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AMD XC4VFX100-11FFG1152C

Part No.:
XC4VFX100-11FFG1152C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC4VFX100-11FFG1152C.pdf
Description:
IC FPGA 576 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,102

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Product details

Overview

XC4VFX100-11FFG1152C from AMD is a high-performance Virtex-4 FX family FPGA featuring 103,296 logic cells, dual PowerPC 405 RISC processors, and integrated RocketIO™ multi-gigabit transceivers operating up to 3.75 Gbps. It is used in high-bandwidth communication infrastructure and embedded processing systems requiring real-time signal handling and protocol acceleration.

For engineers reviewing the XC4VFX100-11FFG1152C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), transceiver lane count (24 lanes), embedded processor core count (2x PPC405), and speed grade (-11).

Technical Context

The XC4VFX100-11FFG1152C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (6,480 kbits), and dedicated DSP48 slices (192). Its embedded PowerPC 405 cores support boot-from-Flash and run-time firmware execution.

RocketIO transceivers provide programmable pre-emphasis, receiver equalization, and clock data recovery (CDR) for protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet. The device supports SelectIO™ standards up to LVDS and SSTL-2.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells103,296 - determines maximum combinational/sequential logic capacity for custom RTL implementation
User I/O Pins720 - supports high-pin-count interface bridging and parallel bus expansion
RocketIO Transceivers24 lanes @ 622 Mbps–3.75 Gbps - enables multi-protocol serial connectivity without external PHYs
Block RAM6,480 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables
DSP48 Slices192 - delivers 18×18-bit multiply-accumulate capability for real-time filtering and math-intensive algorithms
Embedded Processors2× PowerPC 405 - enables hard-core software execution alongside programmable logic for heterogeneous computing

Pinout & Package

XC4VFX100-11FFG1152C is housed in a 1152-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and mechanical design requires controlled PCB stack-up and thermal vias under the die area.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V ±3% supply for FPGA fabric and embedded processors
VCCAUXAuxiliary power supply2.5 V supply for configuration circuitry, SelectIO banks, and transceiver analog circuitry
VCCOI/O bank powerProgrammable per-bank voltage (1.2–3.3 V) supporting mixed-voltage interfaces
M0–M2Configuration mode pinsDetermine boot source (e.g., Master SelectMAP, JTAG, or Serial PROM)
INIT_BConfiguration statusActive-low open-drain signal indicating successful bitstream loading or error condition

Key Features

FeatureDesign Value
Dual PowerPC 405 coresEnables concurrent firmware execution and hardware acceleration in single-package SoC-like architecture
24 RocketIO transceiversReduces external PHY count and board-level routing complexity for multi-gigabit serial links
192 DSP48 slicesSupports real-time FIR/IIR filtering, FFT computation, and video pixel processing at system clock rates
720 user I/Os with SelectIOAllows direct interfacing to DDR2 memory, parallel ADC/DAC, and legacy parallel buses without level-shifting ICs

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time modulation/demodulation and channel coding for LTE and WiMAX base stations.

IC Role / Device Role / Timing Role: FPGA fabric executes PHY-layer algorithms while PowerPC cores manage MAC-layer control and protocol stack.

Use Value: Integrated transceivers interface directly to RF front-end ADC/DAC; DSP slices accelerate convolutional coding at >100 MSPS.

Use Scenario: High-throughput digital pattern generation and acquisition in automated test systems.

IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms; RocketIO lanes capture multi-Gbps DUT responses.

Use Value: 720 I/Os enable wide parallel vector I/O; -11 speed grade ensures deterministic timing closure at 500 MHz system clocks.

Defense Radar Signal ProcessingMedical Imaging Data Pipeline

Use Scenario: Pulse-Doppler processing and beamforming in active electronically scanned array (AESA) radar systems.

IC Role / Device Role / Timing Role: DSP48 slices perform real-time FFTs and CFAR detection; PowerPC handles sensor fusion and command interface.

Use Value: Block RAM buffers radar frame data; RocketIO links transmit processed video streams over fiber to display subsystems.

Use Scenario: Real-time image reconstruction and DICOM compression in MRI and CT scanners.

IC Role / Device Role / Timing Role: FPGA fabric processes raw k-space data; PowerPC manages DICOM network stack and UI controller.

