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AMD XC4VFX60-10FF672C
.JPG)
- Part No.:
- XC4VFX60-10FF672C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC4VFX60-10FF672C.pdf
- Description:
- IC FPGA 352 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,460
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Product details
Overview
XC4VFX60-10FF672C from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes integrated tri-mode Ethernet MACs. Used in high-performance reconfigurable networking and signal processing systems.
For engineers reviewing the XC4VFX60-10FF672C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), -10 speed grade timing, FF672 flip-chip BGA package, and integrated hard IP for embedded processing and connectivity.
Technical Context
The XC4VFX60-10FF672C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its embedded PowerPC 405 cores operate at up to 500 MHz and support JTAG debug and on-chip memory mapping.
It integrates 24 transceivers supporting RocketIO™ GTP (up to 3.125 Gbps), 8 tri-mode Ethernet MACs, and PCI Express™ x4 endpoint capability. Configuration is via Master SelectMAP or serial PROM interface with bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,192 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Embedded Multipliers | 288 × 18×18 - enables parallel DSP operations including FIR filtering and FFT computation |
| Block RAM | 2,880 kbits - provides on-die memory for buffering, lookup tables, and FIFO implementation |
| Speed Grade | -10 - guarantees worst-case propagation delay performance across industrial temperature range |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - supports direct interfacing with DDR2, QDR SRAM, and legacy peripherals |
| Transceiver Count | 24 RocketIO GTP - delivers 24 independent serial links up to 3.125 Gbps for high-speed backplane or optical interface |
| Embedded Processors | Dual PowerPC 405 - enables soft-core offload, real-time control, and boot management without external CPU |
Pinout & Package
XC4VFX60-10FF672C is housed in a 672-pin flip-chip fine-pitch BGA (FF672) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction. Thermal pad on underside requires PCB thermal via array per Xilinx UG070.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTCLK | Transceiver Reference Clock Input | Provides low-jitter clock source for RocketIO GTP transceivers; must be routed with controlled impedance and matched length |
| PROGRAM_B | Configuration Initiation | Active-low asynchronous reset that clears configuration memory and initiates reload from external PROM or host |
| INIT_B | Configuration Status Output | Open-drain indicator signaling successful bitstream CRC check and readiness for startup sequence |
| CCLK | Configuration Clock | Drives synchronous configuration data loading in Master SelectMAP mode; frequency ≤ 50 MHz |
| POWERDOWN | Transceiver Power Control | Asserting disables GTP analog circuitry to reduce dynamic power during idle periods |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables asymmetric multiprocessing: one core handles protocol stack while the other manages real-time I/O scheduling |
| Integrated Tri-Mode Ethernet MACs | Reduces external PHY count and simplifies 10/100/1000BASE-T interface design with MII/GMII/RGMII support |
| RocketIO GTP Transceivers | Supports native SATA, Serial RapidIO, and CPRI protocols without external SerDes or retiming ICs |
| PCI Express Endpoint Logic | Provides compliant x4 link layer and transaction layer, eliminating need for PCIe bridge ASIC in endpoint applications |
| Bitstream Encryption | Prevents reverse engineering of programmable logic by enforcing AES-128 decryption before configuration load |
Applications
| Wireless Baseband Processing | High-Speed Network Line Cards |
|---|---|
Use Scenario: Real-time channel coding, MIMO signal processing, and RF front-end control in LTE/5G macro base stations. IC Role / Device Role / Timing Role: Reconfigurable baseband processor with deterministic latency for symbol-level pipeline execution. Use Value: Combines DSP throughput from 288 multipliers and low-latency interconnect to meet 3GPP subframe timing constraints. | Use Scenario: Packet classification, deep packet inspection, and traffic shaping in 10 GbE line cards for carrier-grade routers. IC Role / Device Role / Timing Role: Programmable forwarding engine with integrated Ethernet MACs and PCIe x4 host interface. Use Value: Eliminates external switch fabric and reduces board area by integrating 8 MACs and 24 GTP lanes for multi-port backplane connectivity. |
| Avionics Data Concentrators | Medical Imaging Acceleration |
Use Scenario: ARINC 664 (AFDX) end-system aggregation and deterministic time-triggered communication in flight control systems. IC Role / Device Role / Timing Role: Deterministic network controller with hardware timestamping and bandwidth reservation logic. Use Value: Meets DO-254 DAL-A requirements using dual PowerPC cores for separation of safety-critical and non-critical partitions. | Use Scenario: Real-time reconstruction of CT/MRI image volumes using iterative algorithms and back-projection kernels. IC Role / Device Role / Timing Role: High-throughput compute accelerator tightly coupled to DDR2 memory subsystem and DMA engines. Use Value: Achieves >2× speedup over fixed-ASIC solutions via parallelized 18×18 multiplier arrays and 2,880 kbits on-chip RAM for coefficient caching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX80-11FF1148I | No embedded PowerPC cores; higher logic density (80,640 CLBs); larger FF1148 package | Better suited for pure logic-intensive tasks like video encoding pipelines without embedded software stacks | Select when system requires maximum fabric resources and no hard processor is needed |
| XC5VLX110-2FF1136C | Virtex-5 generation; 110k logic cells; no PowerPC but includes MicroBlaze soft CPU option; improved transceiver jitter specs | Offers migration path with enhanced DSP slice efficiency and lower static power, but requires full HDL and toolchain update | Choose for new designs targeting longer lifecycle and better power efficiency, accepting FPGA tool requalification effort |
Compared with XC4VFX60-10FF672C, XC4VLX80-11FF1148I trades embedded processing for raw logic capacity, while XC5VLX110-2FF1136C provides architectural evolution with updated transceivers and reduced power-but mandates redesign due to non-pin-compatible packaging and toolchain incompatibility.
