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AMD XC4VFX12-11SFG363C

Part No.:
XC4VFX12-11SFG363C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
363-FBGA, FCBGA
Datasheet:
AetrixXC4VFX12-11SFG363C.pdf
Description:
IC FPGA 240 I/O 363FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,814

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Product details

Overview

XC4VFX12-11SFG363C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 12,312 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO multi-gigabit transceivers operating up to 3.125 Gbps. It is housed in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch and supports -11 speed grade timing performance. This device is used in high-speed serial communication systems requiring protocol acceleration and real-time processing.

For engineers reviewing the XC4VFX12-11SFG363C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal design requirements for SFG363 packaging.

Technical Context

The XC4VFX12-11SFG363C integrates two PowerPC 405 cores with on-chip memory, dual 18×18 multipliers per DSP slice, and up to 16 RocketIO transceiver channels supporting protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet. Its SelectIO technology supports differential standards such as LVDS, RSDS, and HSTL across 240 user I/Os.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption supported through AES-128. The device operates within industrial temperature range (0°C to 85°C) and requires multiple supply rails: VCCINT = 1.2 V, VCCAUX = 2.5 V, and VCCO per bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells12,312 - determines maximum combinational and sequential logic capacity for custom digital functions
Embedded Processors2× PowerPC 405 - enables hard-core embedded software execution without external CPU
RocketIO Transceivers16 lanes @ 3.125 Gbps - supports multi-protocol serial interfaces including PCIe Gen1 and SRIO
User I/O Pins240 - configurable as single-ended or differential with bank-specific voltage support
Speed Grade-11 - guarantees timing closure at highest specified clock frequencies for this device variant
PackageSFG363 - 363-pin Fine-Pitch BGA, 19×19 mm body, 0.8 mm ball pitch, RoHS-compliant
Operating Temperature0°C to +85°C - qualified for industrial environment deployment without extended thermal management

Pinout & Package

The XC4VFX12-11SFG363C is packaged in a 363-pin Fine-Pitch Ball Grid Array (SFG363) with 19×19 array, 0.8 mm pitch, and thermal pad exposed on underside. Pin assignments follow Xilinx Virtex-4 FX pinout conventions, with dedicated configuration, clock, JTAG, and transceiver reference pins.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift register during Master SelectMAP mode
DINConfiguration Data InputSerial data input for bitstream loading in Master SelectMAP mode
PROGRAM_BConfiguration ResetActive-low signal that clears configuration memory and initiates reconfiguration
TCK/TMS/TDI/TDOJTAG InterfaceIEEE 1149.1 boundary-scan and debug access to internal logic and configuration registers
GTCLK0/1Transceiver Reference ClockDedicated low-jitter inputs for RocketIO transceiver PLLs
VCCINTCore Supply1.2 V supply for FPGA fabric and embedded processor logic

Key Features

FeatureDesign Value
Integrated PowerPC 405 CoresEnables hybrid hardware-software system-on-chip implementation without external microprocessor
RocketIO Multi-Gigabit TransceiversReduces need for external SerDes ICs and simplifies board-level high-speed serial interface design
SelectIO TechnologyAllows mixed-voltage I/O banks enabling direct interfacing with diverse peripheral voltage levels
AES-128 Bitstream EncryptionProtects intellectual property by preventing unauthorized readback or cloning of programmed logic
Dual-Register Flip-Flops per SliceImproves timing performance and resource utilization in pipelined datapath designs

Applications

PCI Express EndpointGigabit Ethernet Line Card

Use Scenario: Add-in card implementing PCIe x1 or x4 endpoint functionality in server or test equipment.

IC Role / Device Role / Timing Role: FPGA acts as protocol-aware bridge between host CPU and custom peripherals, handling TLP generation and flow control.

Use Value: XC4VFX12-11SFG363C provides integrated PCIe endpoint logic, RocketIO transceivers, and PowerPC core for firmware-based link management.

Use Scenario: Front-panel 1000BASE-X optical interface module in telecom aggregation switches.

IC Role / Device Role / Timing Role: Performs physical coding sublayer (PCS) and reconciliation sublayer (RS) functions with SERDES alignment.

Use Value: XC4VFX12-11SFG363C delivers deterministic latency, embedded processor for MAC management, and 2.5 Gbps transceiver compliance with IEEE 802.3z.

Software-Defined Radio BasebandIndustrial Vision Processing Node

Use Scenario: Reconfigurable baseband processor in wideband wireless infrastructure supporting LTE and WiMAX waveforms.

IC Role / Device Role / Timing Role: Implements channelization, FFT/IFFT, filtering, and modulation/demodulation in programmable logic.

Use Value: XC4VFX12-11SFG363C offers DSP slices for real-time signal processing and PowerPC core for control-plane tasks and waveform scheduling.

