AMD XC4VFX12-10FF668I
- Part No.:
- XC4VFX12-10FF668I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VFX12-10FF668I.pdf
- Description:
- IC FPGA 320 I/O 668FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,114
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VFX12-10FF668I from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 12,312 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO™ multi-gigabit transceivers operating up to 3.75 Gbps. It is housed in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FF668) package with I/O voltage support of 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. This device targets high-bandwidth communication infrastructure and embedded processing applications.
For engineers reviewing the XC4VFX12-10FF668I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and data rate, embedded processor core availability, logic density, I/O bank voltage flexibility, and thermal performance in compact form factor designs.
Technical Context
The XC4VFX12-10FF668I integrates two PowerPC 405 cores with on-chip memory controllers and dual 10/100/1000 Mbps Ethernet MACs. Its RocketIO transceivers support protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet without external PHYs.
This FPGA uses 90 nm copper process technology, includes SelectIO™ technology for flexible I/O standards, and supports partial reconfiguration. The -10 speed grade guarantees maximum system clock frequency of 500 MHz for internal logic and 312 MHz for I/O interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,312 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Embedded Processors | 2× PowerPC 405 - enables hard-core real-time control and host processing without external CPU |
| RocketIO Transceivers | 4 lanes @ 3.75 Gbps - supports full-duplex serial links for backplane or chip-to-chip interconnect |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct interface to diverse memory, peripherals, and FPGAs |
| Speed Grade | -10 - specifies timing closure at 500 MHz internal clock and 312 MHz I/O clock frequencies |
| Package | FF668 - 668-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
The XC4VFX12-10FF668I is packaged in a 668-pin Fine-Pitch Flip-Chip Ball Grid Array (FF668) with 35 × 35 array, 1.0 mm ball pitch, and thermal lid. Pin functions are organized into I/O banks, configuration banks, dedicated clock inputs, JTAG, and power/ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V regulated input powering FPGA logic fabric and embedded processors |
| VCCAUX | Auxiliary supply | 2.5 V input for configuration circuitry, JTAG, and select I/O banks |
| VCCO | I/O supply per bank | Configurable 1.2–3.3 V per I/O bank enabling mixed-voltage interface design |
| MR | Master reset | Active-low asynchronous reset controlling configuration state machine and logic initialization |
| CCLK | Configuration clock | Input clock for slave-serial or boundary-scan configuration modes |
| M0–M2 | Mode pins | Three-pin encoding selecting configuration source (JTAG, Master SPI, Slave SelectMAP) |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables tightly coupled software-defined control alongside programmable logic, reducing latency vs. external microprocessor solutions |
| RocketIO Transceivers | Eliminates need for discrete SerDes chips in high-speed serial protocols such as PCIe Gen1 and SRIO |
| SelectIO Technology | Supports 18 I/O standards within one device, simplifying board-level signal routing and voltage translation |
| Partial Reconfiguration | Allows dynamic logic updates in operational systems without full device reset or service interruption |
Applications
| Wireless Baseband Processing | Avionics Data Concentrators |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in 3G/4G LTE remote radio units. IC Role / Device Role / Timing Role: Programmable baseband processor integrating DSP blocks, PowerPC control, and high-speed CPRI interface via RocketIO. Use Value: Reduces component count by combining soft-core processing, hardware acceleration, and serial connectivity in single-package solution. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: Deterministic real-time I/O hub with deterministic interrupt latency and time-triggered scheduling via PowerPC cores. Use Value: Meets DO-254 Level A design assurance requirements through traceable RTL and hardened processor subsystem. |
| Medical Imaging Backends | Industrial Protocol Gateways |
Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner systems. IC Role / Device Role / Timing Role: Parallel data processor interfacing with DDR2 memory and handling multiple GigE vision camera streams. Use Value: Achieves >2.5 GB/s memory bandwidth using integrated memory controller and 16-bit DDR2 interface. | Use Scenario: Bridging Modbus TCP, EtherNet/IP, and PROFINET in factory automation edge controllers. IC Role / Device Role / Timing Role: Protocol-aware packet router with hardware-accelerated frame parsing and timestamping. Use Value: Supports sub-100 µs cycle times using deterministic RocketIO transceivers and low-latency PowerPC interrupt response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX20-10FF668I | Higher logic density (19,536 LC), same package and transceiver count | Supports larger algorithm implementations and additional protocol stacks | Choose when additional logic resources or memory depth is required without changing PCB layout |
| XCVU3P-2FFVB2104I | UltraScale+ architecture, 16.3 GT/s transceivers, no embedded PowerPC | Lacks hard processor but offers higher bandwidth, lower power per bit, and PCIe Gen4 support | Prefer for new designs requiring higher serial throughput or modern toolchain compatibility over legacy PowerPC firmware reuse |
Compared with XC4VFX12-10FF668I, the XC4VFX20-10FF668I provides scalable logic headroom in identical footprint, while the XCVU3P-2FFVB2104I trades PowerPC integration for advanced transceiver performance and architectural efficiency-making it suitable for next-generation serial infrastructure where legacy software porting is not required.
