AMD XC4VFX140-10FF1517C
- Part No.:
- XC4VFX140-10FF1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XC4VFX140-10FF1517C.pdf
- Description:
- IC FPGA 768 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VFX140-10FF1517C from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 140,000 logic cells, 128 embedded 18×18 multipliers, and integrated PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and delivers 200+ GMACs of DSP performance. Used in high-end radar signal processing systems requiring real-time reconfigurable compute.
For engineers reviewing the XC4VFX140-10FF1517C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), total RAM bits (11,648 kbits), and available RocketIO transceivers (16 lanes @ 3.125 Gbps).
Technical Context
The XC4VFX140-10FF1517C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM, and dedicated DSP slices. It integrates two hard-core PowerPC 405 processors with on-chip PLB bus and supports partial reconfiguration via ICAP interface.
Its 16 RocketIO GTP transceivers comply with PCI Express 1.0a, Serial RapidIO, and Gigabit Ethernet standards. The device uses 90 nm copper process technology and supports JTAG boundary-scan IEEE 1149.1 for test and debug.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 140,000 - determines maximum combinational and sequential logic capacity for complex control and datapath implementation |
| Block RAM | 11,648 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency |
| DSP Slices | 128 × 18×18 multipliers - enables parallel MAC operations for FIR filters, FFT engines, and matrix math |
| RocketIO Transceivers | 16 lanes, 3.125 Gbps - supports full-duplex serial protocols including PCIe x1/x4 and SRIO x4 |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct interfacing to DDR2, QDR SRAM, and analog front-end ADCs/DACs |
| PowerPC Cores | 2 × PowerPC 405 - enables embedded software execution alongside hardware-accelerated logic for hybrid compute architectures |
Pinout & Package
XC4VFX140-10FF1517C is housed in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1517) package with 0.8 mm pitch, designed for high-speed signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, JTAG, and SelectIO banks |
| VCCO_0 | I/O bank power | Configurable 1.2–2.5 V output driver supply per bank; sets I/O voltage standard compatibility |
| MGTCLK | Transceiver reference clock | Differential input for RocketIO PLL; must meet jitter < 1.0 ps RMS for 3.125 Gbps operation |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without system reset-critical for adaptive radar waveform updates and protocol stack upgrades |
| Integrated PowerPC 405 Cores | Provides deterministic real-time software execution environment co-located with hardware accelerators for control-plane offload |
| RocketIO GTP Transceivers | Supports native PCIe 1.0a endpoint functionality without external PHY-reduces BOM count and board area |
| Multi-Voltage I/O Banks | Allows simultaneous connection to DDR2 (1.8 V), QDR-II (2.5 V), and LVDS ADCs (2.5 V) on same device-eliminates level-shifter ICs |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; PowerPC cores manage scheduling and communication. Use Value: Achieves sub-microsecond latency for adaptive waveform switching using partial reconfiguration and on-chip memory. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Accelerates back-projection and iterative reconstruction algorithms while interfacing to 16-bit ADCs and DDR2 frame buffers. Use Value: Delivers >120 GOPS sustained compute via DSP slices and avoids external memory bottlenecks with 11.4 Mbits on-chip RAM. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements protocol engines and time-triggered scheduler using soft peripherals and deterministic PowerPC execution. Use Value: Meets DO-254 DAL-A timing constraints with static timing analysis verified at -10°C to +85°C junction temperature. | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gbps serial links. IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns using RocketIO transceivers and built-in pattern generators/checkers. Use Value: Enables loopback testing at line rate without external equipment-reducing test setup complexity and cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX160-11FF1513C | No PowerPC cores; higher logic density (160K LC); no RocketIO transceivers | Better suited for pure logic-intensive tasks like packet classification; lacks serial protocol acceleration | Select when software control plane is handled externally and serial I/O is not required |
| XC5VLX330T-1FF1760C | Virtex-5 architecture; 330K logic cells; 24 RocketIO GTX transceivers; no embedded PowerPC | Supports PCIe 2.0 and higher bandwidth; requires external microcontroller for management functions | Choose for next-generation designs needing >4 Gbps serial I/O and larger logic capacity, accepting added software integration effort |
Compared with XC4VFX140-10FF1517C, the XC4VLX160-11FF1513C trades embedded processing for raw logic capacity, while the XC5VLX330T-1FF1760C offers higher serial bandwidth and logic scale but removes hard processor cores-requiring architectural redesign for software-offload use cases.
