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AMD XC4VFX40-10FFG1152C

Part No.:
XC4VFX40-10FFG1152C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC4VFX40-10FFG1152C.pdf
Description:
IC FPGA 448 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,103

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Product details

Overview

XC4VFX40-10FFG1152C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 40,000 logic cells, embedded PowerPC 405 RISC processors, and integrated multi-gigabit transceivers operating up to 3.75 Gbps. It supports PCI Express x4, Serial RapidIO, and 10 Gigabit Ethernet in high-performance communications and signal processing systems.

For engineers reviewing the XC4VFX40-10FFG1152C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count (16 lanes), I/O standard support (LVDS, SSTL, HSTL), embedded processor availability, and -10 speed grade timing performance.

Technical Context

The XC4VFX40-10FFG1152C integrates two hard-core PowerPC 405 processors with on-chip memory controllers and 16 RocketIO™ multi-gigabit transceivers. Its architecture includes distributed RAM, block RAM (2,088 kbits), and DSP48 slices for arithmetic-intensive tasks.

It uses 90 nm copper CMOS process technology, supports JTAG boundary-scan (IEEE 1149.1), and implements SelectIO™ technology for flexible I/O interfacing across 1,152-ball FCBGA package with 640 user I/Os.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells40,000 - determines maximum combinational/sequential logic capacity for custom digital design implementation
Embedded Processors2× PowerPC 405 - enables soft/hard real-time control and host processing without external CPU
Transceivers16× RocketIO™ - supports 10G Ethernet, SRIO, and PCIe x4 physical layer interfaces
Block RAM2,088 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external memory
I/O Count640 user I/Os - enables high-bandwidth parallel interface connectivity to ADCs, DACs, and memory
Speed Grade-10 - guarantees worst-case timing performance at 1 GHz system clock domain operation
Package1152-ball FCBGA (FFG1152) - 35 mm × 35 mm footprint with thermal lid for high-power FPGA applications

Pinout & Package

XC4VFX40-10FFG1152C is housed in a 1152-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG1152) package with 35 mm × 35 mm body size, thermal lid, and 1.0 mm ball pitch. Pin functions are defined per Xilinx UG070 (Virtex-4 Platform FPGA User Guide) and include dedicated configuration, clock, JTAG, transceiver, and I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift register during master serial mode programming
DONEConfiguration StatusOpen-drain output indicating successful bitstream loading and initialization completion
INIT_BConfiguration ControlActive-low input signaling device readiness and detecting configuration errors
M0–M2Mode SelectionThree-pin bus selecting configuration mode (JTAG, Master Serial, Slave Parallel, etc.)
VRP/VRNAnalog ReferenceDifferential pair providing internal voltage reference for analog I/O calibration
GTX_CLK0_M2P/GTX_CLK0_M2NTransceiver RefClkDedicated differential input for RocketIO™ transceiver PLL reference clock

Key Features

FeatureDesign Value
Hard PowerPC 405 CoresEnables deterministic real-time processing and reduces external processor dependency in embedded systems
RocketIO™ TransceiversProvides native SerDes capability for high-speed serial protocols without external PHYs
SelectIO™ TechnologySupports 18 I/O standards including LVDS, SSTL-2, and HSTL with programmable drive strength and termination
DSP48 SlicesDelivers 18-bit × 18-bit multiply-accumulate operations at up to 500 MHz for signal processing pipelines
Block RAM ConfigurationAllows dual-port, true dual-port, and simple dual-port modes for flexible memory architecture mapping

Applications

Wireless Baseband ProcessingDefense Radar Signal Processing

Use Scenario: Real-time FFT, channel estimation, and MIMO decoding in LTE/5G base stations.

IC Role / Device Role / Timing Role: Primary programmable logic fabric hosting custom DSP kernels and managing high-speed data flow between RF front-end and backhaul interface.

Use Value: Integrated PowerPC cores offload control-plane tasks while RocketIO™ transceivers handle CPRI/eCPRI fronthaul links at 3.072+ Gbps.

Use Scenario: Pulse-Doppler processing and beamforming in AESA radar systems with low-latency response requirements.

IC Role / Device Role / Timing Role: High-throughput reconfigurable accelerator executing time-critical filtering and correlation algorithms synchronized to precise system clocks.

Use Value: 640 user I/Os enable direct connection to multiple ADC/DAC channels; -10 speed grade ensures sub-10 ns timing closure for critical paths.

Medical Imaging Data AcquisitionIndustrial Machine Vision Controller

Use Scenario: Parallel acquisition and preprocessing of ultrasound echo data from 128+ transducer elements.

IC Role / Device Role / Timing Role: Central data concentrator and real-time image reconstruction engine interfacing with high-speed ADCs and DDR2 memory subsystems.

Use Value: Block RAM and DSP48 slices accelerate beamforming computations; SelectIO™ supports LVDS inputs from multi-channel ADCs at 80 MSPS.

Use Scenario: High-resolution image capture, feature extraction, and real-time defect classification on production lines.