Use Value: Dual PPC405 cores isolate safety-critical imaging pipeline from network-facing services; 6,480 kbits block RAM stores intermediate image tiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 1,182,240 LUTs, 64 GTY transceivers @ 32.75 Gbps, no embedded processorsLacks hard PowerPC cores; requires soft-core or external processor for control planePreferred when higher transceiver bandwidth and logic density outweigh need for integrated processors
XC7Z045-2FBG676IZynq-7000 SoC, 2× ARM Cortex-A9, 245,760 logic cells, 16 GTP transceivers @ 3.125 GbpsARM-based software ecosystem vs. PowerPC; lower logic density but stronger OS support and peripheral integrationChosen for Linux-capable embedded systems where application software maturity matters more than raw FPGA fabric size

Compared with XC4VFX100-11FFG1152C, XCVU9P-2FLGA2104I offers significantly higher transceiver speed and logic capacity but removes embedded processors, shifting control-plane responsibility off-die. XC7Z045-2FBG676I trades PowerPC for ARM, enabling richer OS support and peripheral integration at lower logic density and transceiver count.

Availability

XC4VFX100-11FFG1152C is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and medical imaging systems requiring stable component supply across long product lifecycles.

Supply support for XC4VFX100-11FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs and manufactures high-performance programmable logic devices, adaptive SoCs, and AI accelerators for datacenter, edge, and embedded markets.

The Virtex-4 FX family was engineered to unify high-speed serial connectivity, embedded processing, and programmable logic in a single device for demanding communications and signal processing applications.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC4VFX100-11FFG1152C?

The XC4VFX100-11FFG1152C RocketIO transceivers support data rates from 622 Mbps to 3.75 Gbps per lane. This range enables compliance with multiple serial protocols including PCI Express Gen1, Serial RapidIO 1.x, and Gigabit Ethernet. Each of the 24 transceiver lanes operates independently and can be configured individually within this bandwidth window.

Does XC4VFX100-11FFG1152C include on-chip memory for data buffering?

Yes, XC4VFX100-11FFG1152C integrates 6,480 kbits of block RAM distributed across the FPGA fabric. This memory is organized into configurable blocks usable as true dual-port RAM, ROM, or shift registers. It supports synchronous read/write operations and is commonly used for FIFOs, coefficient storage, and frame buffering in signal processing pipelines.

What power supply voltages does XC4VFX100-11FFG1152C require?

XC4VFX100-11FFG1152C requires three primary supply rails: VCCINT at 1.2 V ±3% for the core logic and PowerPC processors; VCCAUX at 2.5 V for configuration circuitry and transceiver analog sections; and per-bank VCCO supplies ranging from 1.2 V to 3.3 V to match connected I/O standards. Decoupling and sequencing must follow AMD's Virtex-4 DC and switching characteristics specifications.

Can XC4VFX100-11FFG1152C be configured via JTAG interface?

Yes, XC4VFX100-11FFG1152C supports JTAG boundary-scan configuration using IEEE 1149.1-compliant TAP controller. JTAG is used for programming, debugging, and verification during development and in-system testing. Configuration modes M0–M2 must be set to select JTAG as the active method, and the TCK, TMS, TDI, and TDO pins must be properly terminated and routed.

What is the operating temperature range for XC4VFX100-11FFG1152C?

XC4VFX100-11FFG1152C is rated for commercial operation from 0 °C to +85 °C ambient temperature. The "C" suffix in the part number explicitly denotes the commercial temperature grade. Thermal management must ensure junction temperature remains within safe limits under full logic and transceiver utilization, typically requiring heatsinking and airflow for sustained 100% resource usage.

XC4VFX100-11FFG1152C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10544
Number of Logic Elements/Cells:
94896
Total RAM Bits:
6930432
Number of I/O:
576
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC4VFX100-11FFG1152C FAQ

1.How can I place an order for XC4VFX100-11FFG1152C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX100-11FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX100-11FFG1152C reliable?

The price and inventory of XC4VFX100-11FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-11FFG1152C is usually 5 days.

3.What payment methods are accepted for XC4VFX100-11FFG1152C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-11FFG1152C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX100-11FFG1152C?

XC4VFX100-11FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX100-11FFG1152C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX100-11FFG1152C?

For technical support, including XC4VFX100-11FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-11FFG1152C requirements.

6.How does Aetrix verify that XC4VFX100-11FFG1152C is sourced from the original manufacturer or authorized distributors?

All XC4VFX100-11FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-11FFG1152C meets industry standards.

7.What is the process for return or replacement of XC4VFX100-11FFG1152C?

All XC4VFX100-11FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-11FFG1152C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX100-11FFG1152C part is unused and in its original packaging.

Return procedure for XC4VFX100-11FFG1152C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX100-11FFG1152C Tags

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  • XC4VFX100-11FFG1152C Images
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