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AMD XC4VFX60-11FF672C

Part No.:
XC4VFX60-11FF672C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
672-BBGA, FCBGA
Datasheet:
AetrixXC4VFX60-11FF672C.pdf
Description:
IC FPGA 352 I/O 672FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,346

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Product details

Overview

XC4VFX60-11FF672C from AMD is a Virtex-4 FX60 FPGA with 60,192 logic cells, embedded PowerPC 405 RISC processors, and integrated multi-gigabit transceivers operating up to 3.125 Gbps. It features 360 DSP slices, 2.5 MB of block RAM, and supports PCI Express x4 endpoint functionality in the FF672 flip-chip BGA package. It is used in high-performance communication line cards requiring protocol processing and serial connectivity.

For engineers reviewing the XC4VFX60-11FF672C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, embedded processor availability, PCI Express compliance level, and I/O voltage support for backplane interfacing.

Technical Context

The XC4VFX60-11FF672C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and RocketIO™ multi-gigabit transceivers supporting protocols including Serial RapidIO, Gigabit Ethernet, and PCI Express. Its dual PowerPC 405 cores operate at up to 500 MHz and share access to on-chip memory and peripherals via the Processor Local Bus (PLB) and OPB bus interfaces.

Configuration is performed via Master SelectMAP mode using external PROM or through JTAG boundary-scan. The device supports partial reconfiguration and includes built-in clock management with DCMs offering phase shifting, frequency synthesis, and duty cycle correction across 16 global clock networks.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells60,192 - determines maximum combinational/sequential logic capacity for custom digital functions
Embedded ProcessorsDual PowerPC 405 cores - enables hard real-time control and host-side protocol stack execution without external CPU
Transceivers16 RocketIO lanes @ 3.125 Gbps - supports x4 PCI Express Gen1, dual 10G Ethernet XAUI, or 16-lane SRIO
Block RAM2,508 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM
I/O StandardsLVDS, LVPECL, SSTL, HSTL - enables direct interface to high-speed SerDes PHYs, memory controllers, and backplane receivers
DCMs16 Digital Clock Managers - delivers jitter-tolerant clock synthesis and phase alignment for multi-clock domain systems

Pinout & Package

XC4VFX60-11FF672C is housed in a 672-pin flip-chip fine-pitch BGA (FF672) package with 2.0 mm pitch, thermal lid, and 25 × 25 mm body size. Pin assignment follows Xilinx (now AMD) Virtex-4 FX family standard layout, with dedicated banks for VCCO, VRN/VRP termination, and differential I/O pairs aligned to transceiver quads.

Pin/TerminalCircuit RoleDesign Meaning
M2MRDY_NMaster ready signal for PLB bus arbitration - indicates when master is prepared to accept data
P3TRDY_NTarget ready signal for PLB bus - confirms target peripheral readiness for data transfer
R1CLK0Primary global clock input - feeds DCMs and clock distribution network for synchronous logic domains
T2SRGlobal synchronous reset - asynchronously resets all flip-flops while preserving configuration state
U1VREFI/O reference voltage - sets threshold for SSTL/HSTL input receivers in associated bank
Y2GTCLK0Transceiver reference clock input - drives PLLs for RocketIO lane rate synthesis

Key Features

FeatureDesign Value
Dual PowerPC 405 CoresEnables concurrent firmware execution and hardware acceleration - eliminates need for external microcontroller in protocol-aware designs
RocketIO TransceiversSupports wire-speed serialization/deserialization at 625 Mbps–3.125 Gbps - allows native integration of PCIe, SRIO, and 10GbE MAC layers
Partial ReconfigurationPermits dynamic logic module swapping during operation - reduces system downtime and enables field-upgradable functions
Integrated DCMsProvides ±100 ps phase shift resolution and 2×/4×/8× frequency multiplication - simplifies clock tree design for mixed-rate interfaces
PCI Express Endpoint LogicHard IP core compliant with PCI Express Base 1.0a - handles link training, transaction layer packet routing, and error reporting without soft logic overhead

Applications

Wire-Speed Packet ProcessingPCI Express Acceleration Card

Use Scenario: Line card in carrier-grade router performing deep packet inspection and header rewriting at OC-192 rates.

IC Role / Device Role / Timing Role: XC4VFX60-11FF672C serves as the programmable forwarding engine, integrating TCAM search logic, parser state machines, and PCIe interface to host CPU.

Use Value: Embedded PowerPC cores offload control-plane tasks while RocketIO transceivers directly connect to SFP+ PHYs, eliminating external SerDes and reducing latency by >12 ns.

Use Scenario: High-throughput compute accelerator board for financial analytics using FPGA-accelerated risk modeling.

IC Role / Device Role / Timing Role: XC4VFX60-11FF672C acts as PCIe endpoint with DMA engines, managing host memory transfers and executing parallel Monte Carlo simulations.

Use Value: x4 Gen1 PCIe interface sustains 2 GB/s bidirectional throughput; 360 DSP slices enable simultaneous 64-bit floating-point operations across 16 pipelines.

Serial RapidIO Base StationHigh-Speed Backplane Interconnect

Use Scenario: Baseband unit in 3G/4G wireless infrastructure connecting multiple DSP blades over a switched fabric.

IC Role / Device Role / Timing Role: XC4VFX60-11FF672C implements SRIO endpoint with message passing, doorbell, and maintenance transaction support.

Use Value: 16 RocketIO lanes configured as four 4x SRIO links provide 20 Gbps aggregate full-duplex bandwidth per blade interface.

