My Inquiry
My Account
AMD XC4VFX140-11FFG1517C
- Part No.:
- XC4VFX140-11FFG1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XC4VFX140-11FFG1517C.pdf
- Description:
- IC FPGA 768 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,219
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VFX140-11FFG1517C from AMD (formerly Xilinx) is a high-performance Virtex-4 FPGA featuring 140,000 logic cells, 1517-pin Flip-Chip BGA package, -11 speed grade, and support for embedded PowerPC 405 processors. It targets high-bandwidth digital signal processing in radar systems, software-defined radio baseband units, and high-end test equipment requiring deterministic timing and multi-gigabit serial I/O.
For engineers reviewing the XC4VFX140-11FFG1517C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility (1.2 V/1.5 V/1.8 V/2.5 V), embedded Block RAM capacity (7,372,800 bits), and RocketIO transceiver count (24 channels @ 3.75 Gbps).
Technical Context
The XC4VFX140-11FFG1517C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive operations, and integrated PowerPC 405 RISC cores for system control. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 840 Mbps per pin.
RocketIO multi-gigabit transceivers provide serial connectivity compliant with PCI Express 1.0, Serial RapidIO, and 10 Gigabit Ethernet physical layer specifications. The device uses 90 nm copper process technology and operates at core voltage of 1.2 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 140,000 - determines maximum combinational and sequential logic density for complex state machines and data paths |
| Block RAM | 7,372,800 bits - enables large on-chip FIFOs, coefficient storage, and frame buffering without external memory |
| RocketIO Transceivers | 24 × 3.75 Gbps - supports 24 independent serial links for high-throughput backplane or inter-FPGA communication |
| I/O Standards | LVDS, SSTL-2, SSTL-18, HSTL-I, LVCMOS - allows direct interface to DDR2 SDRAM, ADCs, DACs, and FPGAs |
| Embedded Processor | Two PowerPC 405 cores - provides hard real-time control, boot management, and offload of soft CPU tasks |
| Speed Grade | -11 - guarantees worst-case propagation delay performance across industrial temperature range (0°C to 85°C) |
Pinout & Package
XC4VFX140-11FFG1517C is housed in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Pin assignment follows Xilinx Virtex-4 FFG1517 mechanical and electrical specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, DSP slices, and internal routing; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and auxiliary I/O banks |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V output driver supply per bank; sets I/O voltage standard |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and halts processor execution |
| CLKIN | Primary clock input | Dedicated global clock input feeding DCMs for jitter reduction and frequency synthesis |
| PROGRAM_B | Configuration initiator | Active-low signal triggering full reconfiguration from external PROM or processor |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 cores | Enables dual-core embedded control without soft-core resource consumption or timing uncertainty |
| DSP48 slices | Provides 18 × 18-bit signed multiplication with pipeline registers for real-time FIR/IIR filtering |
| DCM clock managers | Delivers precise phase alignment, duty-cycle correction, and frequency synthesis for synchronous system design |
| SelectIO technology | Supports mixed-voltage I/O banks enabling direct connection to legacy and next-generation peripherals |
| Partial reconfiguration support | Allows dynamic logic module swapping during operation-critical for adaptive waveform or protocol switching |
Applications
| Radar Signal Processing | Software-Defined Radio (SDR) Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFTs, CFAR detection, and digital down-conversion pipelines. Use Value: 24 RocketIO transceivers enable high-speed ADC/DAC data ingestion; 140K logic cells sustain parallel filter banks and tracking loops. | Use Scenario: Multi-band, multi-standard wireless baseband processing in military and cellular infrastructure. IC Role / Device Role / Timing Role: Reconfigurable digital front-end handling modulation/demodulation, channel coding, and MIMO precoding. Use Value: Dual PowerPC 405 cores manage protocol stacks while FPGA fabric handles symbol-level processing at >100 MSPS. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: Bit-error-rate testers and protocol analyzers requiring deterministic latency and multi-protocol serialization. IC Role / Device Role / Timing Role: Protocol-aware serializer/deserializer with real-time pattern generation and error injection. Use Value: -11 speed grade ensures sub-nanosecond timing closure; RocketIO compliance with PCIe 1.0 and SRIO enables standard host interfacing. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control systems. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with guaranteed latency and redundancy failover. Use Value: Embedded PowerPC cores execute AFDX end-system stack; SelectIO supports 2.5 V AFDX PHY interface and 3.3 V discrete I/O monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX160-11FFG1517C | No embedded PowerPC cores; higher logic density (160K cells); same package and I/O structure | Better suited for pure logic-intensive tasks without embedded control requirements | Select when system control is handled externally or via soft-core, and maximum LUT count is prioritized |
| XC5VLX330T-1FFG1760C | Virtex-5 architecture; 330K logic cells; 1760-pin package; supports GTX transceivers up to 6.5 Gbps | Offers higher bandwidth and newer process node but requires PCB redesign due to different package and power delivery | Choose for new designs needing higher serial throughput and scalability beyond Virtex-4 limits |
Compared with XC4VFX140-11FFG1517C, the XC4VLX160-11FFG1517C trades embedded processing for raw logic capacity, while the XC5VLX330T-1FFG1760C delivers generational improvements in speed and transceiver performance at the cost of migration effort and footprint change.
