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AMD XC4VFX40-11FFG672C
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- Part No.:
- XC4VFX40-11FFG672C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC4VFX40-11FFG672C.pdf
- Description:
- IC FPGA 352 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,926
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Product details
Overview
XC4VFX40-11FFG672C from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 40,000 logic cells, embedded PowerPC 405 RISC processors, and integrated RocketIO multi-gigabit transceivers operating up to 3.75 Gbps. It supports PCI Express x4 endpoint functionality and is used in high-performance communication line cards requiring protocol acceleration and real-time signal processing.
For engineers reviewing the XC4VFX40-11FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal performance in compact carrier board layouts.
Technical Context
The XC4VFX40-11FFG672C integrates two hard-core PowerPC 405 processors with on-chip memory and AXI-compatible bus interfaces, enabling embedded software execution alongside programmable logic. Its 16 RocketIO transceivers are configurable as PCIe Gen1 endpoints, Serial RapidIO, or custom protocols with built-in encoding/decoding and clock data recovery.
It implements SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards across 448 user I/Os. The device uses 90 nm copper process technology and operates at -40°C to +85°C junction temperature with 1.2 V core supply and multiple I/O bank voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 40,000 - determines maximum combinational and sequential logic capacity for custom datapaths and control units |
| Embedded Processors | 2× PowerPC 405 - enables dual-threaded firmware execution without external CPU, reducing BOM and latency |
| RocketIO Transceivers | 16 lanes, up to 3.75 Gbps - supports PCIe x4 endpoint or dual x2 links with full protocol stack offload capability |
| User I/O Pins | 448 - provides high-density interface flexibility across multiple voltage standards and signaling types |
| Core Voltage | 1.2 V - defines power delivery network requirements and impacts dynamic power consumption at 11-speed grade |
| Operating Temperature | -40°C to +85°C - qualifies for industrial and telecom infrastructure deployment without derating |
Pinout & Package
XC4VFX40-11FFG672C is housed in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered and regulated at 1.2 V ±3% with low-ESR capacitors near all corners of die |
| VCCAUX | Auxiliary power supply | Supplies configuration logic, JTAG, and transceiver reference circuits at 2.5 V |
| VRP/VRN | Reference voltage pair | Defines termination voltage for differential I/O standards like LVDS and RSDS in associated banks |
| MGTREFCLK | Transceiver reference clock input | Accepts 100–300 MHz differential clock for PLL locking; jitter tolerance ≤1.5 ps RMS |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hard PowerPC 405 cores | Enables deterministic real-time firmware execution independent of FPGA fabric timing closure |
| RocketIO transceivers with PCS/PMA | Reduces PHY-layer design effort by integrating 8B/10B encoding, elastic buffers, and CDR circuitry |
| SelectIO technology with multi-standard support | Allows mixed-voltage I/O banks on single device, simplifying interface to legacy and modern peripherals |
| PCI Express Endpoint LogiCORE IP support | Provides verified, synthesis-ready RTL for PCIe x1/x2/x4 configurations compliant with v1.0a/v1.1 |
Applications
| Telecom Line Card | Medical Imaging Accelerator |
|---|---|
Use Scenario: High-density packet processing in 10G Ethernet and SONET/SDH aggregation platforms. IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, deep packet inspection, and traffic shaping; PowerPC cores run control plane software. Use Value: Integrated transceivers eliminate external SerDes, reducing board area and signal integrity complexity while maintaining sub-100 ns latency. | Use Scenario: Real-time reconstruction pipeline in CT/MRI systems requiring parallel math-intensive computation. IC Role / Device Role / Timing Role: Configurable logic executes custom FFT and back-projection kernels; PowerPC manages data flow and host interface. Use Value: 40K logic cells and dual processors enable simultaneous image reconstruction and DICOM export without external compute offload. |
| Avionics Data Concentrator | Industrial Protocol Gateway |
Use Scenario: ARINC 664 (AFDX) end-system interfacing with legacy MIL-STD-1553 and ARINC 429 buses. IC Role / Device Role / Timing Role: FPGA implements time-triggered AFDX MAC and deterministic scheduling; PowerPC handles health monitoring and diagnostics. Use Value: Hardened transceivers meet DO-254 DAL-A timing constraints; dual-core redundancy supports fault-tolerant partitioning. | Use Scenario: Fieldbus-to-Ethernet gateway bridging PROFIBUS, CANopen, and EtherCAT to industrial IoT cloud platforms. IC Role / Device Role / Timing Role: FPGA implements protocol state machines and cyclic redundancy checks; PowerPC runs Linux-based edge application stack. Use Value: 448 I/Os support concurrent multi-protocol physical layer interfaces; integrated PCIe enables high-throughput host CPU communication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VFX60-11FFG1152C | 60K logic cells, 24 RocketIO transceivers, larger FFG1152 package | Supports higher-bandwidth PCIe x8 or dual x4 links; requires larger PCB footprint and enhanced thermal management | Choose when XC4VFX40-11FFG672C logic or transceiver resources are insufficient for target throughput or integration scope |
| XCVU3P-2FFVD1760E | UltraScale architecture, 345K logic cells, 20 GTY transceivers up to 32.75 Gbps, 0.85 V core | Targets next-generation 100G+ interconnects and AI-accelerated workloads; not pin-compatible and requires full HDL migration | Choose for new designs requiring >10 Gbps serial bandwidth or advanced DSP slices; not a drop-in replacement for XC4VFX40-11FFG672C |
Compared with XC4VFX40-11FFG672C, XC4VFX60-11FFG1152C offers scalable resources within the same Virtex-4 FX family and toolchain, while XCVU3P-2FFVD1760E represents a generational leap in bandwidth and density but demands architectural redesign and new IP integration.
