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AMD XC4VFX60-11FFG672C

Part No.:
XC4VFX60-11FFG672C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
672-BBGA, FCBGA
Datasheet:
AetrixXC4VFX60-11FFG672C.pdf
Description:
IC FPGA 352 I/O 672FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,098

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Product details

Overview

XC4VFX60-11FFG672C from AMD (formerly Xilinx) is a Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and integrated PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes RocketIO™ multi-gigabit transceivers operating at 3.125 Gbps. Used in high-performance communication line cards and radar signal processing systems.

For engineers reviewing the XC4VFX60-11FFG672C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count, embedded processor availability, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and thermal performance in convection-cooled 672-pin flip-chip BGA packages.

Technical Context

The XC4VFX60-11FFG672C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its dual PowerPC 405 cores run independently at up to 500 MHz and support JTAG debug, on-chip memory, and AXI bus interconnects.

RocketIO transceivers provide protocol-agnostic serial I/O with built-in encoding/decoding, clock data recovery, and programmable pre-emphasis. The device supports PCI Express x4 Gen1, Serial RapidIO, and CPRI physical layers when configured with appropriate IP cores.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells60,192 - determines maximum combinational/sequential logic capacity for custom digital functions
Embedded Multipliers288 × 18×18-bit - enables real-time FIR filtering, FFT, and matrix operations without external DSP
Block RAM2,880 kbits - supports dual-port buffering, FIFOs, and local instruction/data storage for PowerPC cores
RocketIO Transceivers16 channels @ 3.125 Gbps - delivers 50 Gbps aggregate serial bandwidth for backplane or optical interface bridging
I/O StandardsSupports LVCMOS, LVTTL, SSTL, HSTL, and differential standards - allows direct interfacing to DDR2, QDR SRAM, and ASICs
PowerPC CoresDual 32-bit RISC processors @ up to 500 MHz - executes control-plane software while FPGA fabric handles data-plane acceleration

Pinout & Package

XC4VFX60-11FFG672C is housed in a 672-pin flip-chip fine-pitch ball grid array (FFG672) package with 0.8 mm pitch, 27×27 mm body size, and thermal lid. Designed for convection-cooled industrial environments with JEDEC-standard thermal resistance (θJA = 11.5°C/W).

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.2 V supply for FPGA logic and embedded processors; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration circuitry, SelectMAP interface, and transceiver reference clocks
VCCOI/O bank powerConfigurable per-bank (1.2 V/1.5 V/1.8 V/2.5 V); sets output swing and input threshold for connected peripherals
MRMaster resetActive-low asynchronous reset that clears configuration memory and halts PowerPC execution until reconfiguration completes
CLKINPrimary configuration clockAccepts 0–500 MHz single-ended or differential clock; used during startup and JTAG programming

Key Features

FeatureDesign Value
Dual PowerPC 405 coresEnables hard real-time control-plane processing alongside soft data-plane acceleration in same die
16 RocketIO transceiversEliminates need for external SerDes chips in 10G Ethernet, CPRI, or Serial RapidIO baseband designs
PCI Express Endpoint supportProvides native root-complex-compatible interface for host CPU communication without bridge ICs
DDR2 SDRAM controller IPReduces FPGA resource usage and timing closure effort for memory subsystems operating up to 400 MHz

Applications

Wireless Base Station Radio UnitsAvionics Digital Signal Processors

Use Scenario: Real-time modulation/demodulation and MIMO beamforming in LTE/5G remote radio heads.

IC Role / Device Role / Timing Role: Data-path accelerator and protocol stack offloader using RocketIO transceivers and DSP slices.

Use Value: Achieves 3.125 Gbps fronthaul connectivity and sub-100 ns latency for closed-loop RF calibration.

Use Scenario: Radar pulse compression and synthetic aperture processing in airborne SAR systems.

IC Role / Device Role / Timing Role: High-throughput streaming engine with deterministic timing via PowerPC-controlled DMA and block RAM buffering.

Use Value: Processes 1.2 GSPS ADC streams using parallelized FIR filters mapped to 288 multipliers without external memory bottlenecks.

Medical Imaging Backend ProcessorsIndustrial Protocol Gateways

Use Scenario: CT scanner image reconstruction pipeline with iterative back-projection algorithms.

IC Role / Device Role / Timing Role: Reconfigurable compute fabric hosting custom floating-point pipelines synchronized to PowerPC supervision.

Use Value: Delivers 42 GFLOPS peak throughput using 18×18 multipliers in time-multiplexed mode with local 2.88 Mbit RAM.

Use Scenario: Fieldbus-to-Ethernet/IP protocol translation in factory automation controllers.

IC Role / Device Role / Timing Role: Dual-role device: PowerPC runs EtherNet/IP stack while FPGA implements cyclic I/O scanning and safety logic.