Use Scenario: Modular test equipment chassis with hot-swappable instrument modules communicating over parallel LVDS backplane.

IC Role / Device Role / Timing Role: XC4VFX60-11FF672C functions as backplane controller and serializer, converting parallel data to serialized streams for long-reach transmission.

Use Value: LVDS I/O banks support 800 Mbps DDR signaling; DCMs align clocks across 16-slot chassis with <50 ps skew between slots.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA with embedded processor and serial transceiver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV5VLX110-1FF1136CVirtex-5 architecture; higher logic density (110K LUTs), no embedded PowerPC, 24 GTX transceivers up to 3.75 GbpsBetter suited for pure logic-intensive tasks; lacks hard processor for control-plane offloadSelect when transceiver count and speed outweigh need for integrated CPU
XC6VLX130T-1FF784CVirtex-6 architecture; 130K logic cells, no PowerPC, 24 GTH transceivers up to 6.6 Gbps, integrated PCIe Gen2 endpointSuperior serial bandwidth and PCIe Gen2 support; requires external ARM processor for control softwareChoose for next-generation designs needing >3 Gbps serial links and Gen2 PCIe compatibility

Compared with XC4VFX60-11FF672C, the XCV5VLX110 offers greater logic capacity but removes embedded processing capability, while the XC6VLX130T delivers higher transceiver performance and PCIe Gen2 support at the cost of increased power and board complexity - both require architectural re-evaluation rather than drop-in replacement.

Availability

XC4VFX60-11FF672C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, military/aerospace data concentrators, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XC4VFX60-11FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, wired/wireless infrastructure, and automotive markets.

The Virtex-4 FX family was originally designed by Xilinx to integrate programmable logic, embedded processors, and high-speed serial I/O in a single device for protocol-aware networking and compute acceleration applications.

FAQ

What is the maximum supported data rate per RocketIO transceiver lane in XC4VFX60-11FF672C?

The XC4VFX60-11FF672C supports a maximum data rate of 3.125 Gbps per RocketIO transceiver lane. This rate is validated for protocols including PCI Express Gen1, Serial RapidIO, and Gigabit Ethernet. Operation above 2.5 Gbps requires proper AC-coupling, impedance-controlled PCB routing, and compliance with the RocketIO transmitter pre-emphasis and receiver equalization settings specified in the XC4VFX60-11FF672C datasheet.

Does XC4VFX60-11FF672C include hard IP for PCI Express Gen1 endpoint functionality?

Yes, XC4VFX60-11FF672C integrates hard PCI Express Gen1 endpoint logic compliant with the PCI Express Base 1.0a specification. This includes physical layer (PHY) interface, data link layer, and transaction layer functionality implemented in dedicated silicon, not soft logic. The XC4VFX60-11FF672C supports x1 and x4 link widths and handles link training, ACK/NAK generation, and error reporting without consuming CLB resources.

How many PowerPC 405 cores does XC4VFX60-11FF672C contain, and what is their clock frequency range?

XC4VFX60-11FF672C contains two embedded PowerPC 405 RISC processor cores. Each core operates at frequencies ranging from DC to 500 MHz, depending on voltage, temperature, and speed grade. The -11 speed grade of XC4VFX60-11FF672C guarantees 500 MHz operation under standard industrial conditions (0°C to 85°C, 1.2 V core supply). Both cores share access to on-chip memory and peripherals via the PLB and OPB buses.

What configuration modes are supported by XC4VFX60-11FF672C?

XC4VFX60-11FF672C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP is the primary mode for high-speed parallel loading from external PROM. JTAG is used for boundary-scan testing and in-system programming. The XC4VFX60-11FF672C also supports partial reconfiguration via ICAP port, enabling dynamic logic updates without full device reset.

Is XC4VFX60-11FF672C pin-compatible with other Virtex-4 FX devices in the FF672 package?

No, XC4VFX60-11FF672C is not fully pin-compatible with other Virtex-4 FX devices in the FF672 package. While the FF672 footprint is shared across several Virtex-4 FX variants, pin functions differ significantly due to varying transceiver counts, I/O bank configurations, and processor subsystem layouts. For example, XC4VFX100-11FF672C allocates additional pins to extra RocketIO quads, altering the placement of user I/O and clock inputs relative to XC4VFX60-11FF672C.

XC4VFX60-11FF672C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
672-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
6320
Number of Logic Elements/Cells:
56880
Total RAM Bits:
4276224
Number of I/O:
352
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
672-FCBGA (27x27)

XC4VFX60-11FF672C FAQ

1.How can I place an order for XC4VFX60-11FF672C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX60-11FF672C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX60-11FF672C reliable?

The price and inventory of XC4VFX60-11FF672C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FF672C is usually 5 days.

3.What payment methods are accepted for XC4VFX60-11FF672C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FF672C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX60-11FF672C?

XC4VFX60-11FF672C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX60-11FF672C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX60-11FF672C?

For technical support, including XC4VFX60-11FF672C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FF672C requirements.

6.How does Aetrix verify that XC4VFX60-11FF672C is sourced from the original manufacturer or authorized distributors?

All XC4VFX60-11FF672C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FF672C meets industry standards.

7.What is the process for return or replacement of XC4VFX60-11FF672C?

All XC4VFX60-11FF672C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FF672C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX60-11FF672C part is unused and in its original packaging.

Return procedure for XC4VFX60-11FF672C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX60-11FF672C Tags

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  • XC4VFX60-11FF672C Datasheet
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