IC Role / Device Role / Timing Role: Vision co-processor handling pixel-level operations and coordinating with industrial Ethernet (PROFINET, EtherCAT) via RocketIO™-based MACs.

Use Value: Embedded PowerPC 405 manages camera interface, motion control, and network stack-reducing BOM count and latency versus discrete SoC+FPGA solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VFX60-11FFG1152CHigher logic capacity (60K LC), faster speed grade (-11), same package and transceiver countRequired when design exceeds 40K LC utilization or needs tighter timing marginsSelect if additional logic resources or improved timing slack is needed without changing PCB layout
XCVU9P-2FLGA2104IVersal ACAP architecture, AI Engines, 32 GTY transceivers, 2104-pin FC-BGATargets next-gen AI-accelerated inference and heterogeneous compute-not drop-in compatibleChoose for new designs requiring hardware-accelerated ML workloads; not a replacement for legacy Virtex-4 migration

Compared with XC4VFX40-10FFG1152C, the XC4VFX60-11FFG1152C offers higher density and speed within identical footprint and pinout, while the XCVU9P represents a generational architecture shift with AI acceleration but requires full redesign and toolchain migration.

Availability

XC4VFX40-10FFG1152C is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, medical imaging, and industrial vision systems requiring stable component supply and long-term obsolescence management.

Supply support for XC4VFX40-10FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance and heterogeneous computing markets.

The Virtex-4 FX family was designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding communications and signal processing applications.

FAQ

What is the maximum data rate supported by the RocketIO™ transceivers in XC4VFX40-10FFG1152C?

The XC4VFX40-10FFG1152C features 16 RocketIO™ transceivers each capable of 3.75 Gbps line rate. This enables compliance with 10 Gigabit Ethernet (10GBASE-R), Serial RapidIO Gen1/Gen2, and PCI Express 1.0 x4 physical layers. The transceivers support both 8B/10B encoding and raw data modes, and their performance is validated under the -10 speed grade specification across industrial temperature range.

Does XC4VFX40-10FFG1152C include embedded memory blocks, and what types are available?

Yes, XC4VFX40-10FFG1152C includes 2,088 kbits of total block RAM organized as 144 × 18-kbit dual-port RAM blocks. It also provides distributed RAM using LUTs and shift registers. These memory resources support synchronous/asynchronous read/write, byte-write enable, and parity generation-enabling efficient FIFOs, frame buffers, and coefficient storage in signal processing pipelines implemented on the XC4VFX40-10FFG1152C.

What configuration modes does XC4VFX40-10FFG1152C support?

XC4VFX40-10FFG1152C supports multiple configuration modes including Master Serial (via PROM), Slave Serial, Slave Parallel, JTAG, and System ACE. Mode selection is controlled by the M0–M2 pins at power-up. Configuration bitstreams can be loaded from external SPI flash, microprocessor, or JTAG debugger, and the DONE pin confirms successful initialization. All modes are fully documented in Xilinx UG070 for the XC4VFX40-10FFG1152C.

Is XC4VFX40-10FFG1152C RoHS compliant and lead-free?

Yes, XC4VFX40-10FFG1152C is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The FFG1152 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation-including substance declarations and test reports-is available through AMD's product change notifications and material content portals for the XC4VFX40-10FFG1152C.

Can XC4VFX40-10FFG1152C operate in extended temperature ranges beyond commercial grade?

No, XC4VFX40-10FFG1152C is specified only for commercial temperature range (0°C to +85°C ambient). It is not rated for industrial (–40°C to +100°C) or automotive temperature grades. Designs requiring wider thermal operation must select alternative Virtex-4 variants such as XC4VFX40-10FFG1152I (industrial grade) or verify thermal derating with AMD's thermal models for the XC4VFX40-10FFG1152C.

XC4VFX40-10FFG1152C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
4656
Number of Logic Elements/Cells:
41904
Total RAM Bits:
2654208
Number of I/O:
448
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC4VFX40-10FFG1152C FAQ

1.How can I place an order for XC4VFX40-10FFG1152C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX40-10FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX40-10FFG1152C reliable?

The price and inventory of XC4VFX40-10FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX40-10FFG1152C is usually 5 days.

3.What payment methods are accepted for XC4VFX40-10FFG1152C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX40-10FFG1152C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX40-10FFG1152C?

XC4VFX40-10FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX40-10FFG1152C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX40-10FFG1152C?

For technical support, including XC4VFX40-10FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX40-10FFG1152C requirements.

6.How does Aetrix verify that XC4VFX40-10FFG1152C is sourced from the original manufacturer or authorized distributors?

All XC4VFX40-10FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX40-10FFG1152C meets industry standards.

7.What is the process for return or replacement of XC4VFX40-10FFG1152C?

All XC4VFX40-10FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX40-10FFG1152C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX40-10FFG1152C part is unused and in its original packaging.

Return procedure for XC4VFX40-10FFG1152C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX40-10FFG1152C Tags

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