updates fix field-reported timing bugs. |
Use Scenario: Translation between RS-485 Modbus RTU and CAN FD protocols in factory automation gateways. IC Role / Device Role / Timing Role: Implements dual-protocol state machines, packet parsing, and buffer management using SelectRAM™ as shared message store. Use Value: Supports concurrent protocol stacks with zero-latency handoff between buses, eliminating microcontroller software overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4028XL-09BG352C | Same CLB count and I/O count but uses XC4000XL architecture; lacks latch-capable CLBs and has reduced routing resources. | Not suitable for designs requiring latch-based pipeline stages or high fan-out clock distribution. | Select only if migrating from XC4000XL designs where latch functionality is unused and routing density is sufficient. |
| XCV300E-09BG352C | Virtex-E family successor with 300K system gates, 180 MHz max clock, and embedded BlockRAM; incompatible bitstream and pinout. | Requires full HDL redesign and PCB layout change; supports DDR SDRAM interfaces and higher integration. | Choose for new designs needing >10× logic density increase and modern memory interfaces - not for drop-in replacement. |
Compared with XC4028XLA-09BGG352C, XC4028XL-09BG352C offers lower cost but sacrifices latch support and routing flexibility, while XCV300E-09BG352C enables next-generation performance at the expense of complete hardware and toolchain requalification.
Availability
XC4028XLA-09BGG352C is available at Aetrix Electronics and suitable for legacy system sustainment, industrial controller upgrades, telecom infrastructure spares, and FPGA-based prototyping requiring stable component supply across extended product lifecycles.
Supply support for XC4028XLA-09BGG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered commercial FPGA technology and developed the XC4000 series as its first high-density, system-oriented programmable logic platform.
The XC4000XLA family was designed specifically for 3.3 V systems requiring PCI compliance, embedded memory, and long-term obsolescence resilience - targeting telecom, industrial control, and military/aerospace applications.
FAQ
What is the maximum operating frequency of XC4028XLA-09BGG352C?
The XC4028XLA-09BGG352C is rated for a maximum system clock frequency of 80 MHz at speed grade -09, validated under worst-case voltage (3.0 V) and temperature (85°C) conditions. Internal logic paths can exceed 150 MHz in optimized designs. This rating applies to synchronous operation with proper timing constraints applied during place-and-route using Xilinx Foundation or Alliance software tools. The XC4028XLA-09BGG352C achieves this performance through its 0.35 µm SRAM process and enhanced carry logic architecture.
Does XC4028XLA-09BGG352C support dual-port RAM functionality?
Yes, XC4028XLA-09BGG352C supports dual-port RAM in each CLB by configuring both F' and G' function generators as a 16×1 dual-port array with independent read and write ports. This enables simultaneous read and write operations to the same or different addresses - essential for FIFOs and buffer management. The feature is implemented in hardware and requires no external components. Dual-port mode is selected during synthesis using Xilinx library primitives such as RAM16X1D, and is fully supported in XC4000XLA devices per the May 1999 datasheet revision.
Is XC4028XLA-09BGG352C pin-compatible with other XC4028 variants?
XC4028XLA-09BGG352C is pinout-compatible with XC4028EX and XC4028XL devices in the same BGG352 package, sharing identical I/O assignments and power/ground ball maps. However, it is not bitstream-compatible due to architectural differences in CLB structure and routing resources. Migration from XC4028EX/XL requires re-synthesis and place-and-route but preserves PCB layout. The XC4028XLA-09BGG352C maintains the same 256-user-I/O count and global clock pin locations as its predecessors.
What configuration modes does XC4028XLA-09BGG352C support?
XC4028XLA-09BGG352C supports Master Serial, Slave Serial, Master Parallel, and Peripheral configuration modes. In Master Parallel mode, it accepts up to 22-bit addressing for large PROMs - an enhancement over XC4000E's 18-bit limit. Configuration data is loaded into internal SRAM cells, enabling unlimited reprogramming. The device asserts DONE upon successful load and supports IEEE 1149.1 boundary scan for in-system verification. All modes use the same PROGRAM_B, INIT_B, and CCLK pins defined in the BGG352 pinout.
Can XC4028XLA-09BGG352C operate with 5 V I/O signals?
Yes, XC4028XLA-09BGG352C features 5 V-tolerant I/Os on all user pins, allowing direct connection to 5 V logic without level shifters. Input thresholds are fixed at 1.6 V, compatible with both 3.3 V CMOS and TTL signaling standards. Outputs swing from 0 V to VCCO (3.3 V), and the device includes programmable pull-up/pull-down resistors on each IOB. This tolerance is inherent to the XC4000XLA silicon process and does not require external circuitry or configuration bits to enable.
XC4028XLA-09BGG352C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- XC4000XLA
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1024
- Number of Logic Elements/Cells:
- 2432
- Total RAM Bits:
- 32768
- Number of I/O:
- 256
- Number of Gates:
- 28000
- Voltage - Supply:
- 3V ~ 3.6V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XC4028XLA-09BGG352C FAQ
1.How can I place an order for XC4028XLA-09BGG352C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4028XLA-09BGG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4028XLA-09BGG352C reliable?
The price and inventory of XC4028XLA-09BGG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4028XLA-09BGG352C is usually 5 days.
3.What payment methods are accepted for XC4028XLA-09BGG352C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4028XLA-09BGG352C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4028XLA-09BGG352C?
XC4028XLA-09BGG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4028XLA-09BGG352C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4028XLA-09BGG352C?
For technical support, including XC4028XLA-09BGG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4028XLA-09BGG352C requirements.
6.How does Aetrix verify that XC4028XLA-09BGG352C is sourced from the original manufacturer or authorized distributors?
All XC4028XLA-09BGG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4028XLA-09BGG352C meets industry standards.
7.What is the process for return or replacement of XC4028XLA-09BGG352C?
All XC4028XLA-09BGG352C units undergo pre-shipment inspection (PSI). If there is an issue with XC4028XLA-09BGG352C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4028XLA-09BGG352C part is unused and in its original packaging.
Return procedure for XC4028XLA-09BGG352C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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