AMD XC4VFX100-11FF1517I
- Part No.:
- XC4VFX100-11FF1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XC4VFX100-11FF1517I.pdf
- Description:
- IC FPGA 768 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VFX100-11FF1517I from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 103,296 logic cells, 640 embedded 18×18 multipliers, and integrated PowerPC 405 processor cores. It supports DDR2 memory interfaces up to 400 MHz and includes 6.4 Mb of block RAM. Used in high-speed communications infrastructure and radar signal processing systems.
For engineers reviewing the XC4VFX100-11FF1517I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), speed grade (-11), thermal performance in industrial temperature range (-40°C to +100°C), and FF1517 flip-chip BGA package compatibility.
Technical Context
The XC4VFX100-11FF1517I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hard-core PowerPC 405 RISC processors. It integrates RocketIO™ multi-gigabit transceivers supporting 622 Mbps to 3.75 Gbps serial links.
It features SelectIO™ technology with programmable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and RSDS. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 103,296 - total configurable logic resources for complex digital logic implementation |
| Block RAM | 6.4 Mb - on-chip memory for data buffering, FIFOs, and lookup tables |
| Multipliers | 640 × 18×18 - dedicated DSP resources for high-throughput arithmetic operations |
| Speed Grade | -11 - highest performance bin for critical timing paths in high-frequency designs |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS - flexible interface compatibility with diverse peripheral families |
| Transceivers | 16 × RocketIO™ - serial link capability up to 3.75 Gbps per channel |
Pinout & Package
XC4VFX100-11FF1517I is housed in a 1517-pin flip-chip fine-pitch BGA (FF1517) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal management in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, JTAG, and auxiliary I/O circuitry |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–2.5 V) enabling mixed-voltage interface design |
| IO_Lx | Configurable I/O | Bi-directional user I/O pins supporting multiple single-ended and differential standards |
| CLK_IN | Global clock input | Dedicated low-skew clock routing path into global clock network |
| PROG_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 cores | Two embedded 32-bit RISC processors enable real-time control and software-defined functionality alongside hardware acceleration |
| RocketIO™ transceivers | 16 serial transceivers support protocol-agnostic high-speed links including Aurora, PCI Express, and Serial RapidIO |
| SelectIO™ technology | Per-bank I/O voltage and standard configuration allows heterogeneous interface integration without level-shifting components |
| ChipSync™ source-synchronous I/O | Enables reliable DDR2 memory interfacing at 400 MHz with built-in deskew and calibration |
| Partial reconfiguration support | Allows dynamic module swapping in operational systems, reducing downtime and enabling field-upgradable functionality |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom signal processing algorithms while PowerPC cores manage system control and communication stacks. Use Value: Integrated DSP slices and 640 multipliers accelerate FFT and filtering operations; RocketIO transceivers interface with ADC/DAC FMC modules at >2 Gbps. | Use Scenario: High-precision automated test equipment requiring deterministic timing, pattern generation, and real-time response analysis. IC Role / Device Role / Timing Role: Serves as the core logic engine for stimulus generation, response capture, and on-the-fly error detection. Use Value: -11 speed grade ensures sub-nanosecond timing closure; ChipSync I/O enables precise synchronization with external instruments at 400 MHz DDR2 rates. |
| Communications Baseband Processing | Avionics Data Concentrators |
Use Scenario: LTE and WiMAX baseband processing in macrocell and remote radio head units. IC Role / Device Role / Timing Role: Implements channel coding, modulation/demodulation, and MIMO processing pipelines with parallelized hardware accelerators. Use Value: 103,296 logic cells accommodate large OFDM symbol processing chains; 6.4 Mb block RAM buffers multiple frames for latency-sensitive protocols. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553 data concentrator in flight control and mission computing systems. IC Role / Device Role / Timing Role: Manages time-triggered Ethernet switching, protocol translation, and deterministic packet scheduling. Use Value: Hard PowerPC 405 cores run AFDX stack firmware; RocketIO transceivers connect to dual-redundant switched fabric at 1.25 Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (1,182K LC), no embedded PowerPC, supports PCIe Gen4 and 25.8 Gbps transceivers | Targets newer high-bandwidth compute-acceleration and AI inference workloads; lacks legacy PowerPC-based firmware compatibility | Choose when migrating from Virtex-4 for bandwidth and density scaling, not for PowerPC-dependent legacy code reuse |
| XC5VLX110T-2FF1136I | Virtex-5 architecture; 110K logic cells, no PowerPC cores, 3.2 Gbps RocketIO, lower block RAM (5.5 Mb) | Suitable for cost-optimized upgrades where PowerPC is not required and transceiver count is reduced | Prefer for incremental upgrades requiring same-family toolchain continuity but without processor core dependency |
Compared with XC4VFX100-11FF1517I, the XCVU9P offers significantly higher throughput and modern protocol support but removes PowerPC firmware compatibility, while the XC5VLX110T retains Virtex toolchain familiarity at lower density and without embedded processors-making it suitable only for non-processor-centric logic upgrades.
