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AMD XC4VFX100-11FF1517C

Part No.:
XC4VFX100-11FF1517C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXC4VFX100-11FF1517C.pdf
Description:
IC FPGA 768 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,416

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Product details

Overview

XC4VFX100-11FF1517C from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 101,952 logic cells, 640 embedded 18×18 multipliers, and integrated PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes 12 RocketIO™ GTP transceivers operating at 1.0–3.75 Gb/s. It is used in high-speed communication line cards and reconfigurable computing platforms.

For engineers reviewing the XC4VFX100-11FF1517C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O bank voltage support (1.2 V/1.5 V/1.8 V/2.5 V), transceiver compliance with SONET/SDH and PCIe 1.0, and configuration via Master SelectMAP or JTAG.

Technical Context

The XC4VFX100-11FF1517C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (12,312 kbits), and dedicated DSP slices. Its dual-processor subsystem integrates two PowerPC 405 cores with on-chip cache and PLB bus interface for embedded control.

RocketIO transceivers support protocol-specific encoding (8B/10B), clock data recovery (CDR), and programmable pre-emphasis and equalization. The device uses 90 nm copper process technology and operates over commercial temperature range (0°C to 85°C).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells101,952 - determines maximum combinational and sequential logic capacity for custom digital functions
Embedded Multipliers640 × 18×18-bit - enables parallel DSP operations including FIR filtering and FFT computation
Block RAM12,312 kbits - provides on-chip memory for buffering, lookup tables, and FIFO implementation
RocketIO GTP Transceivers12 × 1.0–3.75 Gb/s - supports serial protocols including PCIe 1.0, Gigabit Ethernet, and Serial RapidIO
I/O StandardsLVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct interfacing with DDR2 SDRAM, ADCs, DACs, and FPGAs
Configuration ModeMaster SelectMAP, Slave SelectMAP, JTAG - enables flexible programming via flash, processor, or boundary-scan

Pinout & Package

XC4VFX100-11FF1517C is housed in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1517) package with 1.0 mm ball pitch and 35 × 35 array. The package supports thermal dissipation up to 12.5 W under typical operating conditions and requires controlled-impedance PCB routing for transceiver lanes.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationSelects startup configuration mode (e.g., Master SelectMAP, JTAG)
CCLKConfiguration ClockDrives internal configuration logic during bitstream loading
DINConfiguration Data InputSerial input for configuration bitstream in Master SelectMAP mode
INIT_BConfiguration StatusOpen-drain output indicating configuration status and error detection
PROGRAM_BConfiguration ResetActive-low signal that clears configuration memory and restarts startup sequence
GTxP/NTransceiver Differential PairHigh-speed serial I/O supporting CDR and 8B/10B encoding

Key Features

FeatureDesign Value
Integrated PowerPC 405 CoresTwo hardened RISC processors enable real-time embedded control alongside programmable logic
DDR2 Memory Controller SupportHardened interface supporting 400 MHz data rates and 32-bit/64-bit bus widths
Partial Reconfiguration CapabilityAllows dynamic logic module replacement without full device reset or system interruption
Multi-Voltage I/O Banks16 independent banks support mixed-voltage operation (1.2 V to 2.5 V) for heterogeneous interface integration
ChipSync Source-Synchronous I/OEnables deterministic timing closure for high-speed parallel interfaces like DDR2 and QDR SRAM

Applications

Wireless Baseband ProcessingOptical Transport Line Cards

Use Scenario: Real-time modulation/demodulation and channel coding in LTE and WiMAX base stations.

IC Role / Device Role / Timing Role: FPGA fabric implements PHY-layer algorithms while PowerPC cores manage MAC-layer protocol stack and system control.

Use Value: Enables field-upgradable waveform standards and adaptive resource allocation across multiple air interfaces.

Use Scenario: SONET/SDH add-drop multiplexing and packet-over-SONET framing in metro optical edge equipment.

IC Role / Device Role / Timing Role: RocketIO transceivers handle OC-192 serial links; CLBs implement GFP/HDLC framing and overhead processing.

Use Value: Integrates line-rate packet processing and SERDES in single device, reducing board area and power vs. discrete solutions.

Medical Imaging AccelerationDefense Radar Signal Processing

Use Scenario: Real-time image reconstruction and beamforming in MRI and CT scanner front-ends.

IC Role / Device Role / Timing Role: DSP slices execute back-projection and convolution kernels; block RAM buffers raw sensor data streams.

Use Value: Delivers deterministic latency and throughput for safety-critical imaging pipelines with no software OS dependency.

Use Scenario: Pulse-Doppler radar processing including STAP, CFAR, and synthetic aperture generation in airborne platforms.

IC Role / Device Role / Timing Role: Configurable logic implements radar-specific FFTs and matched filters; PowerPC manages mission computer interface and health monitoring.