Availability
XC4VFX40-11FFG672C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX40-11FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for high-performance computing and embedded systems.
The Virtex-4 FX family was originally designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding communications and signal processing applications.
FAQ
What is the maximum supported data rate per RocketIO transceiver in XC4VFX40-11FFG672C?
The XC4VFX40-11FFG672C supports RocketIO transceivers rated up to 3.75 Gbps per lane. This rate is validated under specified conditions including proper reference clock jitter (≤1.5 ps RMS), controlled impedance routing, and recommended PCB stack-up. Actual achievable throughput depends on protocol encoding overhead and link training success.
Does XC4VFX40-11FFG672C include on-chip memory for the PowerPC 405 processors?
Yes, XC4VFX40-11FFG672C integrates 64 KB of on-chip Block RAM per PowerPC 405 core, accessible via dedicated local memory bus. This memory is used for instruction and data storage, eliminating need for external SRAM in many boot and real-time control scenarios. Total available BRAM is 2,088 Kbits shared across fabric and processors.
What configuration modes does XC4VFX40-11FFG672C support?
XC4VFX40-11FFG672C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration bitstream can be loaded from external PROM (e.g., XCFxxP series), microprocessor, or boundary-scan controller. Multi-boot capability allows dual-bitstream storage with fallback selection via mode pins.
Is XC4VFX40-11FFG672C qualified for automotive applications?
No, XC4VFX40-11FFG672C is specified for industrial temperature range (-40°C to +85°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure rate reporting, and extended temperature screening. For automotive use, designers should evaluate AMD's XA (Automotive) grade Virtex-7 or Versal derivatives instead.
What software tools are required to develop for XC4VFX40-11FFG672C?
XC4VFX40-11FFG672C development requires Xilinx ISE Design Suite 14.7 or earlier, which includes synthesis (XST), implementation (Map/Par), and bitstream generation tools. PowerPC software development uses Xilinx EDK 14.7 with GNU toolchain and standalone or Xilkernel BSPs. Vivado does not support Virtex-4 devices.
XC4VFX40-11FFG672C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4656
- Number of Logic Elements/Cells:
- 41904
- Total RAM Bits:
- 2654208
- Number of I/O:
- 352
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC4VFX40-11FFG672C FAQ
1.How can I place an order for XC4VFX40-11FFG672C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX40-11FFG672C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX40-11FFG672C reliable?
The price and inventory of XC4VFX40-11FFG672C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX40-11FFG672C is usually 5 days.
3.What payment methods are accepted for XC4VFX40-11FFG672C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX40-11FFG672C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX40-11FFG672C?
XC4VFX40-11FFG672C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX40-11FFG672C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX40-11FFG672C?
For technical support, including XC4VFX40-11FFG672C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX40-11FFG672C requirements.
6.How does Aetrix verify that XC4VFX40-11FFG672C is sourced from the original manufacturer or authorized distributors?
All XC4VFX40-11FFG672C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX40-11FFG672C meets industry standards.
7.What is the process for return or replacement of XC4VFX40-11FFG672C?
All XC4VFX40-11FFG672C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX40-11FFG672C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX40-11FFG672C part is unused and in its original packaging.
Return procedure for XC4VFX40-11FFG672C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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