AMD XC4VFX12-11SFG363C
- Part No.:
- XC4VFX12-11SFG363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VFX12-11SFG363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,814
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VFX12-11SFG363C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 12,312 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO multi-gigabit transceivers operating up to 3.125 Gbps. It is housed in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch and supports -11 speed grade timing performance. This device is used in high-speed serial communication systems requiring protocol acceleration and real-time processing.
For engineers reviewing the XC4VFX12-11SFG363C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal design requirements for SFG363 packaging.
Technical Context
The XC4VFX12-11SFG363C integrates two PowerPC 405 cores with on-chip memory, dual 18×18 multipliers per DSP slice, and up to 16 RocketIO transceiver channels supporting protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet. Its SelectIO technology supports differential standards such as LVDS, RSDS, and HSTL across 240 user I/Os.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption supported through AES-128. The device operates within industrial temperature range (0°C to 85°C) and requires multiple supply rails: VCCINT = 1.2 V, VCCAUX = 2.5 V, and VCCO per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,312 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Embedded Processors | 2× PowerPC 405 - enables hard-core embedded software execution without external CPU |
| RocketIO Transceivers | 16 lanes @ 3.125 Gbps - supports multi-protocol serial interfaces including PCIe Gen1 and SRIO |
| User I/O Pins | 240 - configurable as single-ended or differential with bank-specific voltage support |
| Speed Grade | -11 - guarantees timing closure at highest specified clock frequencies for this device variant |
| Package | SFG363 - 363-pin Fine-Pitch BGA, 19×19 mm body, 0.8 mm ball pitch, RoHS-compliant |
| Operating Temperature | 0°C to +85°C - qualified for industrial environment deployment without extended thermal management |
Pinout & Package
The XC4VFX12-11SFG363C is packaged in a 363-pin Fine-Pitch Ball Grid Array (SFG363) with 19×19 array, 0.8 mm pitch, and thermal pad exposed on underside. Pin assignments follow Xilinx Virtex-4 FX pinout conventions, with dedicated configuration, clock, JTAG, and transceiver reference pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master SelectMAP mode |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 boundary-scan and debug access to internal logic and configuration registers |
| GTCLK0/1 | Transceiver Reference Clock | Dedicated low-jitter inputs for RocketIO transceiver PLLs |
| VCCINT | Core Supply | 1.2 V supply for FPGA fabric and embedded processor logic |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 Cores | Enables hybrid hardware-software system-on-chip implementation without external microprocessor |
| RocketIO Multi-Gigabit Transceivers | Reduces need for external SerDes ICs and simplifies board-level high-speed serial interface design |
| SelectIO Technology | Allows mixed-voltage I/O banks enabling direct interfacing with diverse peripheral voltage levels |
| AES-128 Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of programmed logic |
| Dual-Register Flip-Flops per Slice | Improves timing performance and resource utilization in pipelined datapath designs |
Applications
| PCI Express Endpoint | Gigabit Ethernet Line Card |
|---|---|
Use Scenario: Add-in card implementing PCIe x1 or x4 endpoint functionality in server or test equipment. IC Role / Device Role / Timing Role: FPGA acts as protocol-aware bridge between host CPU and custom peripherals, handling TLP generation and flow control. Use Value: XC4VFX12-11SFG363C provides integrated PCIe endpoint logic, RocketIO transceivers, and PowerPC core for firmware-based link management. | Use Scenario: Front-panel 1000BASE-X optical interface module in telecom aggregation switches. IC Role / Device Role / Timing Role: Performs physical coding sublayer (PCS) and reconciliation sublayer (RS) functions with SERDES alignment. Use Value: XC4VFX12-11SFG363C delivers deterministic latency, embedded processor for MAC management, and 2.5 Gbps transceiver compliance with IEEE 802.3z. |
| Software-Defined Radio Baseband | Industrial Vision Processing Node |
Use Scenario: Reconfigurable baseband processor in wideband wireless infrastructure supporting LTE and WiMAX waveforms. IC Role / Device Role / Timing Role: Implements channelization, FFT/IFFT, filtering, and modulation/demodulation in programmable logic. Use Value: XC4VFX12-11SFG363C offers DSP slices for real-time signal processing and PowerPC core for control-plane tasks and waveform scheduling. | Use Scenario: Embedded vision node performing real-time image preprocessing and feature extraction in factory automation cameras. IC Role / Device Role / Timing Role: Captures parallel CMOS/CCD sensor data, applies noise reduction and edge detection, and streams processed frames over GigE. Use Value: XC4VFX12-11SFG363C provides high-bandwidth I/O for sensor interface, DSP resources for pixel-level operations, and GigE transceivers for deterministic frame delivery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based protocol acceleration and embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX20-11FF668C | Higher logic density (19,576 LC), 20 RocketIO lanes, larger FF668 package (27×27 mm) | Supports wider PCIe x8 links and higher channel-count SDR systems | Choose when additional logic, transceiver count, or I/O bandwidth is required beyond XC4VFX12-11SFG363C capacity |
| XC5VLX30-2FF324C | Virtex-5 architecture, no embedded PowerPC, 30k logic cells, 6 RocketIO GTPs, lower power consumption | Better suited for logic-intensive, non-processor-centric designs with moderate serial I/O needs | Choose when PowerPC integration is unnecessary and lower static power or newer process node is preferred |
Compared with XC4VFX12-11SFG363C, XC4VFX20-11FF668C scales up transceiver count and logic for broader serial interconnects, while XC5VLX30-2FF324C trades processor integration for improved logic efficiency and reduced power-making each suitable for distinct architectural trade-offs in embedded FPGA systems.
