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AMD XC4VFX60-11FF1152I

Part No.:
XC4VFX60-11FF1152I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC4VFX60-11FF1152I.pdf
Description:
IC FPGA 576 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,568

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Product details

Overview

XC4VFX60-11FF1152I from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It integrates high-speed serial transceivers (up to 10.3125 Gbps), DDR2 memory controller support, and tri-mode Ethernet MACs. Used in high-performance reconfigurable computing systems requiring real-time signal processing and protocol acceleration.

For engineers reviewing the XC4VFX60-11FF1152I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, embedded processor availability, I/O voltage compatibility (1.2 V/1.5 V/1.8 V/2.5 V), and thermal design for the 1152-pin Flip-Chip Fine-Pitch BGA package.

Technical Context

The XC4VFX60-11FF1152I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its embedded PowerPC 405 cores operate at up to 500 MHz and support full JTAG debug, while the RocketIO transceivers comply with PCIe 1.0a, Serial RapidIO, and SONET/SDH standards.

Configuration is performed via Master SelectMAP or JTAG mode using external PROM or processor-controlled interface. The device supports partial reconfiguration and includes clock management tiles (DCMs) for jitter reduction and phase alignment across multiple clock domains.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells60,192 - determines maximum combinational/sequential logic capacity for custom RTL implementation
Embedded Multipliers288 × 18×18 - enables parallel DSP operations including FIR filtering and FFT computation
Block RAM2,880 kbits - provides on-chip memory for data buffering, lookup tables, or FIFOs without external memory access
RocketIO Transceivers16 lanes, up to 10.3125 Gbps - supports high-bandwidth serial protocols including PCIe and SRIO
PowerPC Cores2 × PPC405 - enables embedded software execution alongside hardware-accelerated logic
I/O StandardsSupports LVCMOS, LVTTL, SSTL, HSTL, and differential standards - ensures interoperability with diverse peripheral interfaces
PackageFF1152 - 1152-pin Flip-Chip BGA with 1.0 mm pitch, thermal pad, and 35×35 mm body

Pinout & Package

The XC4VFX60-11FF1152I is housed in a 1152-pin Flip-Chip Fine-Pitch BGA (FF1152) package with exposed thermal pad, 1.0 mm ball pitch, and 35 mm × 35 mm body size. Pin functions are organized into banks with independent VCCO and VREF per bank.

Pin/TerminalCircuit RoleDesign Meaning
MRGlobal Master ResetAsynchronous active-low reset input that clears configuration logic and internal state
CCLKConfiguration ClockInput clock for slave serial/SelectMAP configuration; also used for readback operations
DINConfiguration Data InSerial data input during master or slave serial configuration modes
INIT_BConfiguration StatusOpen-drain output indicating configuration status; low during configuration or error
DONEConfiguration CompletionOpen-drain output asserted high when configuration completes successfully
PROG_BProgram InitiateActive-low input to reset configuration logic and reload bitstream from external source

Key Features

FeatureDesign Value
Dual PowerPC 405 CoresEnables tightly coupled hardware-software co-design with shared on-chip memory and interrupt routing
16 RocketIO TransceiversProvides native support for PCIe 1.0a x4, Serial RapidIO 1x/4x, and 10 Gigabit Ethernet PHY layer
DDR2 Memory ControllerHard macro supporting up to 400 MHz data rate and 2 GB addressable space with ECC capability
Tri-Mode Ethernet MACIntegrated 10/100/1000 Mbps MAC with GMII/RGMII/MII interface options and checksum offload
Partial Reconfiguration SupportAllows dynamic swapping of logic modules without resetting the entire device or halting operation

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric performs parallel FFTs and digital down-conversion; PowerPC cores manage system control and data packaging.

Use Value: Reduces latency by executing signal chain in hardware while maintaining software-defined flexibility for algorithm updates.

Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: XC4VFX60-11FF1152I accelerates back-projection kernels and manages high-speed data flow from ADCs to DDR2 memory.

Use Value: Achieves sub-second reconstruction times via 288 DSP slices and 2,880 kbits block RAM for local coefficient storage.

Wireless Baseband ProcessingIndustrial Protocol Gateway

Use Scenario: LTE FDD/TDD baseband processing in small-cell and remote radio head equipment.

IC Role / Device Role / Timing Role: Implements channel coding (Turbo/LDPC), OFDM modulation/demodulation, and MIMO processing in programmable logic.

Use Value: Supports multi-standard operation through reconfiguration while meeting strict 3GPP timing constraints using DCM-based clock synthesis.

Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in factory automation edge controllers.

IC Role / Device Role / Timing Role: XC4VFX60-11FF1152I hosts protocol stacks in PowerPC cores and handles deterministic packet scheduling in fabric.

