AMD XC4VFX40-10FFG672I
- Part No.:
- XC4VFX40-10FFG672I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC4VFX40-10FFG672I.pdf
- Description:
- IC FPGA 352 I/O 672FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VFX40-10FFG672I from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 40,000 logic cells, embedded PowerPC 405 RISC processors, and integrated multi-gigabit transceivers operating up to 3.125 Gbps. It is housed in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm pitch and supports -40°C to +100°C industrial temperature operation.
For engineers reviewing the XC4VFX40-10FFG672I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (448 user I/Os), transceiver lane count (16 lanes), embedded processor availability, and speed grade (-10 = 1.0 ns CLB delay).
Technical Context
The XC4VFX40-10FFG672I integrates two hardened PowerPC 405 cores with on-chip memory controllers and dual 16-lane MGT banks supporting protocols including Serial RapidIO, PCI Express Gen1, and Gigabit Ethernet. Its clock management includes four Digital Clock Managers (DCMs) per bank for phase alignment and jitter reduction.
Configuration is performed via SelectMAP, JTAG, or serial PROM interfaces. The device supports partial reconfiguration and uses 1.2 V core voltage with 2.5 V or 3.3 V I/O banks, each independently configurable for LVCMOS, LVTTL, SSTL, HSTL, and differential standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 40,000 - determines maximum combinational/sequential logic capacity for custom digital design implementation |
| Embedded Processors | 2× PowerPC 405 - enables hard real-time control and software-defined functionality without external CPU |
| MGT Lanes | 16 × 3.125 Gbps - supports 8-lane PCIe x8 or dual 4x SRIO links with full-duplex serial connectivity |
| User I/O Pins | 448 - provides high-density parallel interface capability across 24 I/O banks with flexible voltage support |
| Speed Grade | -10 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature conditions |
| Package | 672-pin FFG - flip-chip BGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity in dense PCB layouts |
Pinout & Package
The XC4VFX40-10FFG672I is packaged in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG672) with 0.8 mm ball pitch and 27 × 27 array footprint. Thermal pad is exposed on underside for enhanced heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during master serial or SelectMAP mode |
| DIN | Configuration Data In | Serial input for bitstream loading in master serial mode |
| INIT_B | Configuration Status | Open-drain output indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts load sequence |
| M0–M2 | Mode Selection | Three-pin bus selecting among JTAG, Master SelectMAP, Slave SelectMAP, and Serial modes |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 Cores | Enables deterministic real-time processing alongside programmable logic without external microprocessor latency |
| Multi-Gigabit Transceivers | 16 lanes at 3.125 Gbps support protocol-agnostic serial links including PCIe, SRIO, and 10GbE MACPHY |
| Digital Clock Managers (DCMs) | Four per I/O bank provide precise duty-cycle correction, frequency synthesis, and phase shifting for system clock domain bridging |
| SelectIO Technology | Per-bank I/O voltage and standard selection allows mixed-voltage interfacing (1.2 V to 3.3 V) without level shifters |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive radio and runtime protocol switching |
Applications
| Wireless Baseband Processing | Defense Radar Signal Processing |
|---|---|
Use Scenario: Real-time FFT, channel estimation, and MIMO precoding in LTE/5G macro base stations. IC Role / Device Role / Timing Role: Primary programmable fabric hosting DSP pipelines with hard PowerPC managing control plane and protocol stack. Use Value: Combines high-speed serial backhaul (via MGTs) and deterministic software execution to replace discrete DSP+FPGA+CPU architectures. | Use Scenario: Pulse-Doppler processing and beamforming in AESA radar systems requiring low-latency response. IC Role / Device Role / Timing Role: Time-critical signal conditioning and adaptive filtering engine synchronized to system timing reference via DCMs. Use Value: Achieves sub-microsecond latency for closed-loop feedback using embedded processors and dedicated arithmetic blocks. |
| Industrial Machine Vision | Medical Imaging Interface |
Use Scenario: High-throughput image preprocessing (demosaic, noise reduction, edge detection) in automated optical inspection systems. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator interfacing to CMOS sensors and frame grabbers via LVDS and DDR memory controllers. Use Value: Delivers >200 MP/s throughput using distributed RAM and dedicated multipliers, eliminating external frame buffers. | Use Scenario: DICOM-compliant data aggregation and real-time compression from ultrasound or MRI front-end modules. IC Role / Device Role / Timing Role: Protocol bridge between analog front-end ADCs and Gigabit Ethernet or PCI Express host interface. Use Value: Integrates JPEG2000 encoder logic and DMA controller to reduce host CPU load and ensure deterministic transfer timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX60-10FFG1152I | Higher logic density (60K LC), 24 MGT lanes, larger 1152-pin FFG package | Required for designs needing >40K logic cells or >16 transceiver lanes | Select when scalability beyond XC4VFX40-10FFG672I resources is confirmed in early architecture review |
| XCVU3P-2FFVB2104I | Virtex UltraScale+ device with 395K logic cells, 24 GTY transceivers (16.3 Gbps), and quad-core ARM Cortex-A53 | Supports PCIe Gen3, DDR4, and advanced video codecs not feasible on Virtex-4 platform | Choose for new designs targeting long-term roadmap compatibility and higher bandwidth, accepting migration effort |
Compared with XC4VFX40-10FFG672I, the XC4VFX60-10FFG1152I extends capacity within the same architecture, while the XCVU3P-2FFVB2104I represents a generational leap in performance, integration, and protocol support-requiring full RTL and board redesign but enabling future-proof system architecture.
