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AMD XC4VFX12-10SFG363I
- Part No.:
- XC4VFX12-10SFG363I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VFX12-10SFG363I.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,978
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Product details
Overview
XC4VFX12-10SFG363I from AMD is a Virtex-4 FX family FPGA featuring 12,312 logic cells, embedded PowerPC 405 RISC processors, and integrated multi-gigabit transceivers operating up to 3.125 Gbps. It is packaged in a 363-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and supports -40°C to +100°C industrial temperature operation.
For engineers reviewing the XC4VFX12-10SFG363I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and configuration interface options (SelectMAP, JTAG, serial).
Technical Context
The XC4VFX12-10SFG363I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (1,728 kbits), and dedicated DSP48 slices for arithmetic-intensive tasks. It integrates two hard-core PowerPC 405 processors clocked up to 400 MHz and eight RocketIO™ transceivers supporting protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet.
Configuration is performed via Master SelectMAP mode using external PROM or microprocessor, with JTAG boundary-scan support for testing. The device uses 1.2 V core voltage and supports multiple I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and RSDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,312 - determines maximum combinational/sequential logic capacity for custom digital design implementation |
| Block RAM | 1,728 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external memory interface |
| Embedded Processors | 2 × PowerPC 405 - enables soft real-time control, boot management, or host-side firmware execution alongside programmable logic |
| RocketIO Transceivers | 8 lanes, up to 3.125 Gbps - supports high-speed serial interconnects including PCIe Gen1 x1 and SRIO 1x |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS - allows direct interfacing with diverse memory, peripherals, and FPGAs across voltage domains |
| Operating Temperature | -40°C to +100°C - qualified for industrial and extended-temperature embedded applications without derating |
| Core Voltage | 1.2 V ±3% - requires precision low-noise core regulator; impacts power efficiency and thermal design |
Pinout & Package
XC4VFX12-10SFG363I is housed in a 363-pin Fine-Pitch Ball Grid Array (SFG) package with 0.8 mm ball pitch, 23 mm × 23 mm body size, and standard RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to internal logic and CLBs; requires local decoupling and low-ESR capacitors |
| VCCAUX | Auxiliary power supply | Provides 2.5 V to configuration circuitry, JTAG, and select I/O banks; shared across multiple banks |
| VCCO | I/O bank power | Bank-specific voltage (1.2–2.5 V); sets output swing and input threshold for associated I/O pins |
| M0–M2 | Configuration mode select | Determines startup configuration method (e.g., Master SelectMAP, JTAG, Serial); pulled during power-up |
| CCLK | Configuration clock | Drives internal configuration shift register during SelectMAP or slave parallel modes |
| DIN / DOUT | Configuration data I/O | Serial data path for bitstream loading (DIN) and readback (DOUT) in SelectMAP mode |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 cores | Enables deterministic real-time processing co-resident with programmable logic, eliminating need for external microcontroller |
| RocketIO transceivers | Integrates SerDes with built-in encoding/decoding, clock recovery, and elastic buffers-reducing external PHY count and board area |
| SelectMAP configuration interface | Supports fast parallel bitstream loading from microprocessor or flash memory, enabling field-upgradable designs |
| Multi-voltage I/O banks | Allows independent voltage assignment per bank, simplifying interface to mixed-voltage systems (e.g., DDR2 memory + 3.3 V peripherals) |
| JTAG boundary-scan | Permits IEEE 1149.1-compliant testing and in-system programming without requiring dedicated test fixtures |
Applications
| Wireless Baseband Processing | Industrial Protocol Gateway |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in 3G/LTE remote radio units. IC Role / Device Role / Timing Role: FPGA fabric handles signal processing pipelines while PowerPC cores manage MAC-layer scheduling and system control. Use Value: Integrated transceivers interface directly to RFICs at 3.125 Gbps; dual PowerPC cores offload protocol stack execution from main host. | Use Scenario: Bridging Modbus RTU, PROFIBUS, and EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: XC4VFX12-10SFG363I acts as protocol translation engine and real-time scheduler with deterministic latency. Use Value: Multi-standard I/O banks interface simultaneously to legacy 5 V RS-485 and 2.5 V EtherCAT PHYs; embedded processors run protocol stacks natively. |
| Medical Imaging Data Acquisition | Aerospace Data Concentrator |
Use Scenario: High-throughput digitization and preprocessing of ultrasound echo streams before GPU transfer. IC Role / Device Role / Timing Role: XC4VFX12-10SFG363I performs real-time beamforming and noise filtering in programmable logic; PowerPC manages USB/Ethernet data export. Use Value: Block RAM buffers raw ADC data at >100 MSPS; RocketIO links to host PC via PCIe x1 for low-latency streaming. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete sensor inputs in UAV flight control units. IC Role / Device Role / Timing Role: XC4VFX12-10SFG363I serves as deterministic time-triggered communication hub with hardware timestamping. Use Value: Industrial temperature rating ensures reliability in uncontrolled avionics bays; JTAG enables in-field reconfiguration after mission updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC4VFX20-10SFG363I | Higher logic capacity (19,536 CLBs), same package and transceiver count; larger block RAM (2,880 kbits) | Better suited for complex signal processing or multi-protocol convergence where XC4VFX12-10SFG363I resource limits are exceeded | Select when additional logic density or memory bandwidth is required without changing PCB layout |
| Xilinx XC4VLX25-10SFG363I | No embedded PowerPC cores; higher logic count (24,192 CLBs); same I/O and transceiver specs but lacks processor subsystem | Applicable where pure programmable logic is preferred and external microcontroller handles control tasks | Choose when deterministic software execution is handled externally and FPGA resources must be maximized for datapath logic |
Compared with XC4VFX12-10SFG363I, the XC4VFX20-10SFG363I offers scalable logic and memory headroom within identical mechanical and electrical interfaces, while the XC4VLX25-10SFG363I trades processor integration for greater fabric capacity-enabling different system partitioning strategies.