Availability
XC4VFX60-10FF672C is available at Aetrix Electronics and suitable for aerospace avionics, medical imaging systems, and telecom infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX60-10FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and AI acceleration technologies.
The Virtex-4 FX family was designed for high-performance embedded systems requiring integrated processing, high-speed serial I/O, and programmable logic in a single device-targeting networking, defense, and scientific computing.
FAQ
What is the operating temperature range for XC4VFX60-10FF672C?
The XC4VFX60-10FF672C is rated for industrial temperature operation from –40°C to +85°C ambient. This range applies to the C-grade speed bin and is validated per Xilinx DS112 specification. Thermal management must account for power dissipation up to 12.3 W under typical routing and switching activity, requiring appropriate PCB copper pour and thermal vias beneath the FF672 package.
Does XC4VFX60-10FF672C support JTAG boundary-scan testing?
Yes, XC4VFX60-10FF672C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional ones (IDCODE, USERCODE). JTAG pins (TCK, TMS, TDI, TDO) are dedicated and electrically isolated from user I/O banks.
Can XC4VFX60-10FF672C configure from SPI flash memory?
No, XC4VFX60-10FF672C does not support native SPI flash configuration. It requires Master SelectMAP mode using parallel NOR flash or serial PROM (Xilinx XCFxxP series) with dedicated PROM interface pins. SPI flash may be used indirectly via PowerPC firmware executing a custom loader, but this adds boot-time latency and complexity not present in standard configuration flows.
What is the maximum supported DDR2 memory clock frequency for XC4VFX60-10FF672C?
XC4VFX60-10FF672C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock), compliant with JEDEC DDR2-400 specification. This requires use of dedicated DQS groups and phase-matched routing; timing closure is achievable only with -10 speed grade and proper PCB stack-up design per Xilinx UG070 guidelines.
Is bitstream encryption enabled by default on XC4VFX60-10FF672C?
No, bitstream encryption is disabled by default on XC4VFX60-10FF672C. It must be explicitly enabled during bitstream generation using Xilinx ISE tools with AES-128 key programming into on-chip eFUSE. Once programmed, the device will refuse configuration unless the correct encrypted bitstream is presented, providing tamper-resistant IP protection for deployed XC4VFX60-10FF672C units.
XC4VFX60-10FF672C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6320
- Number of Logic Elements/Cells:
- 56880
- Total RAM Bits:
- 4276224
- Number of I/O:
- 352
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC4VFX60-10FF672C FAQ
1.How can I place an order for XC4VFX60-10FF672C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX60-10FF672C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX60-10FF672C reliable?
The price and inventory of XC4VFX60-10FF672C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-10FF672C is usually 5 days.
3.What payment methods are accepted for XC4VFX60-10FF672C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-10FF672C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX60-10FF672C?
XC4VFX60-10FF672C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX60-10FF672C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX60-10FF672C?
For technical support, including XC4VFX60-10FF672C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-10FF672C requirements.
6.How does Aetrix verify that XC4VFX60-10FF672C is sourced from the original manufacturer or authorized distributors?
All XC4VFX60-10FF672C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-10FF672C meets industry standards.
7.What is the process for return or replacement of XC4VFX60-10FF672C?
All XC4VFX60-10FF672C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-10FF672C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX60-10FF672C part is unused and in its original packaging.
Return procedure for XC4VFX60-10FF672C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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