Availability
XC4VFX12-11SFG363C is available at Aetrix Electronics and suitable for high-speed serial interface design, embedded vision processing, and protocol acceleration applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC4VFX12-11SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Virtex-4 FX family was designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for communications infrastructure and embedded computing.
FAQ
What is the maximum data rate supported by the RocketIO transceivers in XC4VFX12-11SFG363C?
The XC4VFX12-11SFG363C RocketIO transceivers support a maximum line rate of 3.125 Gbps per lane. This enables compliance with PCI Express 1.0, Serial RapidIO 1.x, and Gigabit Ethernet (1000BASE-X) standards. The transceivers include built-in encoding/decoding, clock data recovery, and elastic buffers to maintain signal integrity at this rate.
Does XC4VFX12-11SFG363C include embedded processor cores?
Yes, XC4VFX12-11SFG363C integrates two hard-core PowerPC 405 RISC processors with 32 kB instruction and 32 kB data cache each. These cores run independently and can execute bare-metal firmware or lightweight RTOS environments, enabling tightly coupled control-plane logic alongside programmable fabric data paths.
What configuration modes does XC4VFX12-11SFG363C support?
XC4VFX12-11SFG363C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP uses an internal oscillator to drive configuration clocks, while JTAG is used for debugging and in-system programming. Configuration bitstreams may be stored in external SPI flash or loaded dynamically via processor interface.
What are the power supply requirements for XC4VFX12-11SFG363C?
XC4VFX12-11SFG363C requires three primary supply rails: VCCINT = 1.2 V ±3% for core logic, VCCAUX = 2.5 V ±5% for auxiliary circuitry including JTAG and configuration logic, and bank-specific VCCO voltages (1.2 V, 1.5 V, 1.8 V, or 2.5 V) for I/O signaling. Decoupling must meet Xilinx layout guidelines to ensure stable operation under dynamic switching conditions.
Is XC4VFX12-11SFG363C compatible with Xilinx ISE Design Suite?
Yes, XC4VFX12-11SFG363C is fully supported by Xilinx ISE 14.7 and earlier versions. Synthesis, place-and-route, timing analysis, and bitstream generation workflows are validated for this device. While Vivado does not support Virtex-4, legacy ISE toolchains remain functional for maintenance and re-spin projects using XC4VFX12-11SFG363C.
XC4VFX12-11SFG363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1368
- Number of Logic Elements/Cells:
- 12312
- Total RAM Bits:
- 663552
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VFX12-11SFG363C FAQ
1.How can I place an order for XC4VFX12-11SFG363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX12-11SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX12-11SFG363C reliable?
The price and inventory of XC4VFX12-11SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-11SFG363C is usually 5 days.
3.What payment methods are accepted for XC4VFX12-11SFG363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-11SFG363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX12-11SFG363C?
XC4VFX12-11SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX12-11SFG363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX12-11SFG363C?
For technical support, including XC4VFX12-11SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-11SFG363C requirements.
6.How does Aetrix verify that XC4VFX12-11SFG363C is sourced from the original manufacturer or authorized distributors?
All XC4VFX12-11SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-11SFG363C meets industry standards.
7.What is the process for return or replacement of XC4VFX12-11SFG363C?
All XC4VFX12-11SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-11SFG363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX12-11SFG363C part is unused and in its original packaging.
Return procedure for XC4VFX12-11SFG363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VFX12-11SFG363C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