Availability
XC4VFX40-10FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and industrial imaging applications requiring stable component supply and long lifecycle support.
Supply support for XC4VFX40-10FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio. Xilinx pioneered high-performance programmable logic for demanding compute and signal processing applications.
The Virtex-4 FX family was designed specifically for embedded computing applications requiring tightly coupled processor logic and high-speed serial I/O-targeting aerospace, telecom, and medical imaging systems where integration, determinism, and bandwidth are critical.
FAQ
What is the maximum supported transceiver data rate for XC4VFX40-10FFG672I?
The XC4VFX40-10FFG672I supports a maximum transceiver line rate of 3.125 Gbps per lane. This is validated across all 16 MGT lanes under industrial temperature conditions and is compatible with protocols including PCI Express 1.0, Serial RapidIO 1.x, and Gigabit Ethernet physical layer interfaces.
Does XC4VFX40-10FFG672I include embedded processor cores?
Yes, XC4VFX40-10FFG672I integrates two hard PowerPC 405 RISC processor cores with dedicated instruction and data caches, debug interfaces, and memory controllers. These cores operate independently of the FPGA fabric and enable concurrent software-driven control and hardware-accelerated datapath execution.
What configuration methods are supported by XC4VFX40-10FFG672I?
XC4VFX40-10FFG672I supports multiple configuration modes: JTAG boundary-scan, Master/Slave SelectMAP parallel, and Master/Slave Serial PROM. Configuration can be initiated via PROGRAM_B pin or automatically on power-up when using a compliant PROM device connected to the dedicated configuration interface.
Is XC4VFX40-10FFG672I qualified for industrial temperature operation?
Yes, XC4VFX40-10FFG672I carries the "I" suffix denoting industrial temperature grade, rated for continuous operation from -40°C to +100°C junction temperature. Thermal design must account for power dissipation in the FFG672 package, especially under full MGT and logic utilization.
What I/O standards are supported on XC4VFX40-10FFG672I banks?
XC4VFX40-10FFG672I supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and differential standards including LVDS, RSDS, and BLVDS across its 24 I/O banks. Each bank operates at a single VCCO voltage (1.2 V to 3.3 V), enabling mixed-standard interfacing without external level shifters.
XC4VFX40-10FFG672I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4656
- Number of Logic Elements/Cells:
- 41904
- Total RAM Bits:
- 2654208
- Number of I/O:
- 352
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC4VFX40-10FFG672I FAQ
1.How can I place an order for XC4VFX40-10FFG672I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX40-10FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX40-10FFG672I reliable?
The price and inventory of XC4VFX40-10FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX40-10FFG672I is usually 5 days.
3.What payment methods are accepted for XC4VFX40-10FFG672I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX40-10FFG672I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX40-10FFG672I?
XC4VFX40-10FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX40-10FFG672I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX40-10FFG672I?
For technical support, including XC4VFX40-10FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX40-10FFG672I requirements.
6.How does Aetrix verify that XC4VFX40-10FFG672I is sourced from the original manufacturer or authorized distributors?
All XC4VFX40-10FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX40-10FFG672I meets industry standards.
7.What is the process for return or replacement of XC4VFX40-10FFG672I?
All XC4VFX40-10FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX40-10FFG672I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX40-10FFG672I part is unused and in its original packaging.
Return procedure for XC4VFX40-10FFG672I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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