AMD XC4VFX60-10FFG1152C
- Part No.:
- XC4VFX60-10FFG1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC4VFX60-10FFG1152C.pdf
- Description:
- IC FPGA 576 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VFX60-10FFG1152C from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 32 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes integrated RocketIO™ multi-gigabit transceivers operating at 622 Mbps–3.75 Gbps. Used in high-performance communication line cards requiring protocol processing and real-time packet handling.
For engineers reviewing the XC4VFX60-10FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded processor count, transceiver lane count and data rate, block RAM capacity, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal performance in FFG1152 package.
Technical Context
The XC4VFX60-10FFG1152C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and hard IP cores including two PowerPC 405 cores, 24 RocketIO transceivers, and PCI Express™ Endpoint logic. It supports partial reconfiguration and offers clock management via Digital Clock Managers (DCMs) with phase-matching and frequency synthesis capabilities.
This device targets systems requiring hardware-accelerated control plane processing and high-speed serial interconnects-such as 10G Ethernet edge routers and wireless baseband units-where deterministic latency, multi-protocol flexibility, and on-chip processing coexistence are essential design requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,192 - determines maximum combinational/sequential logic capacity for custom datapaths and state machines |
| Embedded Multipliers | 32 × 18×18-bit - enables parallel MAC operations for filtering, FFT, and modulation algorithms |
| RocketIO Transceivers | 24 lanes, 622 Mbps–3.75 Gbps - supports SONET/SDH, 10G Ethernet, and CPRI physical layer links |
| Block RAM | 3,888 kbits - provides on-die memory for FIFOs, buffers, and coefficient storage without external SRAM |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards - enables direct interfacing to DDR2, QDR, and SERDES PHYs |
| PowerPC Cores | 2 × PowerPC 405 - delivers 400+ DMIPS each for embedded control, protocol stack execution, and host interface management |
Pinout & Package
XC4VFX60-10FFG1152C is housed in a 1152-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1152) package with 0.8 mm pitch, designed for high-density PCB layouts and thermal dissipation in telecom infrastructure applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.2 V or 2.5 V supply for configuration, clocking, and transceiver reference circuits |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2 V/1.5 V/1.8 V/2.5 V) enabling mixed-voltage I/O interfacing |
| MR | Master Reset | Asynchronous global reset input that clears configuration registers and logic states |
| PROGRAM_B | Configuration initiate | Active-low signal triggering full reconfiguration from external PROM or processor |
| CLK0–CLK3 | Global clock inputs | Dedicated low-skew inputs feeding DCMs and global clock networks |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 processors | Enables concurrent firmware execution and hardware acceleration within single die-reducing inter-processor latency and board-level routing complexity |
| 24 RocketIO transceivers | Provides native multi-protocol serial connectivity (e.g., 10G Ethernet, CPRI, Serial RapidIO) without external PHYs or retimers |
| PCI Express Endpoint logic | Hard IP block supporting x1/x2/x4 PCIe Gen1 links-eliminates soft-core implementation overhead and timing closure risk |
| Partial reconfiguration support | Allows dynamic swapping of logic modules during operation-critical for adaptive radio and protocol-upgradeable network equipment |
Applications
| 10G Ethernet Line Card | Wireless Baseband Unit |
|---|---|
Use Scenario: Aggregating and switching 10G Ethernet traffic in metro edge routers with deep packet inspection. IC Role / Device Role / Timing Role: FPGA fabric performs packet classification and forwarding; PowerPC cores run control-plane software; RocketIO handles SERDES conversion. Use Value: Integrates switch fabric, CPU, and PHY into one device-reducing component count, power, and board area versus discrete solutions. | Use Scenario: Real-time digital pre-distortion (DPD) and MIMO signal processing in LTE/5G macro base stations. IC Role / Device Role / Timing Role: DSP slices execute DPD algorithms; RocketIO interfaces to remote radio heads via CPRI; PowerPC manages transport layer protocols. Use Value: Achieves sub-100 ns loop latency for closed-loop DPD adaptation-unattainable with off-chip processor+FPGA combinations. |
| Satcom Modem | Defense Radar Signal Processor |
Use Scenario: Forward error correction, modulation/demodulation, and beamforming control in airborne satellite terminals. IC Role / Device Role / Timing Role: Configurable logic implements LDPC decoding and QAM mapping; PowerPC handles link-layer framing and telemetry. Use Value: Single-chip solution meets SWaP-C constraints while supporting multiple waveform standards through reconfiguration. | Use Scenario: Pulse compression, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne radar systems. IC Role / Device Role / Timing Role: Block RAM buffers ADC streams; DSP slices perform FFT-based matched filtering; PowerPC coordinates sensor fusion and reporting. Use Value: On-chip memory bandwidth (3.888 Mbits) eliminates external memory bottlenecks for real-time SAR processing at 100+ MSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA with embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 1,182K logic cells, 64 DSP slices, 24 GTY transceivers (up to 32.75 Gbps) | Targets next-gen 400G/800G systems requiring higher throughput and lower latency than XC4VFX60-10FFG1152C supports | Select when migrating to newer process node, higher bandwidth, or PCIe Gen4/Gen5 endpoints |
| XC5VLX110T-1FF1136C | Virtex-5 architecture, 110K logic cells, no embedded PowerPC, 12 RocketIO GTP transceivers (up to 3.75 Gbps) | Offers larger logic capacity but lacks dual-hard CPU cores-requires external processor for control-plane tasks | Select when logic density is primary requirement and embedded processing is handled externally |
Compared with XC4VFX60-10FFG1152C, XCVU9P-2FLGA2104I delivers 20× more logic and 10× higher transceiver speed but requires new PCB layout and toolchain migration; XC5VLX110T-1FF1136C provides greater fabric resources at same transceiver speed but removes integrated CPU functionality-shifting control software to external host.
