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AMD XC4VFX20-10FFG672C
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- Part No.:
- XC4VFX20-10FFG672C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC4VFX20-10FFG672C.pdf
- Description:
- IC FPGA 320 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,323
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Product details
Overview
XC4VFX20-10FFG672C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 20,800 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO™ multi-gigabit transceivers operating up to 3.75 Gbps. It includes 1.2 MB of block RAM, 128 DSP48 slices, and supports PCI Express® x4 endpoint functionality. It is used in high-speed communications line cards requiring protocol processing and SerDes interfacing.
For engineers reviewing the XC4VFX20-10FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, embedded processor count, block RAM depth, and PCIe endpoint compliance for reconfigurable networking hardware design.
Technical Context
The XC4VFX20-10FFG672C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and dual-processor PowerPC 405 cores with separate instruction and data caches. Its RocketIO transceivers support multiple protocols including Gigabit Ethernet, Serial RapidIO, and PCI Express Gen1.
It uses 90 nm copper CMOS process technology, operates at 1.2 V core voltage, and supports SelectIO™ standards including LVDS, SSTL, and HSTL. Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption available for secure deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,800 - determines maximum combinational/sequential logic capacity for custom IP integration |
| Block RAM | 1.2 MB - enables large on-chip buffering for packet processing or video frame storage |
| DSP Slices | 128 × DSP48 - provides fixed-point multiply-accumulate capability for filtering or modulation algorithms |
| RocketIO Transceivers | 8 channels, 3.75 Gbps max - supports full-rate PCIe x4 or dual-channel SRIO links without external retimers |
| Embedded Processors | 2 × PowerPC 405 - enables soft-core offload of control-plane tasks while FPGA handles data-plane acceleration |
| I/O Standards | LVDS, SSTL-2, HSTL - allows direct interface to DDR2 memory, optical PHYs, and backplane drivers |
Pinout & Package
XC4VFX20-10FFG672C is housed in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 29×29 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports high-speed signal integrity and efficient power delivery for multi-gigabit transceiver operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, DSP slices, and internal routing; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and SelectIO banks |
| MGTREFCLK | Transceiver reference clock input | Dedicated differential pair for RocketIO PLL reference; must meet jitter < 1.5 ps RMS |
| PCIe_RX/N, PCIe_TX/N | PCIe differential I/O | Hardwired to PCIe endpoint block; supports Gen1 x4 link with integrated termination |
| PPC_0_DBGRQ, PPC_1_DBGRQ | PowerPC debug request | Active-low signals enabling JTAG-based processor debugging independent of FPGA fabric |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 cores | Enables concurrent software-defined control plane execution alongside hardware-accelerated data path |
| RocketIO transceivers | Eliminates need for external SerDes chips in 1–3.75 Gbps serial protocols like PCIe and SRIO |
| PCI Express hard IP block | Provides compliant endpoint functionality with minimal user logic overhead and deterministic latency |
| Block RAM with byte-write enable | Supports efficient packet header modification and small-database lookup without external memory |
| SelectIO technology with programmable slew rate | Allows signal integrity tuning across varying trace lengths and load conditions |
Applications
| Wireless Baseband Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time channel coding, MIMO signal processing, and CPRI fronthaul mapping in LTE/5G remote radio units. IC Role / Device Role / Timing Role: FPGA fabric executes parallelized LDPC decoding and beamforming kernels; PowerPC cores manage RRC layer and OAM messaging. Use Value: Single-chip integration reduces board area and inter-chip latency versus discrete processor + ASIC solutions. | Use Scenario: Aggregating 10G Ethernet, OTU2, and Fibre Channel traffic onto DWDM wavelengths in metro transport nodes. IC Role / Device Role / Timing Role: RocketIO transceivers interface directly to optical PHYs; block RAM buffers bursty traffic; PCIe connects to host CPU for provisioning. Use Value: Eliminates external SerDes and bridging logic, lowering BOM cost and power by ~2.3 W per port. |
| Defense Radar Signal Processor | Industrial Machine Vision Controller |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: DSP48 slices perform real-time FFT and matrix inversion; PowerPC runs mission-critical health monitoring and comms stack. Use Value: Radiation-tolerant configuration memory and SEU mitigation features ensure operational reliability in avionics environments. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronization and sub-pixel defect classification. IC Role / Device Role / Timing Role: FPGA fabric processes pixel streams from four CMOS sensors; PowerPC coordinates motion control and network reporting. Use Value: On-chip block RAM enables real-time frame buffering without external DDR, reducing EMI and timing skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance reconfigurable processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX40-11FFG672C | Higher logic density (40K LC), more DSP slices (256), same package and transceiver count | Better suited for multi-protocol convergence where additional fabric is needed for protocol gateways | Select when XC4VFX20-10FFG672C resource utilization exceeds 85% in synthesis reports |
| XCVU3P-2FFVB2104I | UltraScale architecture, 16 nm process, 114K logic cells, 24 GTY transceivers up to 32.75 Gbps | Targets next-gen 100G+ systems with PAM4 and coherent optics; not pin-compatible | Choose for new designs requiring higher bandwidth and lower power; migration requires RTL and PCB redesign |
Compared with XC4VFX20-10FFG672C, XC4VFX40-11FFG672C offers scalable resources within identical footprint and toolchain, while XCVU3P-2FFVB2104I delivers generational improvements in speed and efficiency but mandates full system requalification.
