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AMD XC4VFX12-10SFG363C
- Part No.:
- XC4VFX12-10SFG363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VFX12-10SFG363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,745
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Product details
Overview
XC4VFX12-10SFG363C from AMD is a Virtex-4 FX12 FPGA featuring 12,288 logic cells, embedded PowerPC 405 RISC processors, 640 Kbits of block RAM, and integrated multi-gigabit transceivers operating up to 3.125 Gbps. It is used in high-performance communication line cards requiring protocol processing, packet classification, and real-time data path acceleration.
For engineers reviewing the XC4VFX12-10SFG363C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), -10 speed grade timing performance, RoHS-compliant 363-pin Fine-Pitch Ball Grid Array (FBGA) package, and compliance with IEEE 1149.1 JTAG boundary-scan test standard.
Technical Context
The XC4VFX12-10SFG363C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hard-wired PowerPC 405 cores for embedded control. It supports SelectIO technology with programmable I/O standards including LVCMOS, LVTTL, SSTL, and HSTL across multiple banks.
Its integrated RocketIO transceivers provide serial connectivity compliant with PCI Express 1.0, Serial RapidIO, and Gigabit Ethernet protocols. The device uses 90 nm copper process technology and supports partial reconfiguration for dynamic function swapping in runtime systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,288 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 640 Kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory interface |
| Max I/O Pins | 240 - supports high-density peripheral interfacing with bank-wise voltage isolation |
| Transceiver Speed | 3.125 Gbps - enables single-lane PCI Express Gen1 and Gigabit Ethernet physical layer implementation |
| Speed Grade | -10 - guarantees worst-case propagation delay and setup/hold timing margins at rated voltage and temperature |
| Package | 363-pin FBGA (SFG363) - 17 mm × 17 mm footprint with 1.0 mm ball pitch, compatible with standard reflow assembly |
| Operating Temp | 0 °C to 85 °C - specifies industrial-grade thermal envelope for sustained operation in telecom equipment |
Pinout & Package
XC4VFX12-10SFG363C is housed in a 363-ball fine-pitch BGA (SFG363) package with 240 user I/Os distributed across 12 I/O banks. Power and ground balls are arranged per Xilinx/AMD FPGA layout conventions to minimize noise and ensure stable core and I/O supply delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | 1.2 V power for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCO_0 | I/O Bank 0 Supply | Configurable 1.2–2.5 V output driver voltage; sets signal swing and interface compatibility |
| MGTAVCC | Transceiver Analog Supply | 1.2 V analog rail for RocketIO transceiver PLL and serializer/deserializer circuits |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 boundary-scan test and in-system programming interface pins |
| CLKIN | Primary Clock Input | Dedicated global clock input supporting differential (LVDS/LVPECL) or single-ended (LVTTL) sources |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 Cores | Two hardened RISC processors enable concurrent firmware execution alongside programmable logic for control-plane offload |
| RocketIO Transceivers | Four 3.125 Gbps serial transceivers support protocol-specific encoding and clock-data recovery without external PHY |
| SelectIO Technology | Per-bank I/O voltage and standard programmability allows mixed-voltage board design and legacy interface bridging |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation-critical for adaptive radio and protocol gateway applications |
| Dedicated DSP Slices | 128 18×18-bit multipliers support real-time filtering, FFT, and modulation/demodulation in baseband processing |
Applications
| Wireless Baseband Processing | Protocol-Aware Network Acceleration |
|---|---|
Use Scenario: Real-time channel coding, MIMO signal processing, and OFDM symbol generation in LTE femtocells and small-cell radios. IC Role / Device Role / Timing Role: FPGA fabric executes custom PHY-layer algorithms while PowerPC cores manage MAC-layer scheduling and RRC signaling. Use Value: Integrated transceivers and DSP slices eliminate need for discrete SerDes and multiplier ICs, reducing latency and board area. | Use Scenario: Deep packet inspection and header modification in enterprise firewalls and carrier-grade routers. IC Role / Device Role / Timing Role: Configurable logic implements parallel pattern matching engines; RocketIO links connect to network processors and switch fabrics. Use Value: On-chip block RAM enables high-speed TCAM-like lookups; -10 speed grade ensures deterministic pipeline timing under full load. |
| Industrial Vision System Controller | Avionics Data Concentrator Unit |
Use Scenario: High-resolution image preprocessing, edge detection, and camera interface bridging in automated optical inspection equipment. IC Role / Device Role / Timing Role: FPGA logic synchronizes multi-camera inputs via LVDS receivers; PowerPC handles USB/Ethernet host communication. Use Value: SelectIO supports both 1.8 V CMOS image sensors and 2.5 V frame grabber interfaces in same design without level shifters. | Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation with time-stamped data forwarding in flight control subsystems. IC Role / Device Role / Timing Role: Dedicated I/O banks isolate mixed-voltage avionics buses; internal clock management ensures deterministic jitter < 150 ps RMS. Use Value: JTAG boundary-scan and built-in self-test (BIST) support DO-254 compliance verification and field diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integration FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC4VLX15-10SFG363C | No embedded PowerPC cores or RocketIO transceivers; higher logic density (15,000 CLBs); same package and speed grade | Suitable for pure logic-intensive tasks without serial protocol handling or embedded processing | Select when system-level software execution is handled externally and transceiver integration is unnecessary |
| Xilinx XC5VLX30T-1FF324C | Virtex-5 family; 30,000 logic cells; 6.5 Gbps transceivers; different 324-pin FF package; no PowerPC cores | Targets next-generation designs requiring higher bandwidth and lower power per logic cell | Choose for migration paths where PCIe Gen2 or SATA 3 Gbps interfaces are required and board redesign is acceptable |
Compared with XC4VFX12-10SFG363C, the XC4VLX15-10SFG363C offers more logic but lacks embedded processors and transceivers-making it less suitable for protocol-aware acceleration. The XC5VLX30T-1FF324C delivers higher serial bandwidth and newer architecture but requires PCB redesign and lacks PowerPC co-processing capability.
