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AMD XC4VFX100-11FF1152I

Part No.:
XC4VFX100-11FF1152I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC4VFX100-11FF1152I.pdf
Description:
IC FPGA 576 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,553

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Product details

Overview

XC4VFX100-11FF1152I from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 100K logic cells, 640 DSP48 slices, 3.8 MB of block RAM, 1152-pin Flip-Chip Fine-Pitch BGA package, and -11 speed grade for deterministic timing closure in high-bandwidth signal processing systems used in radar beamforming and optical transport line cards.

For engineers reviewing the XC4VFX100-11FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), LVDS/BLVDS/SSTL-2 support, embedded PowerPC 405 RISC processors (2x), and multi-gigabit transceivers (16x RocketIO GTP operating up to 3.75 Gbps).

Technical Context

The XC4VFX100-11FF1152I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and integrated PowerPC 405 cores enabling soft-processor and hardware-accelerated co-processing. It supports PCI Express x4 endpoint functionality and DDR2 memory interfaces up to 400 MHz.

RocketIO transceivers provide serial connectivity compliant with SONET OC-48, Gigabit Ethernet, and Fibre Channel standards. Configuration occurs via Master SelectMAP mode using external PROM or JTAG, with bitstream encryption supported through AES-128.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells100,352 - determines maximum combinational/sequential logic capacity for custom digital functions
DSP Slices640 - enables parallel 18×18-bit multiply-accumulate operations per clock cycle
Block RAM3,840 kbits - supports large on-chip data buffering and FIFO implementation without external memory
User I/Os720 - provides high pin-count interface capability for multi-protocol board-level interconnect
Transceivers16 × RocketIO GTP - delivers 1.25–3.75 Gbps serial links for optical and backplane applications
Speed Grade-11 - guarantees worst-case timing performance at highest operating frequency for critical paths
PackageFF1152 - 1152-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity

Pinout & Package

XC4VFX100-11FF1152I is housed in a 1152-pin Flip-Chip Fine-Pitch BGA (FF1152) package with 35×35 array, 1.0 mm ball pitch, and thermal lid for enhanced power delivery and heat transfer in high-clock-rate operation.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration, clock management, and I/O banks; shared across multiple banks
VCCOI/O bank powerProgrammable 1.2–3.3 V per bank; sets output voltage level and compatible interface standards
CONFIG_IOConfiguration I/ODedicated pins for Master SelectMAP, JTAG, or serial configuration; not usable as general-purpose I/O
MRMaster ResetAsynchronous global reset input that clears configuration memory and logic states
CLKINPrimary clock inputAccepts single-ended or differential clocks up to 500 MHz for DCM and PLL clock synthesis

Key Features

FeatureDesign Value
Embedded PowerPC 405 coresTwo hardened RISC processors enable real-time control and firmware-driven system management alongside programmable logic
Multi-Gigabit Transceivers16 RocketIO GTPs support protocol-specific encoding (8B/10B) and built-in PRBS generators for link validation
Dedicated DSP48 slicesHardwired 18×18 multipliers with pipeline registers allow 100% utilization at 500 MHz for filtering and FFT kernels
PCI Express Endpoint LogicIntegrated hard IP supports x4 lane configuration with full transaction layer compliance and MSI interrupt handling
Block RAM with ECCOn-die error correction for single-bit error detection and correction improves reliability in radiation-sensitive environments

Applications

Radar Signal ProcessingOptical Transport Line Card

Use Scenario: Real-time pulse-Doppler processing and adaptive beamforming in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; RocketIO links feed ADC/DAC data streams at 3.125 Gbps.

Use Value: 640 DSP48 slices deliver >2.5 GOPS sustained compute throughput while maintaining deterministic latency under temperature variation.

Use Scenario: Aggregation and framing of 10G Ethernet, OTU2, and STM-64 traffic in metro DWDM line cards.

IC Role / Device Role / Timing Role: XC4VFX100-11FF1152I serves as the packet processing and SerDes bridging engine between client interfaces and backplane PHYs.

Use Value: Integrated PCI Express x4 and 16 RocketIO transceivers eliminate need for external bridge ICs and reduce board-level signal routing complexity.

Medical Imaging BackendAvionics Data Concentrator

Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression in portable imaging platforms.

IC Role / Device Role / Timing Role: Configurable logic processes raw channel data from 128+ receive channels; PowerPC cores manage network stack and UI services.

Use Value: On-chip 3.8 MB block RAM buffers full-frame echo data for multi-pass beamforming without external DRAM access latency.

Use Scenario: ARINC 664 (AFDX) end-system switching and deterministic message scheduling in flight control computers.

IC Role / Device Role / Timing Role: XC4VFX100-11FF1152I implements time-triggered AFDX switch fabric with guaranteed sub-microsecond jitter for safety-critical partitions.