Availability
XC4VFX12-10FF668I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics, medical imaging, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX12-10FF668I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-4 FX family was originally designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding embedded systems requiring both software flexibility and hardware acceleration.
FAQ
What is the maximum data rate supported by the RocketIO transceivers in XC4VFX12-10FF668I?
The XC4VFX12-10FF668I features four RocketIO transceivers each capable of 3.75 Gbps operation. This enables full-duplex serial links compliant with PCI Express 1.0, Serial RapidIO 1.x, and Gigabit Ethernet. The transceivers include built-in clock data recovery, elastic buffers, and 8B/10B encoding/decoding logic. XC4VFX12-10FF668I does not support rates above 3.75 Gbps per lane.
Does XC4VFX12-10FF668I include embedded processor cores?
Yes, XC4VFX12-10FF668I integrates two hard-core PowerPC 405 RISC processors running at up to 400 MHz. Each core includes 32 KB instruction and 32 KB data cache, MMU, and debug interface. XC4VFX12-10FF668I supports symmetric multiprocessing and shared memory access via the internal PLB bus. No external microprocessor is needed for control-plane tasks.
What I/O voltage standards are supported by XC4VFX12-10FF668I?
XC4VFX12-10FF668I supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and LVDS across its 444 user I/O pins. Each of the 16 I/O banks can be independently configured for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCO. XC4VFX12-10FF668I does not support 1.0 V or sub-1.2 V I/O standards.
Is XC4VFX12-10FF668I suitable for aerospace applications?
XC4VFX12-10FF668I is rated for industrial temperature range (–40°C to +100°C) and has been used in DO-254-compliant avionics systems. It supports configuration security, CRC-based bitstream integrity checking, and SEU mitigation via EDAC on block RAM. XC4VFX12-10FF668I is not radiation-hardened or QML-V qualified, so system-level qualification is required for flight-critical use.
What configuration modes does XC4VFX12-10FF668I support?
XC4VFX12-10FF668I supports master SPI, slave serial, slave parallel (SelectMAP), and JTAG boundary-scan configuration. Configuration is initiated via mode pins M0–M2 and controlled by CCLK. Bitstream loading can occur from external SPI flash, microcontroller, or JTAG debugger. XC4VFX12-10FF668I does not support passive parallel or BPI configuration modes.
XC4VFX12-10FF668I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1368
- Number of Logic Elements/Cells:
- 12312
- Total RAM Bits:
- 663552
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VFX12-10FF668I FAQ
1.How can I place an order for XC4VFX12-10FF668I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX12-10FF668I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX12-10FF668I reliable?
The price and inventory of XC4VFX12-10FF668I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-10FF668I is usually 5 days.
3.What payment methods are accepted for XC4VFX12-10FF668I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-10FF668I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX12-10FF668I?
XC4VFX12-10FF668I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX12-10FF668I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX12-10FF668I?
For technical support, including XC4VFX12-10FF668I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-10FF668I requirements.
6.How does Aetrix verify that XC4VFX12-10FF668I is sourced from the original manufacturer or authorized distributors?
All XC4VFX12-10FF668I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-10FF668I meets industry standards.
7.What is the process for return or replacement of XC4VFX12-10FF668I?
All XC4VFX12-10FF668I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-10FF668I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX12-10FF668I part is unused and in its original packaging.
Return procedure for XC4VFX12-10FF668I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VFX12-10FF668I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