Availability
XC4VFX60-10FFG1152C is available at Aetrix Electronics and suitable for 10G Ethernet line cards, wireless baseband units, satcom modems, and defense radar signal processors requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX60-10FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, CPU, GPU, and AI engine architectures for data center, embedded, and adaptive SoC markets.
The Virtex-4 FX family was originally designed by Xilinx to integrate programmable logic with hardened processor subsystems and high-speed serial I/O-targeting communications infrastructure demanding both hardware acceleration and embedded software execution.
FAQ
What is the maximum data rate supported by the RocketIO transceivers in XC4VFX60-10FFG1152C?
The XC4VFX60-10FFG1152C integrates 24 RocketIO transceivers rated for 622 Mbps to 3.75 Gbps per lane. This range supports industry standards including OC-48, 10G Ethernet WAN PHY, and CPRI Option 3. Operation at 3.75 Gbps requires proper PCB layout, controlled impedance traces, and appropriate termination per Xilinx UG078.
Does XC4VFX60-10FFG1152C support partial reconfiguration?
Yes, XC4VFX60-10FFG1152C supports partial reconfiguration through its SelectMAP interface and configuration logic. This capability allows dynamic replacement of specific logic modules without resetting the entire device-enabling runtime protocol adaptation in wireless baseband or field-upgradable radar modes.
What I/O voltage standards are compatible with XC4VFX60-10FFG1152C?
XC4VFX60-10FFG1152C supports multiple I/O standards per bank, including LVCMOS 1.2 V/1.5 V/1.8 V/2.5 V, LVTTL, SSTL-2, SSTL-3, HSTL-I, and differential standards such as LVDS and RSDS. Each I/O bank is independently configurable for voltage and standard, enabling mixed-interface designs like DDR2 memory + Gigabit Ethernet PHY.
How many block RAMs does XC4VFX60-10FFG1152C contain, and what is their total capacity?
XC4VFX60-10FFG1152C contains 192 block RAM primitives, each 18 kbits, yielding a total capacity of 3,456 kbits. When configured as dual-port memory, this provides 3,888 kbits usable for FIFOs, coefficient tables, or frame buffers-critical for real-time signal processing pipelines.
Is XC4VFX60-10FFG1152C still in active production?
XC4VFX60-10FFG1152C is a legacy Virtex-4 device discontinued by Xilinx in 2011. Aetrix Electronics maintains verified inventory and long-term supply support through authorized channels and traceable sources, fulfilling requirements for maintenance, repair, and obsolescence mitigation in deployed telecom and defense systems.
XC4VFX60-10FFG1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6320
- Number of Logic Elements/Cells:
- 56880
- Total RAM Bits:
- 4276224
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC4VFX60-10FFG1152C FAQ
1.How can I place an order for XC4VFX60-10FFG1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX60-10FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX60-10FFG1152C reliable?
The price and inventory of XC4VFX60-10FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-10FFG1152C is usually 5 days.
3.What payment methods are accepted for XC4VFX60-10FFG1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-10FFG1152C transactions.
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4.How is shipping managed for XC4VFX60-10FFG1152C?
XC4VFX60-10FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX60-10FFG1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX60-10FFG1152C?
For technical support, including XC4VFX60-10FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-10FFG1152C requirements.
6.How does Aetrix verify that XC4VFX60-10FFG1152C is sourced from the original manufacturer or authorized distributors?
All XC4VFX60-10FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-10FFG1152C meets industry standards.
7.What is the process for return or replacement of XC4VFX60-10FFG1152C?
All XC4VFX60-10FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-10FFG1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX60-10FFG1152C part is unused and in its original packaging.
Return procedure for XC4VFX60-10FFG1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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