Use Scenario: Embedded vision node performing real-time image preprocessing and feature extraction in factory automation cameras.

IC Role / Device Role / Timing Role: Captures parallel CMOS/CCD sensor data, applies noise reduction and edge detection, and streams processed frames over GigE.

Use Value: XC4VFX12-11SFG363C provides high-bandwidth I/O for sensor interface, DSP resources for pixel-level operations, and GigE transceivers for deterministic frame delivery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based protocol acceleration and embedded processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VFX20-11FF668CHigher logic density (19,576 LC), 20 RocketIO lanes, larger FF668 package (27×27 mm)Supports wider PCIe x8 links and higher channel-count SDR systemsChoose when additional logic, transceiver count, or I/O bandwidth is required beyond XC4VFX12-11SFG363C capacity
XC5VLX30-2FF324CVirtex-5 architecture, no embedded PowerPC, 30k logic cells, 6 RocketIO GTPs, lower power consumptionBetter suited for logic-intensive, non-processor-centric designs with moderate serial I/O needsChoose when PowerPC integration is unnecessary and lower static power or newer process node is preferred

Compared with XC4VFX12-11SFG363C, XC4VFX20-11FF668C scales up transceiver count and logic for broader serial interconnects, while XC5VLX30-2FF324C trades processor integration for improved logic efficiency and reduced power-making each suitable for distinct architectural trade-offs in embedded FPGA systems.

Availability

XC4VFX12-11SFG363C is available at Aetrix Electronics and suitable for high-speed serial interface design, embedded vision processing, and protocol acceleration applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC4VFX12-11SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Virtex-4 FX family was designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for communications infrastructure and embedded computing.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC4VFX12-11SFG363C?

The XC4VFX12-11SFG363C RocketIO transceivers support a maximum line rate of 3.125 Gbps per lane. This enables compliance with PCI Express 1.0, Serial RapidIO 1.x, and Gigabit Ethernet (1000BASE-X) standards. The transceivers include built-in encoding/decoding, clock data recovery, and elastic buffers to maintain signal integrity at this rate.

Does XC4VFX12-11SFG363C include embedded processor cores?

Yes, XC4VFX12-11SFG363C integrates two hard-core PowerPC 405 RISC processors with 32 kB instruction and 32 kB data cache each. These cores run independently and can execute bare-metal firmware or lightweight RTOS environments, enabling tightly coupled control-plane logic alongside programmable fabric data paths.

What configuration modes does XC4VFX12-11SFG363C support?

XC4VFX12-11SFG363C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP uses an internal oscillator to drive configuration clocks, while JTAG is used for debugging and in-system programming. Configuration bitstreams may be stored in external SPI flash or loaded dynamically via processor interface.

What are the power supply requirements for XC4VFX12-11SFG363C?

XC4VFX12-11SFG363C requires three primary supply rails: VCCINT = 1.2 V ±3% for core logic, VCCAUX = 2.5 V ±5% for auxiliary circuitry including JTAG and configuration logic, and bank-specific VCCO voltages (1.2 V, 1.5 V, 1.8 V, or 2.5 V) for I/O signaling. Decoupling must meet Xilinx layout guidelines to ensure stable operation under dynamic switching conditions.

Is XC4VFX12-11SFG363C compatible with Xilinx ISE Design Suite?

Yes, XC4VFX12-11SFG363C is fully supported by Xilinx ISE 14.7 and earlier versions. Synthesis, place-and-route, timing analysis, and bitstream generation workflows are validated for this device. While Vivado does not support Virtex-4, legacy ISE toolchains remain functional for maintenance and re-spin projects using XC4VFX12-11SFG363C.

XC4VFX12-11SFG363C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
363-FBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1368
Number of Logic Elements/Cells:
12312
Total RAM Bits:
663552
Number of I/O:
240
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
363-FCBGA (17x17)

XC4VFX12-11SFG363C FAQ

1.How can I place an order for XC4VFX12-11SFG363C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX12-11SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX12-11SFG363C reliable?

The price and inventory of XC4VFX12-11SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX12-11SFG363C is usually 5 days.

3.What payment methods are accepted for XC4VFX12-11SFG363C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX12-11SFG363C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX12-11SFG363C?

XC4VFX12-11SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX12-11SFG363C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX12-11SFG363C?

For technical support, including XC4VFX12-11SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX12-11SFG363C requirements.

6.How does Aetrix verify that XC4VFX12-11SFG363C is sourced from the original manufacturer or authorized distributors?

All XC4VFX12-11SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX12-11SFG363C meets industry standards.

7.What is the process for return or replacement of XC4VFX12-11SFG363C?

All XC4VFX12-11SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX12-11SFG363C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX12-11SFG363C part is unused and in its original packaging.

Return procedure for XC4VFX12-11SFG363C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX12-11SFG363C Tags

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