Availability
XC4VFX100-11FF1517I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test instrumentation, and avionics data concentrators requiring stable component supply across long-life industrial programs.
Supply support for XC4VFX100-11FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated computing.
The Virtex-4 family was originally designed by Xilinx for high-performance logic, embedded processing, and serial connectivity in demanding communications and defense applications.
FAQ
What is the operating temperature range for XC4VFX100-11FF1517I?
The XC4VFX100-11FF1517I is rated for industrial operation from –40°C to +100°C. This extended temperature range supports deployment in harsh environments such as airborne radar enclosures and outdoor base station cabinets. Thermal derating guidelines apply above 85°C ambient, and proper heatsinking is required due to its 15W typical power dissipation. The XC4VFX100-11FF1517I datasheet specifies junction temperature limits and thermal resistance values for FF1517 package mounting.
Does XC4VFX100-11FF1517I include embedded processor cores?
Yes, the XC4VFX100-11FF1517I integrates two hard-core PowerPC 405 RISC processors running at up to 400 MHz. These cores support full instruction set execution, cache coherency, and direct access to FPGA fabric via PLB and OPB buses. Firmware development uses Xilinx EDK and GNU PowerPC toolchain. The XC4VFX100-11FF1517I enables tightly coupled software-hardware systems without external microcontrollers.
What configuration methods does XC4VFX100-11FF1517I support?
The XC4VFX100-11FF1517I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. External SPI PROMs (e.g., XCFxx series) are commonly used for autonomous startup, while processor-controlled configuration enables dynamic reconfiguration. Boundary-scan testing and in-system programming are fully supported via the JTAG TAP controller. All modes are documented in the XC4VFX100-11FF1517I configuration user guide.
What is the maximum DDR2 memory interface speed supported by XC4VFX100-11FF1517I?
The XC4VFX100-11FF1517I supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using ChipSync™ source-synchronous I/O. This includes built-in write leveling, read leveling, and dynamic phase alignment for robust timing margin. Memory controllers are implemented using Xilinx LogiCORE IP or custom RTL. The XC4VFX100-11FF1517I's I/O banks must be powered at 1.8 V for DDR2 compliance.
Is XC4VFX100-11FF1517I pin-compatible with other Virtex-4 FPGAs in the FX family?
No, the XC4VFX100-11FF1517I is not pin-compatible with smaller FX devices such as XC4VFX20 or XC4VFX40 due to differing ball counts (1517 vs. 1152/1517 variants) and I/O bank arrangements. Even within the FF1517 footprint, pin functions vary across densities. Migration requires PCB redesign. The XC4VFX100-11FF1517I datasheet provides full pinout mapping and bank-specific voltage requirements for layout verification.
XC4VFX100-11FF1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10544
- Number of Logic Elements/Cells:
- 94896
- Total RAM Bits:
- 6930432
- Number of I/O:
- 768
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XC4VFX100-11FF1517I FAQ
1.How can I place an order for XC4VFX100-11FF1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX100-11FF1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX100-11FF1517I reliable?
The price and inventory of XC4VFX100-11FF1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-11FF1517I is usually 5 days.
3.What payment methods are accepted for XC4VFX100-11FF1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-11FF1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX100-11FF1517I?
XC4VFX100-11FF1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX100-11FF1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX100-11FF1517I?
For technical support, including XC4VFX100-11FF1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-11FF1517I requirements.
6.How does Aetrix verify that XC4VFX100-11FF1517I is sourced from the original manufacturer or authorized distributors?
All XC4VFX100-11FF1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-11FF1517I meets industry standards.
7.What is the process for return or replacement of XC4VFX100-11FF1517I?
All XC4VFX100-11FF1517I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-11FF1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX100-11FF1517I part is unused and in its original packaging.
Return procedure for XC4VFX100-11FF1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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