AMD XC4VFX60-11FFG1152I
- Part No.:
- XC4VFX60-11FFG1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC4VFX60-11FFG1152I.pdf
- Description:
- IC FPGA 576 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VFX60-11FFG1152I from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 360 embedded 18×18 multipliers, and dual PowerPC 405 RISC processors. It integrates high-speed serial transceivers (up to 10.3125 Gbps), DDR2 memory controller support, and RocketIO™ MGTs. Used in high-performance networking line cards and radar signal processing systems.
For engineers reviewing the XC4VFX60-11FFG1152I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, embedded processor availability, I/O voltage flexibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and -11 speed grade timing performance.
Technical Context
The XC4VFX60-11FFG1152I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its dual PowerPC 405 cores operate at up to 500 MHz and support JTAG debug, on-chip memory, and AXI bus interface.
RocketIO transceivers provide protocol-agnostic serial connectivity compliant with PCIe 1.0a, Serial RapidIO, and SONET/SDH. The device supports differential I/O standards including LVDS, RSDS, and HSTL, with programmable output drive strength and input termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,192 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Embedded Multipliers | 360 × 18×18 - enables parallel DSP operations for filtering, FFT, and modulation/demodulation |
| Block RAM | 2,880 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external SRAM |
| Transceiver Lanes | 16 × RocketIO - supports 16 independent high-speed serial links up to 10.3125 Gbps each |
| Speed Grade | -11 - guarantees worst-case timing performance at highest operating frequency for critical paths |
| I/O Standards | LVDS, RSDS, HSTL, SSTL, PCI-X - enables direct interfacing with diverse peripheral ICs and memory types |
| Processor Cores | 2 × PowerPC 405 - delivers hard-core embedded processing for control-plane tasks alongside programmable logic |
Pinout & Package
XC4VFX60-11FFG1152I is housed in a 1152-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal and mechanical data align with Xilinx specification DS204 (v2.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clock management, and select I/O banks |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage system interfacing |
| MR | Master reset | Asynchronous active-low reset that clears configuration memory and logic states |
| CCLK | Configuration clock | Input clock for slave-serial and JTAG configuration modes; max 50 MHz |
| INIT_B | Configuration status | Open-drain output indicating configuration success/failure during startup |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 processors | Hardened RISC cores enable deterministic real-time control without soft-core resource overhead |
| 16 RocketIO transceivers | Eliminates need for external SerDes chips in multi-gigabit backplane and optical interface designs |
| DDR2 memory controller | Integrated PHY and controller reduce latency and PCB routing complexity for high-bandwidth memory access |
| Multi-standard I/O banks | Per-bank voltage and standard selection simplifies interface to legacy and modern peripherals |
| Partial reconfiguration support | Enables dynamic logic updates in operational systems without full FPGA reset or downtime |
Applications
| Wireless Baseband Processing | Defense Radar Signal Processing |
|---|---|
Use Scenario: Real-time channelization, MIMO encoding, and digital predistortion in 4G/LTE base stations. IC Role / Device Role / Timing Role: XC4VFX60-11FFG1152I serves as the primary baseband processing engine, coordinating RF front-end timing via deterministic clock networks. Use Value: Embedded PowerPC cores handle MAC-layer protocols while FPGA fabric executes low-latency PHY-layer algorithms with sub-10 ns timing closure. | Use Scenario: Pulse-Doppler processing, beamforming, and synthetic aperture radar (SAR) image reconstruction in airborne platforms. IC Role / Device Role / Timing Role: XC4VFX60-11FFG1152I acts as the real-time signal processor, synchronizing ADC sampling clocks and managing high-throughput DMA transfers to DDR2 memory. Use Value: 16 RocketIO lanes interface directly with high-speed ADC/DAC converters, eliminating interposer latency and supporting >1 GSPS aggregate throughput. |
| Optical Transport Networking | Industrial Protocol Gateway |
Use Scenario: OTN framing, GFP mapping, and FEC decoding in 10G/40G line cards for metro/core routers. IC Role / Device Role / Timing Role: XC4VFX60-11FFG1152I implements protocol-aware packet processing pipelines with precise jitter-tolerant clock recovery. Use Value: Integrated DDR2 controller buffers bursty traffic, while RocketIO transceivers comply with ITU-T G.709 and IEEE 802.3ae standards. | Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in factory automation edge controllers. IC Role / Device Role / Timing Role: XC4VFX60-11FFG1152I hosts dual Ethernet MACs and protocol stacks, with PowerPC cores managing stack execution and FPGA logic handling time-critical frame scheduling. Use Value: Deterministic sub-microsecond response latency meets PROFINET IRT Class A timing requirements without external timing ASICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (2,586K LC), 64 GTY transceivers (16.3 Gbps), no embedded processors | Lacks hard PowerPC cores; requires soft-core or external processor for control-plane tasks | Preferred when raw transceiver bandwidth and logic capacity outweigh integrated processor needs |
| XC5VLX110T-2FF1136I | Virtex-5 architecture; 110K logic cells, 64 DSP48E slices, no embedded processors, 12 RocketIO GTPs (3.75 Gbps) | Lower transceiver speed and count; no PowerPC cores; reduced memory bandwidth vs. FX60 | Suitable for cost-sensitive applications where 10 Gbps serial I/O and dual RISC cores are not required |
Compared with XC4VFX60-11FFG1152I, the XCVU9P offers greater scalability but removes embedded processing, while the XC5VLX110T trades transceiver performance and processor integration for lower cost and power - making XC4VFX60-11FFG1152I uniquely balanced for hybrid control + signal processing workloads.
