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AMD XC4VFX60-10FFG672I

Part No.:
XC4VFX60-10FFG672I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
672-BBGA, FCBGA
Datasheet:
AetrixXC4VFX60-10FFG672I.pdf
Description:
IC FPGA 352 I/O 672FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,127

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Product details

Overview

XC4VFX60-10FFG672I from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes integrated RocketIO™ multi-gigabit transceivers operating at 622 Mbps–3.125 Gbps. It is used in high-performance communication line cards requiring protocol processing and packet forwarding.

For engineers reviewing the XC4VFX60-10FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal performance in air-cooled telecom chassis.

Technical Context

The XC4VFX60-10FFG672I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its dual PowerPC 405 cores run independently at up to 500 MHz and support cache coherency via the internal PLB bus.

RocketIO transceivers are organized in four banks of eight channels each, supporting protocols including PCI Express Gen1, Serial RapidIO, and Gigabit Ethernet. The device uses SelectIO™ technology for flexible single-ended and differential I/O standards including LVDS, SSTL, and HSTL.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells60,192 - determines maximum combinational and sequential logic capacity for custom datapaths
Embedded Multipliers288 × 18×18 - enables parallel DSP operations for filtering, FFT, and modulation
Block RAM2,880 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external SRAM
RocketIO Transceivers32 channels, 622 Mbps–3.125 Gbps - supports multi-protocol serial interconnects with built-in encoding/decoding
PowerPC Cores2 × 405 - enables embedded software execution alongside hardware acceleration in same die
I/O StandardsLVDS, SSTL-2, SSTL-18, HSTL, LVCMOS - allows direct interface to DDR2, QDR, and SERDES PHYs
Max I/O Pins448 - supports high-pin-count system integration with mixed-voltage domain routing

Pinout & Package

The XC4VFX60-10FFG672I is housed in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal characteristics include θJA = 10.5°C/W (typical, 4-layer board).

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V ±3% required for CLB, RAM, and processor logic; decoupling critical for signal integrity
VCCAUXAuxiliary power supply2.5 V ±5% powers configuration logic, JTAG, and transceiver reference circuits
VCCO_0–VCCO_15I/O bank powerConfigurable per-bank voltage (1.2–2.5 V) enabling mixed-standard interface design
MRMaster resetActive-low asynchronous reset controlling FPGA configuration state and PowerPC core initialization
CLKINPrimary clock inputDedicated global clock buffer input supporting single-ended or differential (LVDS/LVPECL) sources
MD[0:2]Configuration mode selectThree-pin strap defining boot source: Master Serial, Slave Serial, or JTAG configuration

Key Features

FeatureDesign Value
Dual PowerPC 405 processorsEnables concurrent firmware-driven control and real-time hardware acceleration without external CPU
32 RocketIO transceiversReduces need for discrete SerDes chips in backplane and optical line card designs
SelectIO™ technologySupports 18 I/O standards in same device, simplifying interface to legacy and next-gen memory/PHYs
Embedded tri-mode Ethernet MACsOffloads TCP/IP stack processing from PowerPC cores, improving packet throughput at line rate
Partial reconfiguration supportAllows dynamic logic module swapping during operation, enabling adaptive protocol handling

Applications

Wireless Baseband ProcessingOptical Transport Line Cards

Use Scenario: Real-time channel coding, MIMO processing, and RF resource scheduling in LTE/5G macro base stations.

IC Role / Device Role / Timing Role: Configurable baseband accelerator hosting soft-core DSP kernels and managing data flow between ADC/DAC and MAC layer.

Use Value: 288 multipliers and 2,880 kbits block RAM enable parallel turbo decoding at 100+ Mbps without external memory bottleneck.

Use Scenario: OTN framing, GFP mapping, and FEC generation in 10G/40G DWDM line interface modules.

IC Role / Device Role / Timing Role: Protocol-aware transport processor integrating SONET/SDH framer, OTU2/OTU3 mapper, and forward error correction engine.

Use Value: Dual PowerPC 405 cores handle management plane tasks while hardware accelerators process OTN overhead in real time.

Defense Radar Signal ProcessingIndustrial Protocol Gateways

Use Scenario: Pulse compression, beamforming, and CFAR detection in AESA radar front-ends with deterministic latency requirements.

IC Role / Device Role / Timing Role: Time-critical DSP fabric synchronized to 100 MHz system clock with sub-cycle jitter tolerance.

Use Value: Dedicated DSP slices and low-latency block RAM deliver <50 ns processing delay for pulse correlation kernels.

Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in factory automation edge controllers.

