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AMD XC4VFX12-11FFG668C
- Part No.:
- XC4VFX12-11FFG668C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 668-BBGA, FCBGA
- Datasheet:
-
XC4VFX12-11FFG668C.pdf
- Description:
- IC FPGA 320 I/O 668FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,077
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Product details
Overview
XC4VFX12-11FFG668C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 12,312 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO™ multi-gigabit transceivers operating up to 3.75 Gbps. It is housed in a 668-pin Fine-Pitch Flip-Chip BGA (FFG) package with 0.8 mm pitch and supports -11 speed grade timing.
For engineers reviewing the XC4VFX12-11FFG668C datasheet, pinout, applications, or equivalent options, key selection considerations include embedded processor count, transceiver lane count and data rate, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal design power (TDP) for high-speed serial interface deployment.
Technical Context
The XC4VFX12-11FFG668C integrates two PowerPC 405 cores with on-chip memory, dual 18×18 multipliers per DSP slice, and up to 24 RocketIO transceiver channels supporting protocols including PCI Express Gen1, Serial RapidIO, and Gigabit Ethernet. Its SelectIO™ technology supports differential standards such as LVDS, RSDS, and HSTL.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption supported through AES-128. The device uses 90 nm copper CMOS process technology and operates over commercial temperature range (0°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,312 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Embedded Processors | 2 × PowerPC 405 - enables hard real-time control and software-defined subsystems without external CPU |
| RocketIO Transceivers | 24 lanes, up to 3.75 Gbps - supports multi-protocol serial connectivity including PCIe x1 and SRIO x4 |
| I/O Standards | LVDS, RSDS, HSTL, SSTL, GTL - allows direct interfacing with diverse memory, ADC/DAC, and ASIC peripherals |
| Speed Grade | -11 - guarantees worst-case timing performance at highest specified clock frequencies for critical paths |
| Package | 668-pin FFG BGA, 0.8 mm pitch - requires fine-pitch PCB layout and controlled-impedance routing for signal integrity |
Pinout & Package
XC4VFX12-11FFG668C is packaged in a 668-pin Fine-Pitch Flip-Chip BGA (FFG) with 27 × 27 array, 0.8 mm ball pitch, and 35 mm × 35 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% required for FPGA fabric and embedded processor logic |
| VCCAUX | Auxiliary supply | 2.5 V ±5% powers configuration circuitry, SelectIO banks, and PLLs |
| VCCO | I/O supply | Configurable per bank (1.2 V/1.5 V/1.8 V/2.5 V) to match connected peripheral voltage levels |
| M0–M2 | Mode pins | Set configuration mode (JTAG, Master SelectMAP, Slave SelectMAP, etc.) at power-up |
| CLKIN | Primary clock input | Drives internal DCMs for clock synthesis, phase alignment, and jitter reduction |
| INIT_B | Configuration status | Active-low open-drain output indicating bitstream loading progress and CRC pass/fail |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores | Enables concurrent firmware execution and hardware acceleration co-design in single-package SoC architecture |
| RocketIO transceivers | Eliminates need for external SerDes chips in high-speed backplane and optical interface designs |
| SelectIO technology | Reduces board-level level-shifting components by supporting mixed-voltage I/O banks |
| DCM clock management | Provides deterministic clock deskew, frequency synthesis, and duty-cycle correction without external PLLs |
| AES-128 bitstream encryption | Protects intellectual property against reverse engineering and unauthorized reprogramming |
Applications
| Wireless Baseband Processing | Defense Radar Signal Processing |
|---|---|
Use Scenario: Real-time modulation/demodulation, channel coding, and MIMO processing in LTE and 5G base stations. IC Role / Device Role / Timing Role: Configurable digital signal processor with embedded CPU for protocol stack handling and hardware-accelerated PHY layer functions. Use Value: Combines soft-core flexibility with hard PowerPC execution to meet strict latency budgets while reducing component count. | Use Scenario: Pulse-Doppler processing, beamforming, and synthetic aperture radar (SAR) image generation in airborne platforms. IC Role / Device Role / Timing Role: High-throughput data path engine synchronizing ADC sampling, FFT computation, and DMA transfers across multiple RF channels. Use Value: RocketIO transceivers interface directly with high-speed ADCs and DACs, avoiding serialization bottlenecks in wideband IF digitization. |
| Industrial Machine Vision | Medical Imaging Data Acquisition |