Availability
XC4VFX60-11FFG1152I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and optical transport equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX60-11FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.
The Virtex-4 FX family was designed by Xilinx to deliver integrated processing, high-speed serial I/O, and programmable logic in a single device for demanding communications and defense applications.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX60-11FFG1152I?
The XC4VFX60-11FFG1152I features two hard PowerPC 405 cores rated for operation up to 500 MHz under the -11 speed grade. This frequency is guaranteed across the industrial temperature range (–40°C to +100°C) with proper core voltage (VCCINT = 1.2 V ±3%) and thermal management. The XC4VFX60-11FFG1152I datasheet specifies this limit in Table 12 of DS204 (v2.1).
Does XC4VFX60-11FFG1152I support partial reconfiguration?
Yes, the XC4VFX60-11FFG1152I supports dynamic partial reconfiguration through its SelectMAP interface and internal configuration access port (ICAP). This allows runtime modification of designated logic regions without resetting the entire device or interrupting active functions. The XC4VFX60-11FFG1152I implementation requires use of Xilinx ISE 12.4 or later tools and adherence to area-group constraints defined in UG070.
What I/O standards are supported on Bank 34 of XC4VFX60-11FFG1152I?
Bank 34 of the XC4VFX60-11FFG1152I supports LVDS_25, LVDS_25_DCI, RSDS_25, RSDS_25_DCI, BLVDS_25, and mini-LVDS_25 I/O standards. These are enabled by the bank's VCCAUX = 2.5 V supply and compatible termination schemes. The XC4VFX60-11FFG1152I Pinout Files (XDC) and DS204 confirm this subset applies exclusively to Bank 34 due to its dedicated differential I/O routing resources.
Is XC4VFX60-11FFG1152I RoHS compliant?
Yes, the XC4VFX60-11FFG1152I is manufactured in a Pb-free (RoHS-compliant) process with matte tin finish on all solder balls. Its packaging meets EU RoHS Directive 2011/65/EU and China RoHS SJ/T 11364-2014. The XC4VFX60-11FFG1152I compliance documentation is available in Xilinx Product Change Notice PCN#0701151 and AMD's component environmental reports.
What configuration modes does XC4VFX60-11FFG1152I support?
The XC4VFX60-11FFG1152I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP uses an internal oscillator to drive CCLK; Slave SelectMAP accepts external CCLK up to 50 MHz. JTAG mode enables boundary-scan testing and programming via IEEE 1149.1. The XC4VFX60-11FFG1152I configuration behavior is controlled by mode pins M[2:0] and documented in DS204 Section 5.
XC4VFX60-11FFG1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6320
- Number of Logic Elements/Cells:
- 56880
- Total RAM Bits:
- 4276224
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC4VFX60-11FFG1152I FAQ
1.How can I place an order for XC4VFX60-11FFG1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX60-11FFG1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX60-11FFG1152I reliable?
The price and inventory of XC4VFX60-11FFG1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FFG1152I is usually 5 days.
3.What payment methods are accepted for XC4VFX60-11FFG1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FFG1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX60-11FFG1152I?
XC4VFX60-11FFG1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX60-11FFG1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX60-11FFG1152I?
For technical support, including XC4VFX60-11FFG1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FFG1152I requirements.
6.How does Aetrix verify that XC4VFX60-11FFG1152I is sourced from the original manufacturer or authorized distributors?
All XC4VFX60-11FFG1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FFG1152I meets industry standards.
7.What is the process for return or replacement of XC4VFX60-11FFG1152I?
All XC4VFX60-11FFG1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FFG1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX60-11FFG1152I part is unused and in its original packaging.
Return procedure for XC4VFX60-11FFG1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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