AMD XC4VFX40-11FFG672I

Overview

XC4VFX40-11FFG672I from AMD (formerly Xilinx) is a Virtex-4 FX family FPGA featuring 40,192 logic cells, 288 embedded 18×18 multipliers, and integrated PowerPC 405 RISC processors. It includes 2.5 Mb of block RAM, supports DDR2 memory interfaces up to 400 MHz, and is packaged in a 672-pin Fine-Pitch Flip-Chip BGA (FFG672). It targets high-performance embedded processing and communication infrastructure applications.

For engineers reviewing the XC4VFX40-11FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), speed grade (-11 = 1.1 V core, -11 speed bin), thermal performance in industrial temperature range (-40°C to +100°C), and compatibility with Xilinx ISE 14.7 design tools.

Technical Context

The XC4VFX40-11FFG672I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hard-core PowerPC 405 processors running at up to 500 MHz. It integrates RocketIO™ multi-gigabit transceivers supporting 622 Mbps to 3.75 Gbps serial links, and features SelectIO™ technology for programmable I/O standards including LVDS, SSTL, HSTL, and PCI-X.

Its clock management includes four Digital Clock Managers (DCMs) per device, enabling precise phase alignment, frequency synthesis, and duty-cycle correction across multiple clock domains. The device supports partial reconfiguration and uses 90 nm copper process technology with 1.2 V core voltage operation.

Key Specifications

Pinout & Package

XC4VFX40-11FFG672I is housed in a 672-pin Fine-Pitch Flip-Chip BGA (FFG672) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal dissipation is managed via internal thermal slug and requires PCB-level thermal vias under the die area.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded FPGA applications.

Compared with XC4VFX40-11FFG672I, the XC4VFX60-11FFG1148I offers scalable logic and transceiver resources within the same Virtex-4 FX family, while the XCVU3P-2FFVB2104I represents a generational shift toward higher-density, transceiver-optimized architectures without legacy processor cores-requiring toolchain and IP migration.

Availability

XC4VFX40-11FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and avionics applications requiring stable component supply and long-term lifecycle support.

Supply support for XC4VFX40-11FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-4 FX family was originally designed by Xilinx to integrate programmable logic with embedded processing and high-speed serial I/O-targeting communications infrastructure, defense systems, and high-end test equipment.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in the XC4VFX40-11FFG672I?

The XC4VFX40-11FFG672I integrates two hard PowerPC 405 RISC processors, each capable of operating up to 500 MHz under industrial temperature conditions. This frequency is achievable when using the -11 speed grade with proper decoupling, thermal management, and 1.1 V VCCINT supply. The actual sustained clock rate depends on system-level timing closure and clock domain synchronization with the FPGA fabric.

Does the XC4VFX40-11FFG672I support JTAG boundary-scan testing?

Yes, the XC4VFX40-11FFG672I fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. Its TAP controller is compliant with Xilinx's standard configuration chain and works with iMPACT and Vivado Hardware Manager tools. All 448 user I/Os and internal logic can be accessed via boundary-scan instructions such as SAMPLE/PRELOAD, EXTEST, and INTEST.

What configuration modes are supported by the XC4VFX40-11FFG672I?

The XC4VFX40-11FFG672I supports Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI PROM, parallel flash, or host processor via dedicated configuration pins. Mode selection is controlled by the MODE pins (M2:M0) at power-up, and all modes are compatible with Xilinx ISE 14.7 toolflow.

Is the XC4VFX40-11FFG672I RoHS-compliant and lead-free?

Yes, the XC4VFX40-11FFG672I is manufactured in a Pb-free (RoHS-compliant) process with matte tin finish on solder balls. The FFG672 package uses lead-free solder spheres meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation-including substance declarations and test reports-is available through AMD's product change notifications and material content portals.

Can the XC4VFX40-11FFG672I interface directly with DDR2 SDRAM at 400 MHz?

Yes, the XC4VFX40-11FFG672I includes dedicated DDR2 memory controller logic supporting data rates up to 400 MHz (200 MHz clock, double-data-rate). It provides programmable read/write leveling, on-die termination control, and calibration support for x8/x16/x32 configurations. Interface reliability requires adherence to Xilinx UG071 guidelines for PCB layout, termination, and timing constraints.