Use Value: Supports radiation-tolerant design variants and long-lifecycle availability required for military avionics programs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VLX100-11FF1517CLacks PowerPC cores and RocketIO transceivers; higher logic density (101,952 CLBs) but no serial I/O or embedded processorSuitable for compute-intensive logic-only tasks without protocol-aware serial I/O or soft/hard CPU needsSelect when transceiver and embedded processor functionality are unnecessary and cost optimization is prioritized
XC5VLX110T-1FF1136CVirtex-5 architecture; 110k logic cells, 640 DSP48E slices, 8 RocketIO GTX transceivers (3.75–6.5 Gb/s), no PowerPC coresBetter suited for next-generation designs requiring higher transceiver bandwidth and lower static power, but lacks dual-processor subsystemChoose for migration paths needing higher serial bandwidth and improved DSP efficiency, accepting loss of hard CPU capability

Compared with XC4VFX100-11FF1517C, the XC4VLX100 offers pure logic capacity at lower cost but no embedded processing or high-speed serial I/O, while the XC5VLX110T delivers superior transceiver performance and DSP density but removes the dual PowerPC 405 subsystem-making it unsuitable for tightly coupled hardware-software co-design.

Availability

XC4VFX100-11FF1517C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, medical imaging, and defense electronics requiring stable component supply and long-term lifecycle support.

Supply support for XC4VFX100-11FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and AI engine technologies for data center, communications, and embedded markets.

The Virtex-4 family was originally designed by Xilinx to deliver high-performance reconfigurable logic with integrated processors and serial transceivers for demanding communication and signal processing applications.

FAQ

What is the operating temperature range for XC4VFX100-11FF1517C?

The XC4VFX100-11FF1517C is rated for commercial temperature operation from 0°C to +85°C ambient. This range applies to the FF1517 package variant and assumes proper PCB thermal design and airflow per Xilinx UG070 documentation. The device does not support industrial or extended temperature grades in this specific speed grade and packaging.

Does XC4VFX100-11FF1517C support partial reconfiguration?

Yes, the XC4VFX100-11FF1517C supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading mechanism. This capability allows runtime modification of designated logic regions without disrupting active functions elsewhere in the XC4VFX100-11FF1517C device.

What configuration modes are supported by XC4VFX100-11FF1517C?

The XC4VFX100-11FF1517C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. These are selected using M0–M2 pins at power-up. Master SelectMAP enables direct loading from external flash memory, while JTAG is used for debugging and in-system programming of the XC4VFX100-11FF1517C.

How many RocketIO transceivers does XC4VFX100-11FF1517C include?

The XC4VFX100-11FF1517C includes 12 RocketIO GTP transceivers, each capable of 1.0–3.75 Gb/s operation. These transceivers comply with SONET OC-48, PCI Express 1.0, and Gigabit Ethernet standards and are distributed across four quadrants of the XC4VFX100-11FF1517C die.

Is XC4VFX100-11FF1517C pin-compatible with other Virtex-4 FPGAs?

No, XC4VFX100-11FF1517C is not pin-compatible with other Virtex-4 devices-even within the same FFG1517 package-due to differing I/O bank assignments, transceiver placement, and configuration pin locations. Pin compatibility must be verified per specific device and speed grade using Xilinx's pinout files for the XC4VFX100-11FF1517C.

XC4VFX100-11FF1517C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1517-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10544
Number of Logic Elements/Cells:
94896
Total RAM Bits:
6930432
Number of I/O:
768
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XC4VFX100-11FF1517C FAQ

1.How can I place an order for XC4VFX100-11FF1517C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX100-11FF1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX100-11FF1517C reliable?

The price and inventory of XC4VFX100-11FF1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-11FF1517C is usually 5 days.

3.What payment methods are accepted for XC4VFX100-11FF1517C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-11FF1517C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX100-11FF1517C?

XC4VFX100-11FF1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX100-11FF1517C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX100-11FF1517C?

For technical support, including XC4VFX100-11FF1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-11FF1517C requirements.

6.How does Aetrix verify that XC4VFX100-11FF1517C is sourced from the original manufacturer or authorized distributors?

All XC4VFX100-11FF1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-11FF1517C meets industry standards.

7.What is the process for return or replacement of XC4VFX100-11FF1517C?

All XC4VFX100-11FF1517C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-11FF1517C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX100-11FF1517C part is unused and in its original packaging.

Return procedure for XC4VFX100-11FF1517C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX100-11FF1517C Tags

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  • XC4VFX100-11FF1517C PDF
  • XC4VFX100-11FF1517C Datasheet
  • XC4VFX100-11FF1517C Specifications
  • XC4VFX100-11FF1517C Images
  • AMD
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  • Buy XC4VFX100-11FF1517C
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