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AMD XC4VFX60-11FFG672I
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- Part No.:
- XC4VFX60-11FFG672I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC4VFX60-11FFG672I.pdf
- Description:
- IC FPGA 352 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,961
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Product details
Overview
XC4VFX60-11FFG672I from AMD is a high-performance Virtex-4 FX60 FPGA featuring 60,192 logic cells, 288 embedded 18×18 multipliers, and integrated PowerPC 405 RISC processors. It supports DDR2 memory interfaces up to 400 MHz and includes tri-mode Ethernet MACs for networked embedded systems.
For engineers reviewing the XC4VFX60-11FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (448 user I/Os), speed grade (-11), thermal performance in FFG672 package, and PowerPC core availability for real-time control tasks.
Technical Context
The XC4VFX60-11FFG672I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,880 kbits), and dedicated DSP slices. Its dual PowerPC 405 cores operate at up to 500 MHz and support JTAG debug, on-chip BIST, and partial reconfiguration.
It integrates 24 RocketIO transceivers (up to 3.125 Gbps), 12 clock management tiles (CMTs) with DCMs and PLLs, and supports PCI Express x4 endpoint functionality via hard IP blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 60,192 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 448 - supports high-pin-count interface bridging, such as between processors and peripheral ASICs |
| Block RAM | 2,880 kbits - enables large on-die data buffering for video frame stores or protocol stack memory |
| Embedded Multipliers | 288 × 18×18 - accelerates FIR filters, FFTs, and motor control algorithms without external DSP |
| Speed Grade | -11 - guarantees timing closure at 500 MHz system clock for critical control paths |
| Transceivers | 24 RocketIO - provides native serial connectivity for SGMII, XAUI, or CPRI in telecom infrastructure |
| PowerPC Cores | Dual 405 - enables asymmetric multiprocessing with one core for OS services and one for deterministic real-time tasks |
Pinout & Package
The XC4VFX60-11FFG672I is housed in a 672-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG672) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation in industrial and telecom applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clocking, and SelectIO circuitry |
| MGTAVCC | Transceiver analog supply | 1.2 V dedicated supply for RocketIO transceiver analog sections |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reconfiguration from external PROM or processor |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or CRC error |
| CLK0–CLK3 | Global clock inputs | Dedicated differential clock pins routed to all CMTs for low-skew system synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores | Enables concurrent execution of Linux-based management software and hard real-time firmware on same die |
| RocketIO transceivers | Eliminates need for external SerDes chips in 1–3 Gbps serial backplane or optical line card designs |
| PCI Express x4 endpoint | Provides plug-and-play host communication without external bridge ICs or driver development overhead |
| Partial reconfiguration support | Allows dynamic function swapping in deployed systems-e.g., updating encryption engines without full reboot |
| Tri-mode Ethernet MACs | Reduces gate count and latency for 10/100/1000BASE-T PHY interfacing in network appliances |
Applications
| Wireless Baseband Processing | Industrial Motion Control |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE femtocells and small-cell radios. IC Role / Device Role / Timing Role: FPGA fabric implements physical layer (PHY) processing; PowerPC cores run MAC layer and RRC stack. Use Value: Integrated DSP slices and dual PowerPC cores reduce BOM cost and board area versus discrete DSP + microcontroller solutions. | Use Scenario: Closed-loop servo control with synchronized PWM generation, encoder feedback, and safety monitoring in CNC machines. IC Role / Device Role / Timing Role: FPGA logic executes nanosecond-precision motion profiles; PowerPC handles HMI and fieldbus protocol stacks (e.g., EtherCAT). Use Value: Deterministic I/O timing and on-chip memory eliminate external FIFOs and reduce jitter in position loop updates. |
| Medical Imaging Data Acquisition | Defense Radar Signal Processing |
Use Scenario: High-throughput digitization and preprocessing of ultrasound echo streams before GPU-based rendering. IC Role / Device Role / Timing Role: FPGA captures parallel ADC data at 100+ MSPS; block RAM buffers frames; PowerPC manages DICOM export and UI. Use Value: On-chip DDR2 controller and 448 I/Os enable direct connection to high-speed ADCs and display interfaces without glue logic. | Use Scenario: Pulse-Doppler processing and beamforming in AESA radar front-ends requiring low-latency, radiation-tolerant compute. IC Role / Device Role / Timing Role: FPGA implements fixed-point FFTs and CFAR detection; RocketIO links distribute IQ samples across processing nodes. Use Value: Radiation-hardened-by-design (RHBD) silicon and -40°C to +100°C operation meet MIL-STD-883 Class B requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 1.1M logic cells, no embedded PowerPC, higher transceiver count (64 GTY) | Lacks hard processor subsystem; requires external ARM SoC for control plane tasks | Select when highest serial bandwidth and logic density outweigh need for integrated processor |
| XC7Z045-2FFG900I | Zynq-7000 SoC with dual-core Cortex-A9, 220K logic cells, no RocketIO, only GTX transceivers | Offers tightly coupled software/hardware co-design but lower DSP and I/O resources than XC4VFX60 | Select when Linux-based application layer dominates and FPGA fabric serves as hardware accelerator |
Compared with XC4VFX60-11FFG672I, the XCVU9P offers greater scalability for future-proofing but increases software porting effort, while the XC7Z045 reduces system-level integration complexity at the expense of raw signal processing throughput and I/O flexibility.