Availability
XC4VFX12-10SFG363C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and avionics applications requiring stable component supply and long-term lifecycle support.
Supply support for XC4VFX12-10SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-4 FX family was originally designed by Xilinx to integrate programmable logic with hard processor cores and high-speed serial I/O for embedded networking and signal processing systems.
FAQ
What is the maximum data rate supported by the transceivers in XC4VFX12-10SFG363C?
The XC4VFX12-10SFG363C integrates RocketIO transceivers rated for a maximum data rate of 3.125 Gbps per lane. This supports PCI Express 1.0 x1, Serial RapidIO 1x, and Gigabit Ethernet physical layers. The transceivers include built-in clock-data recovery and 8B/10B encoding/decoding logic. XC4VFX12-10SFG363C does not support rates above 3.125 Gbps-even with external equalization or retiming.
Does XC4VFX12-10SFG363C include embedded processor cores?
Yes, XC4VFX12-10SFG363C contains two hard-core PowerPC 405 RISC processors running at up to 400 MHz. These are fully compliant with the PowerPC Book III specification and support cache-coherent memory access via the internal PLB bus. XC4VFX12-10SFG363C enables tightly coupled software-hardware partitioning where control-plane tasks execute on the PowerPC while data-plane functions run in FPGA fabric.
What I/O standards are supported by XC4VFX12-10SFG363C?
XC4VFX12-10SFG363C supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and differential standards including LVDS, BLVDS, and RSDS across its 12 I/O banks. Each bank operates independently at 1.2 V, 1.5 V, 1.8 V, or 2.5 V. XC4VFX12-10SFG363C does not support 3.3 V I/O or DDR4-compatible signaling.
Is XC4VFX12-10SFG363C pin-compatible with other Virtex-4 devices?
No, XC4VFX12-10SFG363C is not pin-compatible with other Virtex-4 devices-even those in the same SFG363 package. Pin assignments differ between FX, LX, and SX sub-families due to distinct I/O bank layouts and dedicated resource placement (e.g., RocketIO locations). XC4VFX12-10SFG363C requires its own validated PCB layout and cannot be substituted without hardware revision.
What configuration modes does XC4VFX12-10SFG363C support?
XC4VFX12-10SFG363C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration bitstreams can be loaded from PROM (e.g., XCFxxP series), microprocessor, or boundary-scan chain. XC4VFX12-10SFG363C does not support passive parallel or system-level BPI configuration modes found in later Virtex families.
XC4VFX12-10SFG363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1368
- Number of Logic Elements/Cells:
- 12312
- Total RAM Bits:
- 663552
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VFX12-10SFG363C FAQ
1.How can I place an order for XC4VFX12-10SFG363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX12-10SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX12-10SFG363C reliable?
The price and inventory of XC4VFX12-10SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-10SFG363C is usually 5 days.
3.What payment methods are accepted for XC4VFX12-10SFG363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-10SFG363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX12-10SFG363C?
XC4VFX12-10SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX12-10SFG363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX12-10SFG363C?
For technical support, including XC4VFX12-10SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-10SFG363C requirements.
6.How does Aetrix verify that XC4VFX12-10SFG363C is sourced from the original manufacturer or authorized distributors?
All XC4VFX12-10SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-10SFG363C meets industry standards.
7.What is the process for return or replacement of XC4VFX12-10SFG363C?
All XC4VFX12-10SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-10SFG363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX12-10SFG363C part is unused and in its original packaging.
Return procedure for XC4VFX12-10SFG363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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