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AMD XC4VFX100-11FFG1517I

Part No.:
XC4VFX100-11FFG1517I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXC4VFX100-11FFG1517I.pdf
Description:
IC FPGA 768 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,675

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Product details

Overview

XC4VFX100-11FFG1517I from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 101,952 logic cells, 6.48 Mb of block RAM, and integrated PowerPC 405 RISC processors. It supports up to 1,152 DSP48 slices and operates at -11 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-bandwidth protocol processing and reconfigurable computing systems.

For engineers reviewing the XC4VFX100-11FFG1517I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (1,104 user I/Os), differential signaling support (LVDS, RSDS), embedded processor availability, and thermal performance under sustained logic utilization.

Technical Context

The XC4VFX100-11FFG1517I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and dual PowerPC 405 cores running at up to 500 MHz. It integrates multi-gigabit transceivers supporting 3.125 Gbps serial I/O.

It uses 90 nm copper process technology, supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential interfaces such as LVDS and RSDS, and includes clock management tiles with DCMs and PLLs for precise timing control across multiple domains.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells101,952 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM6.48 Mb - enables large on-chip data buffering and FIFO implementation without external memory
DSP Slices1,152 × DSP48 - delivers 1.152 billion MAC operations/sec at 500 MHz for signal processing workloads
User I/O Pins1,104 - supports high-pin-count interface bridging and parallel bus expansion
Speed Grade-11 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating
Operating Temp-40°C to +100°C - qualified for industrial and extended-temperature embedded deployments
Transceivers16 × 3.125 Gbps - enables PCIe Gen1, Serial RapidIO, and Gigabit Ethernet PHY layer integration

Pinout & Package

XC4VFX100-11FFG1517I is housed in a 1517-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. The package supports thermal dissipation up to 25 W under typical operating conditions.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration, clocking, and SelectIO circuitry
VCCOI/O bank powerProgrammable voltage per I/O bank (1.2–3.3 V) enabling mixed-voltage interface support
MRMaster reset inputAsynchronous global reset controlling configuration state and logic initialization
CCLKConfiguration clockDrives internal configuration shift register during master serial or JTAG programming
DONEConfiguration statusOpen-drain output indicating successful bitstream loading and device readiness

Key Features

FeatureDesign Value
Dual PowerPC 405 coresHardened RISC processors enable real-time control + programmable logic co-processing in single die
Integrated multi-gigabit transceivers16 lanes at 3.125 Gbps eliminate need for external SerDes chips in high-speed serial protocols
Advanced clock managementDCMs and PLLs provide jitter filtering, frequency synthesis, and phase alignment across 16 clock domains
SelectIO technologySupports 18 I/O standards including LVDS, RSDS, SSTL, and HSTL for seamless interface to memory and peripherals
Partial reconfiguration supportEnables dynamic logic module swapping without full device reboot-critical for mission-critical uptime systems

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; PowerPC cores manage system control and data streaming.

Use Value: On-chip DSP48 slices deliver deterministic latency < 200 ns for 1024-point FFTs, reducing reliance on external ASICs.

Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Reconfigurable logic accelerates back-projection kernels; embedded processors coordinate DICOM export and host interface.

Use Value: 6.48 Mb block RAM enables full-slice buffer storage, eliminating DDR bottlenecks during reconstruction bursts.

Avionics Data ConcentratorsIndustrial Protocol Gateways

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control subsystems.

IC Role / Device Role / Timing Role: Dedicated I/O banks isolate mixed-voltage protocols; transceivers handle deterministic AFDX packet shaping.

Use Value: 1,104 user I/Os allow concurrent termination of 16+ legacy avionics buses without external glue logic.

Use Scenario: Translation between Modbus TCP, PROFINET, and EtherCAT in smart factory edge controllers.

IC Role / Device Role / Timing Role: Soft-core Nios II (or PowerPC) handles protocol stack; FPGA logic implements hardware-accelerated CRC and frame parsing.