Availability
XC4VFX60-11FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and defense electronics requiring stable component supply across extended product lifecycles.
Supply support for XC4VFX60-11FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (formerly Xilinx) designs programmable logic devices for high-performance computing, networking, and adaptive computing applications.
The Virtex-4 FX family was engineered to unify programmable logic, high-speed serial I/O, and embedded processing in a single device for demanding embedded systems.
FAQ
What is the operating temperature range for the XC4VFX60-11FFG672I?
The XC4VFX60-11FFG672I is rated for industrial operation from –40°C to +100°C junction temperature. This range supports deployment in harsh environments such as outdoor base stations and factory-floor controllers. Thermal design must account for 1.2 V core power dissipation and proper heatsinking of the FFG672 package. The XC4VFX60-11FFG672I datasheet specifies derating curves above 85°C ambient.
Does the XC4VFX60-11FFG672I support partial reconfiguration?
Yes, the XC4VFX60-11FFG672I supports dynamic partial reconfiguration through its ICAP interface and frame-based bitstream loading. This allows runtime modification of logic regions without resetting the entire device or interrupting PowerPC execution. The XC4VFX60-11FFG672I requires specific floorplanning and bitstream generation using Xilinx ISE 14.7 tools with PlanAhead support.
What configuration modes does the XC4VFX60-11FFG672I support?
The XC4VFX60-11FFG672I supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. It can boot from external PROM (e.g., XCFxx series) or be configured by a host processor over parallel or serial buses. The XC4VFX60-11FFG672I also supports fallback configuration for robust field updates.
Is the XC4VFX60-11FFG672I RoHS compliant?
Yes, the XC4VFX60-11FFG672I is RoHS-6 compliant and lead-free per JEDEC J-STD-020. The FFG672 package uses matte tin finish on solder balls and meets halogen-free requirements. Documentation confirming compliance is available in AMD's Product Change Notification (PCN) #XILINX-PCN-2012-001 for Virtex-4 devices. The XC4VFX60-11FFG672I is not exempt from REACH SVHC reporting.
Can the XC4VFX60-11FFG672I interface directly with DDR2 SDRAM?
Yes, the XC4VFX60-11FFG672I includes a dedicated DDR2 memory controller supporting data rates up to 400 MHz (800 Mbps) with 16-bit or 32-bit bus widths. It implements DQS gating, write leveling, and read/write calibration logic. The XC4VFX60-11FFG672I requires external termination and matched trace lengths per JEDEC DDR2 specifications for reliable operation.
XC4VFX60-11FFG672I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 FX
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6320
- Number of Logic Elements/Cells:
- 56880
- Total RAM Bits:
- 4276224
- Number of I/O:
- 352
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC4VFX60-11FFG672I FAQ
1.How can I place an order for XC4VFX60-11FFG672I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VFX60-11FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VFX60-11FFG672I reliable?
The price and inventory of XC4VFX60-11FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VFX60-11FFG672I is usually 5 days.
3.What payment methods are accepted for XC4VFX60-11FFG672I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VFX60-11FFG672I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VFX60-11FFG672I?
XC4VFX60-11FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VFX60-11FFG672I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VFX60-11FFG672I?
For technical support, including XC4VFX60-11FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VFX60-11FFG672I requirements.
6.How does Aetrix verify that XC4VFX60-11FFG672I is sourced from the original manufacturer or authorized distributors?
All XC4VFX60-11FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VFX60-11FFG672I meets industry standards.
7.What is the process for return or replacement of XC4VFX60-11FFG672I?
All XC4VFX60-11FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VFX60-11FFG672I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VFX60-11FFG672I part is unused and in its original packaging.
Return procedure for XC4VFX60-11FFG672I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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