Availability
XC4VFX12-10SFG363I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and medical imaging systems requiring stable component supply across long product lifecycles.
Supply support for XC4VFX12-10SFG363I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (formerly Xilinx) designs high-performance adaptive computing platforms for aerospace, defense, communications, and industrial markets.
The Virtex-4 FX family targets embedded systems needing tightly coupled processing and programmable logic, with emphasis on high-speed serial connectivity and real-time determinism.
FAQ
What is the maximum supported transceiver data rate for XC4VFX12-10SFG363I?
The XC4VFX12-10SFG363I supports RocketIO transceivers rated up to 3.125 Gbps per lane. This rate is validated under specified operating conditions including junction temperature ≤100°C and proper reference clock jitter compliance. The XC4VFX12-10SFG363I does not support rates beyond 3.125 Gbps, and higher-speed protocols require external retiming or a newer-generation FPGA.
Does XC4VFX12-10SFG363I include embedded microprocessors?
Yes, XC4VFX12-10SFG363I integrates two hard-core PowerPC 405 RISC processors. Each operates up to 400 MHz and includes 32 kB instruction cache and 32 kB data cache. These processors are fully functional upon configuration and support full JTAG debug access. The XC4VFX12-10SFG363I leverages this dual-core capability for concurrent real-time control and data management tasks.
What configuration modes are supported by XC4VFX12-10SFG363I?
XC4VFX12-10SFG363I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables autonomous loading from external parallel flash; JTAG is used for programming and debugging. The XC4VFX12-10SFG363I does not support passive serial or BPI configuration variants.
Is XC4VFX12-10SFG363I qualified for industrial temperature operation?
Yes, XC4VFX12-10SFG363I is specified for operation from -40°C to +100°C ambient temperature. This industrial-grade qualification is confirmed in the official Virtex-4 DC and Switching Characteristics datasheet (DS112). The XC4VFX12-10SFG363I meets thermal requirements for enclosed, fanless industrial enclosures without active cooling.
What I/O standards are supported on XC4VFX12-10SFG363I banks?
XC4VFX12-10SFG363I supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, LVDS, RSDS, and differential HSTL across its configurable I/O banks. Each bank is independently powered (VCCO), allowing mixed-voltage operation. The XC4VFX12-10SFG363I does not support PCI-X, GTL, or BLVDS standards.
XC4VFX12-10SFG363I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1368
- Number of Logic Elements/Cells:
- 12312
- Total RAM Bits:
- 663552
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VFX12-10SFG363I FAQ
1.How can I place an order for XC4VFX12-10SFG363I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX12-10SFG363I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX12-10SFG363I reliable?
The price and inventory of XC4VFX12-10SFG363I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-10SFG363I is usually 5 days.
3.What payment methods are accepted for XC4VFX12-10SFG363I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-10SFG363I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX12-10SFG363I?
XC4VFX12-10SFG363I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX12-10SFG363I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX12-10SFG363I?
For technical support, including XC4VFX12-10SFG363I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-10SFG363I requirements.
6.How does Aetrix verify that XC4VFX12-10SFG363I is sourced from the original manufacturer or authorized distributors?
All XC4VFX12-10SFG363I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-10SFG363I meets industry standards.
7.What is the process for return or replacement of XC4VFX12-10SFG363I?
All XC4VFX12-10SFG363I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-10SFG363I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX12-10SFG363I part is unused and in its original packaging.
Return procedure for XC4VFX12-10SFG363I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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