Availability
XC4VFX20-10FFG672C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, and defense electronics applications requiring stable component supply and long-term lifecycle support.
Supply support for XC4VFX20-10FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and AI engine technologies for data center, edge, and embedded markets.
The Virtex-4 FX family was originally designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for communications and military systems demanding deterministic performance and protocol flexibility.
FAQ
What is the maximum data rate supported by the RocketIO transceivers in XC4VFX20-10FFG672C?
The XC4VFX20-10FFG672C integrates RocketIO transceivers rated for up to 3.75 Gbps per channel. This rate supports PCI Express Gen1 x4 endpoints, Serial RapidIO 1.2, and Gigabit Ethernet over backplanes. Operation at full speed requires proper reference clock jitter specification (<1.5 ps RMS) and controlled impedance PCB layout per Xilinx UG078.
Does XC4VFX20-10FFG672C include hard IP for PCI Express?
Yes, XC4VFX20-10FFG672C contains dedicated hard IP blocks for PCI Express Gen1 endpoint functionality, including transaction layer, data link layer, and physical layer logic. This eliminates the need for soft-core PCIe implementations and ensures compliance with PCIe Base Specification 1.1 without user logic overhead.
How many PowerPC 405 processors are integrated into XC4VFX20-10FFG672C?
XC4VFX20-10FFG672C integrates two embedded PowerPC 405 RISC processors, each with 32 KB instruction cache and 32 KB data cache, independently configurable for symmetric or asymmetric multiprocessing. Both cores support JTAG-based debugging via dedicated DBGRQ pins.
What package type and ball count does XC4VFX20-10FFG672C use?
XC4VFX20-10FFG672C uses a 672-ball Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and 29×29 mm body size. The FFG designation indicates flip-chip construction with underfill compatibility and thermal lid for enhanced thermal dissipation in high-power configurations.
Is XC4VFX20-10FFG672C still in active production or subject to obsolescence?
XC4VFX20-10FFG672C is a mature product in AMD's (formerly Xilinx) Virtex-4 family and is no longer in active production. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers extended lifecycle support, including obsolescence forecasting and cross-reference guidance for migration paths.
XC4VFX20-10FFG672C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2136
- Number of Logic Elements/Cells:
- 19224
- Total RAM Bits:
- 1253376
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC4VFX20-10FFG672C FAQ
1.How can I place an order for XC4VFX20-10FFG672C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX20-10FFG672C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX20-10FFG672C reliable?
The price and inventory of XC4VFX20-10FFG672C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX20-10FFG672C is usually 5 days.
3.What payment methods are accepted for XC4VFX20-10FFG672C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX20-10FFG672C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX20-10FFG672C?
XC4VFX20-10FFG672C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX20-10FFG672C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX20-10FFG672C?
For technical support, including XC4VFX20-10FFG672C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX20-10FFG672C requirements.
6.How does Aetrix verify that XC4VFX20-10FFG672C is sourced from the original manufacturer or authorized distributors?
All XC4VFX20-10FFG672C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX20-10FFG672C meets industry standards.
7.What is the process for return or replacement of XC4VFX20-10FFG672C?
All XC4VFX20-10FFG672C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX20-10FFG672C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX20-10FFG672C part is unused and in its original packaging.
Return procedure for XC4VFX20-10FFG672C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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