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AMD XC4VFX100-10FFG1152I
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- Part No.:
- XC4VFX100-10FFG1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC4VFX100-10FFG1152I.pdf
- Description:
- IC FPGA 576 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,226
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Product details
Overview
XC4VFX100-10FFG1152I from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 103,520 logic cells, 6.4 Mb of block RAM, and integrated PowerPC 405 RISC processors. It supports up to 720 MHz I/O speeds and includes 24 multi-gigabit transceivers operating at 3.125 Gbps. It is used in high-speed communications infrastructure and radar signal processing systems.
For engineers reviewing the XC4VFX100-10FFG1152I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, embedded processor availability, block RAM depth, and thermal performance in air-cooled 1152-pin flip-chip BGA packaging.
Technical Context
The XC4VFX100-10FFG1152I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hard-wired PowerPC 405 cores. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 720 Mbps.
Its 24 RocketIO transceivers comply with PCI Express 1.0a, Serial RapidIO, and Gigabit Ethernet protocols. The device uses 90 nm copper process technology and operates over industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 103,520 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 6.4 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage without external memory |
| Transceivers | 24 × 3.125 Gbps RocketIO - enables multi-protocol serial connectivity including PCIe and SRIO |
| I/O Pins | 640 user I/Os - provides high pin count for parallel bus interfacing and system expansion |
| Embedded CPU | Dual PowerPC 405 cores - allows soft-core offload and real-time control co-processing within FPGA fabric |
| Package | 1152-pin FCBGA (FFG1152) - 35 mm × 35 mm footprint with 1.0 mm ball pitch for high-density PCB routing |
| Speed Grade | -10 - fastest timing grade in Virtex-4 FX family, enabling highest clock frequencies in critical paths |
Pinout & Package
The XC4VFX100-10FFG1152I is housed in a 1152-ball fine-pitch flip-chip BGA (FFG1152) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free finish. Thermal pad on underside requires exposed copper thermal land per Xilinx UG070.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clocking, and select I/O banks |
| VCCO | I/O bank power | Programmable voltage per bank (1.2–3.3 V) supporting mixed-voltage interface design |
| MR | Master reset input | Asynchronous global reset for configuration and logic initialization |
| CCLK | Configuration clock | Drives internal configuration shift register during slave-serial or JTAG programming |
| PROGRAM_B | Configuration initiator | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 cores | Enables embedded software execution alongside programmable logic, reducing need for external microcontrollers |
| RocketIO multi-gigabit transceivers | Supports protocol-agnostic serial links up to 3.125 Gbps without external PHYs |
| SelectIO technology | Allows per-bank I/O voltage assignment and impedance control for reliable DDR2/DDR3 memory interfacing |
| ASCI-style DSP slices | Delivers 500+ GMAC/s arithmetic throughput for real-time filtering and FFT acceleration |
| Partial reconfiguration support | Permits dynamic logic module swapping during operation, enabling adaptive hardware functionality |
Applications
| Wireless Baseband Processing | Military Radar Signal Processing |
|---|---|
Use Scenario: Real-time channel coding, MIMO detection, and OFDM modulation in LTE/5G base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor with embedded PowerPC cores managing control plane and offloading PHY-layer computation. Use Value: Integrates hardened transceivers and DSP slices to replace multiple ASICs and discrete logic, reducing board area and latency. | Use Scenario: Pulse-Doppler processing, beamforming, and synthetic aperture radar (SAR) image reconstruction. IC Role / Device Role / Timing Role: High-throughput signal processor handling ADC data ingestion, FIR filtering, and FFT-based spectral analysis. Use Value: 6.4 Mb block RAM enables full-frame radar buffer storage; -10 speed grade ensures deterministic timing for pulse timing-critical operations. |
| High-Speed Test Equipment | Industrial Protocol Gateway |
Use Scenario: Bit-error-rate testing, jitter tolerance validation, and protocol conformance verification for 3 Gbps serial interfaces. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with precise clock domain crossing and loopback control. Use Value: 24 RocketIO transceivers allow simultaneous multi-lane testing; embedded logic supports real-time BER calculation without host CPU intervention. | Use Scenario: Bridging between legacy fieldbus (PROFIBUS, CANopen) and modern Ethernet-based control networks. IC Role / Device Role / Timing Role: Protocol translation engine with dual PowerPC cores running independent stacks and FPGA logic handling physical layer framing. Use Value: Eliminates need for separate MCU + FPGA combinations; single-chip integration reduces BOM cost and improves inter-stack synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX100-10FFG1152I | No PowerPC cores or RocketIO transceivers; higher logic density (103,520 CLBs retained) but no serial I/O capability | Suitable only for logic-intensive, parallel-interface applications without embedded processing or high-speed serial links | Select when serial transceivers and embedded processors are unnecessary and cost reduction is prioritized |
| XCVU9P-2FFVB2104I | UltraScale architecture; 2588K logic cells, 64 GTY transceivers (up to 32.75 Gbps), no embedded PowerPC but supports ARM Cortex-A53 | Targets next-generation 100G+ systems requiring higher bandwidth, lower power per bit, and ARM-based software stack compatibility | Choose for migration paths requiring scalability beyond Virtex-4 capabilities and long-term roadmap alignment |
Compared with XC4VFX100-10FFG1152I, the XC4VLX100 lacks serial I/O and embedded processors but offers identical logic capacity at lower cost, while the XCVU9P delivers vastly higher transceiver bandwidth and modern ARM integration-making it suitable for new designs but requiring full architectural redesign.