Use Scenario: Sub-millisecond image preprocessing, feature extraction, and real-time defect classification on factory-floor inspection systems. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator tightly coupled with PowerPC for decision logic and network communication. Use Value: On-chip memory and low-latency interconnect reduce off-chip bandwidth demand, enabling 100+ FPS processing at full HD resolution. | Use Scenario: Time-of-flight PET scanner front-end, where synchronized acquisition of thousands of detector channels must be timestamped with sub-nanosecond precision. IC Role / Device Role / Timing Role: Precision timing hub distributing low-jitter clocks to ASIC-based TDCs and managing high-volume event streaming via RocketIO links. Use Value: Integrated DCMs and transceivers eliminate external clock fanout ICs and serializer chips, improving system MTBF. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX20-11FFG668C | Higher logic capacity (19,576 LC), same package and speed grade | Supports larger algorithm implementations and additional protocol stacks | Choose when XC4VFX12-11FFG668C resource utilization exceeds 85% in place-and-route |
| XC5VLX30-1FF676C | Virtex-5 architecture, 30,000 logic cells, no embedded PowerPC, higher transceiver count (4 GTX) | Lacks hard processor but offers superior DSP density and lower static power | Prefer XC5VLX30-1FF676C for compute-intensive, non-processor-centric designs requiring higher throughput per watt |
Compared with XC4VFX12-11FFG668C, XC4VFX20-11FFG668C provides headroom for design growth within identical footprint and thermal envelope, while XC5VLX30-1FF676C trades processor integration for greater logic and DSP resources-making it suitable for pure hardware acceleration roles where software control is handled externally.
Availability
XC4VFX12-11FFG668C is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, industrial automation, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XC4VFX12-11FFG668C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, heterogeneous computing applications.
The Virtex-4 FX family-including XC4VFX12-11FFG668C-was designed for embedded systems requiring both programmable logic and hardened processor subsystems, targeting high-speed serial communications and real-time signal processing.
FAQ
What is the maximum data rate supported by RocketIO transceivers in XC4VFX12-11FFG668C?
The XC4VFX12-11FFG668C RocketIO transceivers support a maximum line rate of 3.75 Gbps per lane. This enables compliance with PCI Express Gen1 (2.5 Gbps), Serial RapidIO (3.125 Gbps), and Gigabit Ethernet (1.25 Gbps) physical layers. Actual achievable throughput depends on encoding overhead and link training success.
Does XC4VFX12-11FFG668C include on-chip memory for the PowerPC 405 processors?
Yes, XC4VFX12-11FFG668C integrates 128 KB of on-chip Block RAM shared between the two PowerPC 405 cores. Each core also has dedicated 32 KB instruction and 32 KB data caches. This eliminates dependency on external memory for boot code and real-time task buffers.
What configuration modes does XC4VFX12-11FFG668C support?
XC4VFX12-11FFG668C supports JTAG, Master SelectMAP, Slave SelectMAP, and Serial PROM configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream can be loaded from parallel flash, serial SPI PROM, or host processor via SelectMAP interface.
Is XC4VFX12-11FFG668C RoHS compliant and lead-free?
Yes, XC4VFX12-11FFG668C is RoHS-compliant and features lead-free (Pb-free) packaging. The FFG668 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
What is the operating temperature range for XC4VFX12-11FFG668C?
XC4VFX12-11FFG668C is rated for commercial temperature operation from 0°C to +85°C ambient. This applies to the FFG668 package variant with standard thermal characteristics and is validated under JEDEC JESD22-A104 reliability testing conditions.
XC4VFX12-11FFG668C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 668-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1368
- Number of Logic Elements/Cells:
- 12312
- Total RAM Bits:
- 663552
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 668-FCBGA (27x27)
XC4VFX12-11FFG668C FAQ
1.How can I place an order for XC4VFX12-11FFG668C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX12-11FFG668C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX12-11FFG668C reliable?
The price and inventory of XC4VFX12-11FFG668C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-11FFG668C is usually 5 days.
3.What payment methods are accepted for XC4VFX12-11FFG668C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-11FFG668C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX12-11FFG668C?
XC4VFX12-11FFG668C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX12-11FFG668C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX12-11FFG668C?
For technical support, including XC4VFX12-11FFG668C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-11FFG668C requirements.
6.How does Aetrix verify that XC4VFX12-11FFG668C is sourced from the original manufacturer or authorized distributors?
All XC4VFX12-11FFG668C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-11FFG668C meets industry standards.
7.What is the process for return or replacement of XC4VFX12-11FFG668C?
All XC4VFX12-11FFG668C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-11FFG668C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX12-11FFG668C part is unused and in its original packaging.
Return procedure for XC4VFX12-11FFG668C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VFX12-11FFG668C Tags
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