Availability
XC4VFX140-11FFG1517C is available at Aetrix Electronics and suitable for radar signal processing, software-defined radio baseband units, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX140-11FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, aerospace, and industrial applications.
The Virtex-4 family was originally designed by Xilinx to deliver high-performance, system-level integration for demanding communications and defense applications requiring both programmable logic and hardened processor subsystems.
FAQ
What is the operating temperature range for XC4VFX140-11FFG1517C?
The XC4VFX140-11FFG1517C is rated for industrial temperature operation from 0°C to +85°C ambient. This range is validated under specified VCCINT, VCCAUX, and VCCO supply conditions and applies to all speed grade -11 devices in the FFG1517 package. Thermal derating is not required within this envelope when using recommended PCB thermal vias and heatsink attachment.
Does XC4VFX140-11FFG1517C support partial reconfiguration?
Yes, XC4VFX140-11FFG1517C supports dynamic partial reconfiguration through Xilinx ISE design tools and associated bitstream generation flow. This capability enables runtime logic module replacement without resetting the entire device or interrupting active RocketIO links or PowerPC execution.
What configuration modes are supported by XC4VFX140-11FFG1517C?
XC4VFX140-11FFG1517C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP is commonly used for fast parallel loading from external PROM, while JTAG supports boundary-scan testing and in-system programming during development and field updates.
How many RocketIO transceivers does XC4VFX140-11FFG1517C include?
XC4VFX140-11FFG1517C integrates 24 RocketIO transceivers, each capable of 622 Mbps to 3.75 Gbps operation. These transceivers are grouped into four quads and support protocols including PCI Express 1.0, Serial RapidIO, and 10 Gigabit Ethernet Physical Coding Sublayer (PCS).
Is XC4VFX140-11FFG1517C RoHS compliant?
Yes, XC4VFX140-11FFG1517C is manufactured as a lead-free, RoHS-compliant device per EU Directive 2011/65/EU. The FFG1517 package uses matte tin finish on solder balls and complies with JEDEC JS-001 and IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
XC4VFX140-11FFG1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15792
- Number of Logic Elements/Cells:
- 142128
- Total RAM Bits:
- 10174464
- Number of I/O:
- 768
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XC4VFX140-11FFG1517C FAQ
1.How can I place an order for XC4VFX140-11FFG1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX140-11FFG1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX140-11FFG1517C reliable?
The price and inventory of XC4VFX140-11FFG1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX140-11FFG1517C is usually 5 days.
3.What payment methods are accepted for XC4VFX140-11FFG1517C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX140-11FFG1517C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX140-11FFG1517C?
XC4VFX140-11FFG1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX140-11FFG1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX140-11FFG1517C?
For technical support, including XC4VFX140-11FFG1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX140-11FFG1517C requirements.
6.How does Aetrix verify that XC4VFX140-11FFG1517C is sourced from the original manufacturer or authorized distributors?
All XC4VFX140-11FFG1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX140-11FFG1517C meets industry standards.
7.What is the process for return or replacement of XC4VFX140-11FFG1517C?
All XC4VFX140-11FFG1517C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX140-11FFG1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX140-11FFG1517C part is unused and in its original packaging.
Return procedure for XC4VFX140-11FFG1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VFX140-11FFG1517C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