IC Role / Device Role / Timing Role: Deterministic protocol translation engine with hardware-timed I/O scanning and cycle-synchronized Ethernet output.

Use Value: Integrated tri-mode Ethernet MACs and dual PowerPC cores support concurrent real-time fieldbus polling and industrial Ethernet frame generation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA-based protocol processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 1,182,240 LUTs, no embedded PowerPC, higher transceiver count (64 GTY)Targets 100G+ systems with PCIe Gen4 and 25G+ Ethernet; lacks hard processor subsystemChoose when migrating to newer architecture with higher bandwidth but accepting software-only control plane
XC5VLX110T-1FF1136IVirtex-5 LX family, 110K logic cells, no PowerPC, RocketIO GTP (3.75 Gbps max), no tri-mode MACsSuitable for non-processor-intensive logic acceleration; lower transceiver performance and no integrated Ethernet MACChoose for cost-sensitive upgrades where PowerPC and tri-mode MAC are not required

Compared with XC4VFX60-10FFG672I, the XCVU9P offers greater logic density and bandwidth but requires external ARM-based management; the XC5VLX110T retains Virtex-4 pin-compatible packaging but sacrifices processor integration and protocol offload capability.

Availability

XC4VFX60-10FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, defense radar, and industrial gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC4VFX60-10FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support for aerospace, defense, and telecom customers requiring long-term stability.

The Virtex-4 FX platform was designed specifically for embedded processing + high-speed serial connectivity in communications infrastructure, combining FPGA flexibility with hardened processor and transceiver subsystems.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX60-10FFG672I?

The XC4VFX60-10FFG672I supports dual PowerPC 405 cores running at up to 500 MHz under typical conditions with adequate cooling and voltage regulation. This frequency is achievable when VCCINT is maintained at 1.2 V ±3% and junction temperature remains below 85°C. The XC4VFX60-10FFG672I datasheet specifies this as the guaranteed maximum for commercial-grade operation.

Does XC4VFX60-10FFG672I support partial reconfiguration?

Yes, the XC4VFX60-10FFG672I supports partial reconfiguration through Xilinx ISE toolchain using modular design methodology. This capability allows dynamic replacement of logic modules without resetting the entire device or interrupting PowerPC execution. The XC4VFX60-10FFG672I implementation requires specific floorplanning and bitstream generation workflows defined in UG070.

What I/O standards are supported by XC4VFX672I's SelectIO™ technology?

The XC4VFX60-10FFG672I supports 18 I/O standards via SelectIO™, including LVDS, LVPECL, SSTL-2, SSTL-18, HSTL-I/III, and LVCMOS 1.2/1.5/1.8/2.5/3.3 V. Each I/O bank is independently configurable for voltage and standard, enabling mixed-interface designs. The XC4VFX60-10FFG672I documentation confirms compatibility with DDR2 SDRAM interfaces up to 400 MHz.

Is XC4VFX60-10FFG672I RoHS compliant?

Yes, the XC4VFX60-10FFG672I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) per Xilinx specification DS225 v2.1. The FFG672 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3. The XC4VFX60-10FFG672I is also qualified for industrial temperature range (–40°C to +100°C junction).

What configuration modes does XC4VFX60-10FFG672I support?

The XC4VFX60-10FFG672I supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes, selected via MD[2:0] pins at power-up. Configuration bitstreams can be loaded from SPI flash, PROM, or host processor over SelectMAP interface. The XC4VFX60-10FFG672I also supports fallback configuration and multi-bitstream storage in external memory.

XC4VFX60-10FFG672I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
6320
Number of Logic Elements/Cells:
56880
Total RAM Bits:
4276224
Number of I/O:
352
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
672-FCBGA (27x27)

XC4VFX60-10FFG672I FAQ

1.How can I place an order for XC4VFX60-10FFG672I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX60-10FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX60-10FFG672I reliable?

The price and inventory of XC4VFX60-10FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-10FFG672I is usually 5 days.

3.What payment methods are accepted for XC4VFX60-10FFG672I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-10FFG672I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX60-10FFG672I?

XC4VFX60-10FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX60-10FFG672I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX60-10FFG672I?

For technical support, including XC4VFX60-10FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-10FFG672I requirements.

6.How does Aetrix verify that XC4VFX60-10FFG672I is sourced from the original manufacturer or authorized distributors?

All XC4VFX60-10FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-10FFG672I meets industry standards.

7.What is the process for return or replacement of XC4VFX60-10FFG672I?

All XC4VFX60-10FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-10FFG672I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX60-10FFG672I part is unused and in its original packaging.

Return procedure for XC4VFX60-10FFG672I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX60-10FFG672I Tags

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