AMD XC4VFX20-11FF672C

Overview

XC4VFX20-11FF672C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 20,800 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO multi-gigabit transceivers operating up to 3.75 Gbps. It is housed in a 672-pin Fine-Pitch Flip-Chip BGA (FF672) package with 1.0 mm pitch and supports -11 speed grade timing.

For engineers reviewing the XC4VFX20-11FF672C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count (8 lanes), embedded processor availability, I/O voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), and thermal design power (TDP) of 5.9 W under typical conditions.

Technical Context

The XC4VFX20-11FF672C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (472 KB), DSP slices (48), and dedicated clock management tiles (DCMs). Its dual-processor subsystem includes two PowerPC 405 cores with on-chip instruction and data caches, enabling soft-core co-processing in embedded applications.

RocketIO transceivers support protocols including Serial RapidIO, PCI Express 1.0, and Gigabit Ethernet via programmable physical coding sublayer (PCS) and physical medium attachment (PMA). The device uses 90 nm copper CMOS process technology and supports JTAG boundary-scan IEEE 1149.1 compliance.

Key Specifications

Pinout & Package

XC4VFX20-11FF672C is packaged in a 672-pin Fine-Pitch Flip-Chip BGA (FF672) with 1.0 mm ball pitch, 27 × 27 mm body size, and Pb-free (RoHS-compliant) finish. Thermal pad on underside requires solder paste stencil aperture and ground plane connection for thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Compared with XC4VFX20-11FF672C, the XC4VFX12-11FF672C offers cost and power reduction at the expense of transceiver count and embedded processing headroom, while XC5VLX30-1FF676C shifts focus to logic scalability and PCIe integration-requiring redesign of processor subsystem and serial interface firmware.

Availability

XC4VFX20-11FF672C is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, medical imaging, and industrial automation requiring stable component supply and long-term obsolescence management.

Supply support for XC4VFX20-11FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and AI engine technologies for data center, communications, and embedded markets.

The Virtex-4 FX family was originally designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding embedded systems requiring both real-time hardware acceleration and software programmability.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX20-11FF672C?

The XC4VFX20-11FF672C integrates two PowerPC 405 cores rated for operation up to 400 MHz under the -11 speed grade at commercial temperature range (0°C to 85°C). This frequency is guaranteed with proper VCCINT regulation and thermal management. The XC4VFX20-11FF672C datasheet specifies timing closure requirements for core clock domain synchronization with fabric logic.

Does XC4VFX20-11FF672C support JTAG boundary-scan testing?

Yes, XC4VFX20-11FF672C fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. It includes dedicated TDI, TDO, TMS, TCK, and TROUT pins for in-circuit test and programming. The XC4VFX20-11FF672C supports instruction register access, device identification, and boundary-scan register testing of all I/O pins and internal logic paths.

Can XC4VFX20-11FF672C be configured via SPI flash memory?

No, XC4VFX20-11FF672C does not support native SPI flash configuration. It requires configuration through Master SelectMAP, Slave SelectMAP, or Slave Serial modes using parallel NOR flash or serial PROMs compatible with Xilinx's proprietary bitstream format. The XC4VFX20-11FF672C configuration interface is not SPI-compatible without external glue logic or bridge IC.

What is the I/O voltage range supported per bank on XC4VFX20-11FF672C?

XC4VFX20-11FF672C supports independent I/O voltage assignment per bank: 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Each bank's VCCO must match the selected standard (e.g., LVCMOS33 requires 3.3 V). The XC4VFX20-11FF672C allows mixed-voltage operation across banks but prohibits mixing standards within a single bank.

Is partial reconfiguration supported on XC4VFX20-11FF672C?

Yes, XC4VFX20-11FF672C supports partial reconfiguration through its hierarchical configuration architecture and dedicated configuration port (ICAP). This allows dynamic loading of logic modules into designated regions without resetting the entire device. The XC4VFX20-11FF672C requires specific place-and-route constraints and bitstream generation flow using Xilinx ISE tools to implement validated partial reconfiguration designs.