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AMD XC4VFX60-11FFG1152C
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- Part No.:
- XC4VFX60-11FFG1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC4VFX60-11FFG1152C.pdf
- Description:
- IC FPGA 576 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,734
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Product details
Overview
XC4VFX60-11FFG1152C from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes integrated tri-mode Ethernet MACs. Used in high-performance networking line cards requiring real-time packet processing and protocol acceleration.
For engineers reviewing the XC4VFX60-11FFG1152C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), total RAM bits (5,091,328), and available RocketIO transceivers (16 lanes at 3.125 Gbps).
Technical Context
The XC4VFX60-11FFG1152C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM, DSP slices, and hard IP cores including PowerPC 405 processors and tri-mode Ethernet MACs. It uses 90 nm copper process technology and supports partial reconfiguration.
It integrates 16 RocketIO GTP transceivers supporting protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG, with bitstream encryption available for design protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,192 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 5,091,328 bits - supports on-chip data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 288 × 18×18 multipliers - enables high-throughput filtering, FFT, and mathematical operations |
| RocketIO Transceivers | 16 lanes, 3.125 Gbps - provides serial connectivity for PCIe Gen1, SRIO, and 1000BASE-X |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards - enables direct interfacing with diverse memory and peripheral ICs |
| Configuration Mode | Master/Slave SelectMAP or JTAG - allows flexible programming methods including flash-based or host-controlled initialization |
Pinout & Package
XC4VFX60-11FFG1152C is housed in a 1152-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm pitch and 35 mm × 35 mm body size. Thermal and mechanical characteristics comply with JEDEC MO-251.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Select Pins | Determine configuration mode (JTAG, Master/Slave SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during bitstream loading |
| DIN | Data Input | Serial input for configuration data in Master SelectMAP mode |
| INIT_B | Initialization Status | Open-drain output indicating successful configuration or error condition |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and restarts loading sequence |
| POWERDOWN | Power Management | Enters low-power state by disabling internal clocks and I/O drivers |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Hardened processor subsystems enabling embedded software execution alongside programmable logic |
| Tri-Mode Ethernet MACs | Integrated 10/100/1000 Mbps MACs reducing external PHY count and PCB area |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without full device reset or system interruption |
| Bitstream Encryption | 128-bit AES key protection prevents unauthorized readback or cloning of configuration data |
| Multi-Voltage I/O Banks | 16 independent I/O banks support mixed-voltage operation for heterogeneous interface integration |
Applications
| Wireless Baseband Processing | Defense Radar Signal Processing |
|---|---|
Use Scenario: Real-time modulation/demodulation, channel coding, and MIMO processing in 3G/4G LTE base stations. IC Role / Device Role / Timing Role: Programmable fabric handles algorithm acceleration while PowerPC cores manage control plane and protocol stack. Use Value: Reduces latency versus ASIC-based solutions and avoids fixed-function limitations of DSP-only platforms. | Use Scenario: Pulse-Doppler processing, beamforming, and synthetic aperture radar (SAR) image reconstruction in airborne radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical signal correlation and filtering; RocketIO transceivers interface with ADC/DAC modules. Use Value: Enables deterministic timing for sub-microsecond sampling synchronization across multiple RF channels. |
| Industrial Protocol Gateway | Medical Imaging Data Pipeline |
Use Scenario: Bridging EtherCAT, PROFINET, and Modbus TCP in factory automation controllers. IC Role / Device Role / Timing Role: Tri-mode Ethernet MACs handle concurrent industrial Ethernet stacks; logic fabric implements protocol translation state machines. Use Value: Eliminates need for multiple discrete MACs and offloads protocol processing from main CPU. | Use Scenario: High-speed acquisition and preprocessing of CT/MRI raw sensor data before GPU-based reconstruction. IC Role / Device Role / Timing Role: Block RAM buffers parallel ADC streams; DSP slices perform real-time noise reduction and interpolation. Use Value: Achieves sustained 2.4 GB/s data throughput from 64-channel ADCs using on-chip memory and pipelined arithmetic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX80-11FF1152C | No PowerPC cores or RocketIO transceivers; higher logic density (80,640 CLBs) | Better suited for pure logic-intensive tasks without serial I/O or embedded processing needs | Select when serial connectivity and soft/hard processor integration are unnecessary |
| XC5VLX110-2FF1136C | Virtex-5 architecture; 110K logic cells, 24 RocketIO GTPs, no embedded PowerPC | Offers higher transceiver count and improved DSP efficiency but lacks dual processor subsystem | Choose for next-generation designs prioritizing serial bandwidth over legacy PowerPC software compatibility |
Compared with XC4VFX60-11FFG1152C, XC4VLX80-11FF1152C trades embedded processing and high-speed serial I/O for greater logic capacity, while XC5VLX110-2FF1136C advances transceiver count and DSP performance but removes the dual PowerPC advantage-making XC4VFX60-11FFG1152C uniquely suited for tightly coupled hardware-software co-design in legacy-compliant systems.