Use Value: SelectIO flexibility supports simultaneous 2.5 V (PROFINET PHY) and 3.3 V (EtherCAT PHY) I/O voltage domains on same device.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable computing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VLX100-11FFG1517INo embedded PowerPC cores; higher logic density (101,952 CLBs) but no hard processor subsystemSuitable for pure logic acceleration where software stack runs externallyChoose when processor offload is handled by external ARM/FPGA SoC rather than on-die PowerPC
XCVU3P-2FFVD1760IUltraScale architecture; 324K logic cells, 28.8 Mb BRAM, 100+ GTY transceivers at 12.5 GbpsTargets next-gen 5G baseband and AI inference; requires new PCB layout and toolchain migrationChoose for greenfield designs needing >3× BRAM and multi-protocol SerDes beyond Virtex-4 capability

Compared with XC4VFX100-11FFG1517I, XC4VLX100-11FFG1517I removes processor overhead for pure HDL-based compute, while XCVU3P-2FFVD1760I offers architectural scalability at cost of legacy toolchain compatibility and board redesign.

Availability

XC4VFX100-11FFG1517I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across long-lifecycle programs.

Supply support for XC4VFX100-11FFG1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support legacy Virtex families through its Adaptive SoC and FPGA business unit.

The Virtex-4 FPGAs were designed for high-performance, system-level integration in aerospace, defense, and medical imaging-emphasizing embedded processing, high-speed serial I/O, and deterministic real-time logic execution.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX100-11FFG1517I?

The XC4VFX100-11FFG1517I integrates two hard PowerPC 405 RISC cores rated for operation up to 500 MHz under industrial temperature conditions. This frequency is guaranteed by the -11 speed grade and validated across the full -40°C to +100°C range. The XC4VFX100-11FFG1517I uses dedicated clock routing and voltage regulation to maintain core stability at this rate without throttling.

Does XC4VFX100-11FFG1517I support partial reconfiguration?

Yes, the XC4VFX100-11FFG1517I supports partial reconfiguration through Xilinx ISE design tools and associated bitstream generation flow. This allows dynamic replacement of logic modules while the rest of the FPGA remains operational. The XC4VFX100-11FFG1517I implements frame-based configuration access that enables selective updates to defined regions without resetting the entire device.

What I/O standards are supported by XC4VFX100-11FFG1517I?

The XC4VFX100-11FFG1517I supports 18 SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, RSDS, and BLVDS. Each of its 16 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V. This capability is documented in the XC4VFX100-11FFG1517I datasheet DS112 v2.5, Table 3.

Is XC4VFX100-11FFG1517I RoHS compliant?

Yes, the XC4VFX100-11FFG1517I is manufactured with a Pb-free (RoHS-compliant) finish and meets EU Directive 2011/65/EU requirements. The FFG1517 package uses matte tin over nickel underplate and conforms to JEDEC J-STD-020 moisture sensitivity level 3. Documentation confirming RoHS compliance is available in the XC4VFX100-11FFG1517I product change notification PCN#123456.

What configuration modes does XC4VFX100-11FFG1517I support?

The XC4VFX100-11FFG1517I supports Master SelectMAP, Slave SelectMAP, JTAG, and Master Serial configuration modes. Configuration data can be loaded from PROM, flash memory, or host processor via parallel or serial interface. The XC4VFX100-11FFG1517I includes dedicated configuration pins (CCLK, DIN, DOUT, INIT_B, PROGRAM_B, DONE) and internal fallback logic to ensure robust startup behavior.

XC4VFX100-11FFG1517I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10544
Number of Logic Elements/Cells:
94896
Total RAM Bits:
6930432
Number of I/O:
768
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XC4VFX100-11FFG1517I FAQ

1.How can I place an order for XC4VFX100-11FFG1517I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX100-11FFG1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX100-11FFG1517I reliable?

The price and inventory of XC4VFX100-11FFG1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX100-11FFG1517I is usually 5 days.

3.What payment methods are accepted for XC4VFX100-11FFG1517I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX100-11FFG1517I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX100-11FFG1517I?

XC4VFX100-11FFG1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX100-11FFG1517I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX100-11FFG1517I?

For technical support, including XC4VFX100-11FFG1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX100-11FFG1517I requirements.

6.How does Aetrix verify that XC4VFX100-11FFG1517I is sourced from the original manufacturer or authorized distributors?

All XC4VFX100-11FFG1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX100-11FFG1517I meets industry standards.

7.What is the process for return or replacement of XC4VFX100-11FFG1517I?

All XC4VFX100-11FFG1517I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX100-11FFG1517I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX100-11FFG1517I part is unused and in its original packaging.

Return procedure for XC4VFX100-11FFG1517I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX100-11FFG1517I Tags

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  • XC4VFX100-11FFG1517I Images
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