Use Value: -11 speed grade and DCM-based clock deskew ensure <±50 ps skew across 720 I/Os required for synchronized AFDX port timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture; 1.1M logic cells; 64 RocketIO GTY transceivers; 2104-pin FC-BGA; no embedded PowerPCTargets next-gen 100G+ coherent optics and AI inference acceleration where legacy PowerPC software is not requiredSelect when migrating from Virtex-4 designs requiring higher bandwidth, lower power per function, and PCIe Gen4 support
XC5VLX110T-1FF1136CVirtex-5 architecture; 110K logic cells; 24 RocketIO GTP; 1136-pin FF1136 package; same PowerPC 405 dual-coreOffers improved DSP density and DDR3 controller support while retaining PowerPC compatibility for legacy firmware reuseChoose for drop-in upgrade path with minimal HDL changes and proven toolchain continuity in aerospace avionics

Compared with XC4VFX100-11FF1152I, the XC5VLX110T offers higher DSP efficiency and DDR3 readiness for memory-intensive upgrades, while the XCVU9P delivers generational leap in transceiver count and logic scale-both require PCB redesign but preserve core algorithmic IP.

Availability

XC4VFX100-11FF1152I is available at Aetrix Electronics and suitable for radar beamforming, optical transport line cards, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC4VFX100-11FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and signal processing applications.

The Virtex-4 FX platform was designed specifically for system-on-chip integration combining programmable logic, embedded processors, and high-speed serial I/O in single-package solutions for defense and telecom infrastructure.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX100-11FF1152I?

The XC4VFX100-11FF1152I integrates two PowerPC 405 RISC processors rated for operation up to 500 MHz under the -11 speed grade. This frequency is achievable with proper thermal management and voltage regulation, and is specified in the Virtex-4 Platform FPGA User Guide (UG070). The actual sustained clock rate depends on design constraints including cache usage, bus arbitration, and instruction mix.

Does XC4VFX100-11FF1152I support JTAG boundary-scan testing?

Yes, XC4VFX100-11FF1152I fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TAP controller is implemented in hardware and accessible via dedicated TCK, TMS, TDI, and TDO pins. Boundary-scan capability covers all user I/Os and internal logic resources, and is validated in Xilinx ISE 14.7 and Vivado 2018.3 legacy toolchains.

What configuration modes are supported by XC4VFX100-11FF1152I?

XC4VFX100-11FF1152I supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. Master SelectMAP uses dedicated CONFIG_IO pins to load bitstream from external PROM at power-up. SPI mode allows direct connection to industry-standard serial flash devices. JTAG is used for in-system programming and debug. All modes are documented in the Virtex-4 Configuration User Guide (UG073).

Is XC4VFX100-11FF1152I qualified for automotive applications?

No, XC4VFX100-11FF1152I is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. It is rated for industrial temperature range (–40°C to +100°C case temperature) and intended for aerospace, defense, and telecom infrastructure. Automotive-grade alternatives require separate qualification, extended temperature screening, and failure-in-time (FIT) reporting not provided for this part.

Can XC4VFX100-11FF1152I interface directly with DDR2 SDRAM at 400 MHz?

Yes, XC4VFX100-11FF1152I includes dedicated DDR2 memory controller logic supporting data rates up to 400 MHz (200 MHz clock, double-data-rate). The controller handles command scheduling, read/write leveling, and on-die termination control. Implementation requires proper PCB layout with matched trace lengths and controlled impedance, and is verified using Xilinx MIG v2.3 IP core targeting the FF1152 package.

XC4VFX100-11FF1152I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10544
Number of Logic Elements/Cells:
94896
Total RAM Bits:
6930432
Number of I/O:
576
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC4VFX100-11FF1152I FAQ

1.How can I place an order for XC4VFX100-11FF1152I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX100-11FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX100-11FF1152I reliable?

The price and inventory of XC4VFX100-11FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-11FF1152I is usually 5 days.

3.What payment methods are accepted for XC4VFX100-11FF1152I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-11FF1152I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX100-11FF1152I?

XC4VFX100-11FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX100-11FF1152I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX100-11FF1152I?

For technical support, including XC4VFX100-11FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-11FF1152I requirements.

6.How does Aetrix verify that XC4VFX100-11FF1152I is sourced from the original manufacturer or authorized distributors?

All XC4VFX100-11FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-11FF1152I meets industry standards.

7.What is the process for return or replacement of XC4VFX100-11FF1152I?

All XC4VFX100-11FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-11FF1152I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX100-11FF1152I part is unused and in its original packaging.

Return procedure for XC4VFX100-11FF1152I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX100-11FF1152I Tags

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  • XC4VFX100-11FF1152I Specifications
  • XC4VFX100-11FF1152I Images
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