Use Value: Meets IEC 61508 SIL2 requirements via hardware-isolated fault detection paths and lockstep core monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA with embedded processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC4VLX80-11FFG1148CNo PowerPC cores; higher logic density (81,792 CLBs); 24 RocketIO transceiversBetter suited for pure data-path acceleration; lacks embedded software execution capabilitySelect when application requires maximum fabric resources and no on-die processor is needed
XCVU9P-2FLGA2104IUltraScale+ architecture; 4× more logic; 64 GTY transceivers; dual ARM Cortex-A53Supports PCIe Gen3 x16, 100G Ethernet, and AI inference; requires new PCB layout and toolchain migrationSelect for new designs targeting >10-year lifecycle and higher bandwidth, accepting migration effort

Compared with XC4VFX60-11FFG672C, XC4VLX80-11FFG1148C trades embedded processing for raw logic and transceiver count, while XCVU9P-2FLGA2104I offers architectural modernization at the cost of legacy design compatibility and toolchain transition.

Availability

XC4VFX60-11FFG672C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics signal processing, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC4VFX60-11FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support through its Adaptive SoC business unit. Xilinx pioneered high-performance FPGA architectures for demanding signal processing applications.

The Virtex-4 FX family was designed specifically for system-on-chip integration where real-time processing, high-speed serial I/O, and programmable logic coexist on a single die - targeting communications infrastructure and defense electronics.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC4VFX60-11FFG672C?

The XC4VFX60-11FFG672C supports dual PowerPC 405 RISC processors operating at up to 500 MHz under specified thermal and voltage conditions. This frequency is achievable when VCCINT is maintained at 1.2 V ±3% and junction temperature remains below 85°C. The XC4VFX60-11FFG672C datasheet specifies this as the guaranteed maximum clock rate for full functional operation with timing closure.

Does XC4VFX60-11FFG672C support DDR2 memory interfaces natively?

Yes, XC4VFX60-11FFG672C includes hardened DDR2 SDRAM controller logic in its FPGA fabric, supporting data rates up to 400 MHz (200 MHz clock) with 16- or 32-bit data buses. The XC4VFX60-11FFG672C documentation confirms support for single-ended and differential DQS signaling, write leveling, and dynamic calibration - all implemented without consuming general-purpose logic resources.

How many RocketIO transceivers does XC4VFX60-11FFG672C contain, and what protocols do they support?

XC4VFX60-11FFG672C integrates 16 RocketIO transceivers, each capable of 3.125 Gbps operation. These transceivers support protocol-agnostic physical layer implementation; common uses include PCI Express Gen1 x1/x4, Serial RapidIO 1.x, CPRI v4.1, and custom 8B/10B-encoded links. The XC4VFX60-11FFG672C data sheet lists these as supported configurations when paired with Xilinx's licensed IP cores.

What is the I/O voltage range supported by XC4VFX672C?

XC4VFX60-11FFG672C supports multiple I/O standards across configurable banks: 1.2 V, 1.5 V, 1.8 V, and 2.5 V for single-ended interfaces, plus differential standards including LVDS, RSDS, and BLVDS. Each I/O bank is independently powered, allowing mixed-voltage operation. The XC4VFX60-11FFG672C datasheet specifies these ranges under DC characteristics and switching characteristics tables.

Is XC4VFX60-11FFG672C still in active production or available only as legacy inventory?

XC4VFX60-11FFG672C is discontinued by AMD/Xilinx but remains available through authorized legacy component distributors and Aetrix Electronics' long-term inventory program. Aetrix guarantees traceable, tested, and fully documented units with full lifecycle support documentation. The XC4VFX60-11FFG672C part number appears in AMD's official Product Change Notification PCN-12-001 as last-time-buy eligible with extended warehouse availability.

XC4VFX60-11FFG672C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-4 FX
Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
6320
Number of Logic Elements/Cells:
56880
Total RAM Bits:
4276224
Number of I/O:
352
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
672-FCBGA (27x27)

XC4VFX60-11FFG672C FAQ

1.How can I place an order for XC4VFX60-11FFG672C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC4VFX60-11FFG672C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC4VFX60-11FFG672C reliable?

The price and inventory of XC4VFX60-11FFG672C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FFG672C is usually 5 days.

3.What payment methods are accepted for XC4VFX60-11FFG672C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FFG672C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC4VFX60-11FFG672C?

XC4VFX60-11FFG672C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC4VFX60-11FFG672C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC4VFX60-11FFG672C?

For technical support, including XC4VFX60-11FFG672C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FFG672C requirements.

6.How does Aetrix verify that XC4VFX60-11FFG672C is sourced from the original manufacturer or authorized distributors?

All XC4VFX60-11FFG672C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FFG672C meets industry standards.

7.What is the process for return or replacement of XC4VFX60-11FFG672C?

All XC4VFX60-11FFG672C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FFG672C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC4VFX60-11FFG672C part is unused and in its original packaging.

Return procedure for XC4VFX60-11FFG672C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC4VFX60-11FFG672C Tags

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