Use Value: Enables concurrent multi-protocol support with hardware-timed I/O response under 1 µs jitter via dedicated I/O clocking resources.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 1,182,240 logic cells, 64 GTY transceivers (16.3 Gbps), no embedded processorsLacks PowerPC cores; requires external ARM processor for control plane tasksPreferred for bandwidth-intensive compute-offload where software control is handled externally
XC7VX690T-2FFG1927IVirtex-7 architecture, 693,120 logic cells, 36 GTH transceivers (13.1 Gbps), no embedded processorsNo integrated PowerPC; relies on external microcontroller or Zynq RFSoC integration pathSuitable when migrating legacy Virtex-4 designs to higher density and speed, but requires redesign of processor subsystem

Compared with XC4VFX60-11FF1152I, the XCVU9P and XC7VX690T offer significantly higher logic capacity and transceiver performance but eliminate the tightly integrated dual PowerPC subsystem-requiring architectural changes to separate control and datapath functions.

Availability

XC4VFX60-11FF1152I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, wireless baseband processing, and industrial protocol gateway applications requiring stable component supply and long-term lifecycle support.

Supply support for XC4VFX60-11FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. Xilinx pioneered high-performance programmable logic for demanding compute and connectivity applications.

The Virtex-4 FX platform was designed specifically for system-level integration of processing, connectivity, and custom logic-targeting aerospace, defense, and high-end communications infrastructure.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in the XC4VFX60-11FF1152I?

The XC4VFX60-11FF1152I integrates two PowerPC 405 RISC cores rated for operation up to 500 MHz under specified thermal and voltage conditions. This frequency is achievable when using the internal DCMs for clock synthesis and maintaining junction temperature below 100°C. The XC4VFX60-11FF1152I datasheet specifies timing closure requirements for core-to-fabric interconnect at this speed.

Does the XC4VFX60-11FF1152I support PCI Express Gen1 x4 endpoint functionality?

Yes, the XC4VFX60-11FF1152I supports PCI Express Gen1 (2.5 Gbps per lane) endpoint operation using its RocketIO transceivers configured in x1, x2, x4, or x8 topologies. The device includes hard IP for the physical layer and supports standard PCIe configuration space mapping. The XC4VFX60-11FF1152I requires external reference clock and compliance with PCIe AC coupling specifications.

What configuration modes are supported by the XC4VFX60-11FF1152I?

The XC4VFX60-11FF1152I supports Master SelectMAP, Slave SelectMAP, JTAG, and Master Serial configuration modes. It can load bitstreams from external PROM, flash memory, or host processor via parallel or serial interface. Configuration security features include bitstream encryption and CRC checking. The XC4VFX60-11FF1152I also supports fallback configuration and multi-bitstream storage.

Is partial reconfiguration supported on the XC4VFX60-11FF1152I, and what tools enable it?

Yes, the XC4VFX60-11FF1152I supports partial reconfiguration through dedicated bitstream partitioning and frame-based update mechanisms. Xilinx ISE Design Suite 14.7 with PlanAhead implementation tools provides full flow support-including floorplanning, module generation, and verification. The XC4VFX60-11FF1152I requires specific HDL coding practices and constrained placement to ensure isolation between static and reconfigurable regions.

What is the I/O voltage range supported per bank on the XC4VFX60-11FF1152I?

The XC4VFX60-11FF1152I supports independent VCCO per I/O bank, with selectable voltages of 1.2 V, 1.5 V, 1.8 V, or 2.5 V. Each bank also supports programmable VREF for differential standards. Bank-specific configuration is set via configuration registers and must be matched to connected peripherals. The XC4VFX60-11FF1152I does not support mixed-voltage signaling within a single bank.

XC4VFX60-11FF1152I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
6320
Number of Logic Elements/Cells:
56880
Total RAM Bits:
4276224
Number of I/O:
576
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC4VFX60-11FF1152I FAQ

1.How can I place an order for XC4VFX60-11FF1152I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX60-11FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX60-11FF1152I reliable?

The price and inventory of XC4VFX60-11FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FF1152I is usually 5 days.

3.What payment methods are accepted for XC4VFX60-11FF1152I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FF1152I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX60-11FF1152I?

XC4VFX60-11FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX60-11FF1152I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX60-11FF1152I?

For technical support, including XC4VFX60-11FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FF1152I requirements.

6.How does Aetrix verify that XC4VFX60-11FF1152I is sourced from the original manufacturer or authorized distributors?

All XC4VFX60-11FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FF1152I meets industry standards.

7.What is the process for return or replacement of XC4VFX60-11FF1152I?

All XC4VFX60-11FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FF1152I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX60-11FF1152I part is unused and in its original packaging.

Return procedure for XC4VFX60-11FF1152I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX60-11FF1152I Tags

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  • XC4VFX60-11FF1152I PDF
  • XC4VFX60-11FF1152I Datasheet
  • XC4VFX60-11FF1152I Specifications
  • XC4VFX60-11FF1152I Images
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