Availability
XC4VFX60-11FFG1152C is available at Aetrix Electronics and suitable for aerospace avionics, telecom infrastructure, and medical imaging systems requiring stable component supply across extended production lifecycles.
Supply support for XC4VFX60-11FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. Xilinx pioneered high-performance programmable logic with emphasis on system-level integration.
The Virtex-4 FX platform was designed specifically for embedded computing applications requiring both programmable logic and hardened processor cores-targeting networking, defense, and high-end instrumentation markets.
FAQ
What is the operating temperature range for XC4VFX60-11FFG1152C?
The XC4VFX60-11FFG1152C is rated for commercial temperature operation (0 °C to +85 °C case temperature). This specification applies to the -C speed grade and is validated per Xilinx DS112 v2.5. Thermal derating is required above 70 °C ambient when operating at maximum I/O toggle rates and logic utilization. The XC4VFX60-11FFG1152C does not support industrial or extended temperature grades.
Does XC4VFX60-11FFG1152C support JTAG boundary-scan testing?
Yes, XC4VFX60-11FFG1152C fully supports IEEE 1149.1 JTAG boundary-scan for interconnect testing and in-system programming. The TAP controller is accessible via TCK, TMS, TDI, and TDO pins, and supports IDCODE, BYPASS, SAMPLE/PRELOAD, and EXTEST instructions. Boundary-scan capability is implemented in silicon and documented in Xilinx UG071.
How many RocketIO transceivers are available on XC4VFX60-11FFG1152C?
The XC4VFX60-11FFG1152C integrates 16 RocketIO GTP transceivers, each capable of 625 Mbps to 3.125 Gbps operation. These support protocols including PCI Express 1.0, Serial RapidIO 1.x, and 1000BASE-X. All 16 transceivers are fully functional and electrically characterized per Xilinx DS116 v2.2.
Can XC4VFX60-11FFG1152C be configured using SPI flash memory?
No, XC4VFX60-11FFG1152C does not support native SPI flash configuration. It requires parallel PROM (e.g., XCFxxP series) or microprocessor-controlled SelectMAP mode. Configuration via SPI flash would require an external bridge controller or FPGA-initiated SPI master logic - a method not supported by the XC4VFX60-11FFG1152C's dedicated configuration interface.
What is the maximum DDR2 memory interface speed supported by XC4VFX60-11FFG1152C?
The XC4VFX60-11FFG1152C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using dedicated DQS logic and phase-matched routing constraints. This capability is verified with Micron MT47H64M8HQ-37E and Samsung K4T51163QG-BCE6 components per Xilinx UG070.
XC4VFX60-11FFG1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6320
- Number of Logic Elements/Cells:
- 56880
- Total RAM Bits:
- 4276224
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC4VFX60-11FFG1152C FAQ
1.How can I place an order for XC4VFX60-11FFG1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX60-11FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX60-11FFG1152C reliable?
The price and inventory of XC4VFX60-11FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FFG1152C is usually 5 days.
3.What payment methods are accepted for XC4VFX60-11FFG1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FFG1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX60-11FFG1152C?
XC4VFX60-11FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX60-11FFG1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX60-11FFG1152C?
For technical support, including XC4VFX60-11FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FFG1152C requirements.
6.How does Aetrix verify that XC4VFX60-11FFG1152C is sourced from the original manufacturer or authorized distributors?
All XC4VFX60-11FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FFG1152C meets industry standards.
7.What is the process for return or replacement of XC4VFX60-11FFG1152C?
All XC4VFX60-11FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FFG1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX60-11FFG1152C part is unused and in its original packaging.
Return procedure for XC4VFX60-11FFG1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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