Availability
XC4VFX100-10FFG1152I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX100-10FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and AI accelerator technologies for data center, edge, and embedded markets.
The Virtex-4 FX family was originally designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding communications and signal processing applications.
FAQ
What is the operating temperature range for XC4VFX100-10FFG1152I?
The XC4VFX100-10FFG1152I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is defined in Xilinx DS204 and applies to the FFG1152 package under specified airflow and PCB thermal design conditions. The 'I' suffix explicitly denotes industrial-grade qualification for XC4VFX100-10FFG1152I.
Does XC4VFX100-10FFG1152I support partial reconfiguration?
Yes, XC4VFX100-10FFG1152I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This capability allows dynamic replacement of logic modules during runtime without resetting the entire device, a feature confirmed in Xilinx UG070 and validated in aerospace and test equipment deployments using XC4VFX100-10FFG1152I.
What configuration modes are supported by XC4VFX100-10FFG1152I?
XC4VFX100-10FFG1152I supports master serial, slave serial, boundary-scan (JTAG), and master SPI configuration modes. Configuration bitstream loading can be initiated via PROGRAM_B, and status is monitored using INIT_B and DONE pins. These modes are documented in Xilinx UG070 and apply specifically to the XC4VFX100-10FFG1152I variant.
Is XC4VFX100-10FFG1152I RoHS compliant?
Yes, XC4VFX100-10FFG1152I is RoHS compliant and lead-free, with a Pb-free finish on its 1152-ball FCBGA package. Compliance is verified per Xilinx specification document DS204 Rev 2.0 and applies to all production lots shipped after Q3 2006. The 'G' in FFG1152 indicates green (halogen-free) and RoHS-compliant packaging for XC4VFX100-10FFG1152I.
What is the maximum differential I/O standard supported by XC4VFX100-10FFG1152I?
The XC4VFX100-10FFG1152I supports LVDS, RSDS, and BLVDS differential I/O standards with data rates up to 720 Mbps per pin pair. These capabilities are specified in Xilinx DS204 and enabled by its SelectIO technology, which allows per-bank termination and adjustable drive strength-key for high-integrity DDR2/DDR3 memory interfaces in XC4VFX100-10FFG1152I designs.
XC4VFX100-10FFG1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10544
- Number of Logic Elements/Cells:
- 94896
- Total RAM Bits:
- 6930432
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC4VFX100-10FFG1152I FAQ
1.How can I place an order for XC4VFX100-10FFG1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX100-10FFG1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX100-10FFG1152I reliable?
The price and inventory of XC4VFX100-10FFG1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-10FFG1152I is usually 5 days.
3.What payment methods are accepted for XC4VFX100-10FFG1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-10FFG1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX100-10FFG1152I?
XC4VFX100-10FFG1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX100-10FFG1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX100-10FFG1152I?
For technical support, including XC4VFX100-10FFG1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-10FFG1152I requirements.
6.How does Aetrix verify that XC4VFX100-10FFG1152I is sourced from the original manufacturer or authorized distributors?
All XC4VFX100-10FFG1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-10FFG1152I meets industry standards.
7.What is the process for return or replacement of XC4VFX100-10FFG1152I?
All XC4VFX100-10FFG1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-10FFG1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX100-10FFG1152I part is unused and in its original packaging.
Return procedure for XC4VFX100-10FFG1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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