Availability
XC4VFX140-10FF1517C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX140-10FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. Xilinx pioneered high-performance programmable logic for demanding compute and signal processing applications.
The Virtex-4 FX platform was designed specifically for embedded reconfigurable systems combining programmable logic, DSP resources, and hardened processor subsystems-targeting defense, aerospace, and high-end instrumentation.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX140-10FF1517C?
The XC4VFX140-10FF1517C integrates two PowerPC 405 cores rated for 500 MHz operation under typical conditions. This frequency is achievable with proper thermal management and core voltage (VCCINT = 1.2 V). The actual sustained clock speed depends on silicon grade (-10 speed grade), junction temperature, and power delivery stability. XC4VFX140-10FF1517C documentation specifies this as the guaranteed maximum for the -10 speed grade at commercial temperature range.
Does XC4VFX140-10FF1517C support JTAG boundary-scan testing?
Yes, XC4VFX140-10FF1517C fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. It includes dedicated TCK, TMS, TDI, TDO, and TROUT pins for in-system programming and interconnect testing. The JTAG chain supports configuration, debug, and manufacturing test modes. XC4VFX140-10FF1517C implements all mandatory boundary-scan instructions including SAMPLE/PRELOAD, EXTEST, and IDCODE.
Can XC4VFX140-10FF1517C interface directly with DDR2 SDRAM?
Yes, XC4VFX140-10FF1517C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock) using its dedicated DQS-based I/O logic and phase-matched routing. It includes built-in calibration logic for write-leveling and read-leveling. XC4VFX140-10FF1517C requires external termination and careful PCB layout but does not need a separate memory controller IC.
What is the purpose of the MGTCLK pins on XC4VFX140-10FF1517C?
The MGTCLK pins on XC4VFX140-10FF1517C provide differential reference clock inputs to the RocketIO GTP transceivers' PLLs. Each transceiver bank has dedicated MGTCLK pairs supporting frequencies from 10 MHz to 875 MHz. XC4VFX140-10FF1517C requires low-jitter (<1.0 ps RMS) clock sources to maintain bit-error rates below 10⁻¹² at 3.125 Gbps operation.
Is partial reconfiguration supported on XC4VFX140-10FF1517C?
Yes, XC4VFX140-10FF1517C supports partial reconfiguration through its Internal Configuration Access Port (ICAP). This allows dynamic loading of logic modules into designated regions without resetting the entire device. XC4VFX140-10FF1517C requires specific bitstream generation flow and floorplanning in Xilinx ISE tools to implement validated partial reconfiguration designs.
XC4VFX140-10FF1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15792
- Number of Logic Elements/Cells:
- 142128
- Total RAM Bits:
- 10174464
- Number of I/O:
- 768
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XC4VFX140-10FF1517C FAQ
1.How can I place an order for XC4VFX140-10FF1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX140-10FF1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX140-10FF1517C reliable?
The price and inventory of XC4VFX140-10FF1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX140-10FF1517C is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX140-10FF1517C transactions.
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Once your XC4VFX140-10FF1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX140-10FF1517C?
For technical support, including XC4VFX140-10FF1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX140-10FF1517C requirements.
6.How does Aetrix verify that XC4VFX140-10FF1517C is sourced from the original manufacturer or authorized distributors?
All XC4VFX140-10FF1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX140-10FF1517C meets industry standards.
7.What is the process for return or replacement of XC4VFX140-10FF1517C?
All XC4VFX140-10FF1517C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX140-10FF1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX140-10FF1517C part is unused and in its original packaging.
Return procedure for XC4VFX140-10FF1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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