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AMD XC4VLX100-10FFG1513C
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- Part No.:
- XC4VLX100-10FFG1513C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX100-10FFG1513C.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,915
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Product details
Overview
XC4VLX100-10FFG1513C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 97,280 logic cells, 6,144 Kbits of block RAM, and 320 DSP48 slices. It supports up to 720 user I/Os in a 1513-pin Flip-Chip BGA package with 1.2V core voltage and -10 speed grade. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VLX100-10FFG1513C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded memory capacity, DSP resource availability, and thermal/power characteristics for board-level integration.
Technical Context
The XC4VLX100-10FFG1513C implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It integrates SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards across its 720 user I/O pins.
It includes 320 hardwired DSP48 slices operating at up to 500 MHz, each capable of 18×18-bit signed multiplication with optional accumulator and pipeline registers. The device uses 90 nm copper process technology and supports partial reconfiguration via JTAG and SelectMAP interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 97,280 - total programmable logic resources for complex state machines and data paths |
| Block RAM | 6,144 Kbits - on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 320 × DSP48 - fixed-function arithmetic units enabling real-time filtering and FFT acceleration |
| User I/O Pins | 720 - configurable single-ended and differential I/Os with programmable drive strength and slew rate |
| Core Voltage | 1.2 V ±3% - defines power delivery network design and low-voltage regulator selection |
| Speed Grade | -10 - maximum guaranteed clock frequency for CLB-to-CLB paths at rated voltage and temperature |
| Package | FFG1513 - 1513-pin flip-chip BGA with 1.0 mm pitch, requiring controlled-depth solder paste and reflow profile |
Pinout & Package
XC4VLX100-10FFG1513C is housed in a 1513-pin Flip-Chip BGA (FFG1513) package with 35 × 35 array, 1.0 mm ball pitch, and thermal lid. Pinout follows Xilinx Virtex-4 LX100 standard layout per DS112 v2.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise decoupling within 10 mm of each power ball |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, JTAG, and SelectIO banks; shared across multiple I/O banks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; determines compatible interface standards (e.g., 1.8 V for SSTL18) |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload from master serial PROM |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading; pulled high externally to enable startup sequencing |
| CCLK | Configuration clock | Input clock for slave serial configuration mode; frequency ≤ 50 MHz limits programming time |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full system reset, reducing downtime in telecom baseband processing |
| SelectIO Technology | Supports 18 I/O standards including LVDS, SSTL2, and HSTL, allowing direct interfacing to DDR2 SDRAM and SERDES PHYs |
| DSP48 Slice Architecture | Hardwired 18×18 multiplier with pre-adder and pipeline register, delivering deterministic 500-MHz MAC throughput |
| Embedded PowerPC 405 Cores (optional) | Not present in LX100 variant - only available in FX and SX families; LX focuses on logic and DSP density |
| 90 nm Copper Process | Reduces dynamic power by ~30% vs. 130 nm predecessors while enabling higher gate density and clock rates |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines synchronized to 100 MHz system clock with sub-cycle timing control. Use Value: 320 DSP48 slices enable simultaneous 128-channel FFT computation at 200 MSPS input rate without external co-processors. | Use Scenario: High-speed image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic implements custom back-projection pipelines with precise latency matching between ADC interface and memory controller. Use Value: 6,144 Kbits of block RAM provides on-chip buffering for 4K×4K sinogram tiles, eliminating off-chip memory bottlenecks. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: Protocol-aware pattern generation and response analysis in automated test systems for PCIe and SATA devices. IC Role / Device Role / Timing Role: Dual-role I/O banks interface directly to DUTs at 3.125 Gbps (PCIe Gen1) with deterministic setup/hold margins. Use Value: 720 user I/Os support concurrent multi-port test head control, reducing test cycle time by consolidating instrumentation logic. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Dedicated logic handles time-triggered message scheduling and CRC validation with <1 µs jitter. Use Value: -10 speed grade guarantees timing closure for 16 MHz ARINC 429 transmit clocks across industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-1FF1136C | 65 nm process, 110K logic cells, 1136-pin FCBGA, no native PCI Express block | Higher density but lacks integrated PCIe endpoint; requires external PHY for PCIe Gen2 | Suitable when migrating to smaller form factor with increased logic but no PCIe requirement |
| XC6VLX130T-1FF784C | 40 nm process, 130K logic cells, 784-pin FCBGA, includes GTX transceivers and PCIe Gen2 x4 endpoint | Integrated high-speed serial I/O enables direct PCIe Gen2 link; lower I/O count (480 vs. 720) | Preferred for new designs needing serial connectivity and reduced board layer count |
Compared with XC4VLX100-10FFG1513C, the XC5VLX110 offers higher logic density in a smaller package but sacrifices I/O count and serial interface capability, while the XC6VLX130T adds transceiver-based serial protocols at the cost of I/O flexibility-making XC4VLX100-10FFG1513C optimal for wide parallel bus architectures requiring maximum pin count and deterministic timing.
Availability
XC4VLX100-10FFG1513C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and high-speed test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC4VLX100-10FFG1513C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Virtex product lines for aerospace, defense, and industrial customers requiring long-lifecycle support.
The Virtex-4 LX family was designed for high-density logic and DSP-intensive applications where parallel processing, large on-chip memory, and I/O flexibility outweigh serial transceiver requirements.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX100-10FFG1513C?
The XC4VLX100-10FFG1513C supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration. Valid standards include SSTL18 (1.8 V), HSTL (1.5 V), LVCMOS25 (2.5 V), and LVDS (2.5 V VCCO). Each bank's VCCO must match the selected standard's required voltage, and mixing standards within a bank is prohibited. XC4VLX100-10FFG1513C does not support 1.0 V or 3.6 V operation.
Does XC4VLX100-10FFG1513C support partial reconfiguration in production systems?
Yes, XC4VLX100-10FFG1513C supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and JTAG interfaces, validated in Xilinx ISE 12.4 and later toolchains. This capability allows runtime swapping of functional modules-such as filter coefficients or protocol stacks-without resetting the entire device. XC4VLX100-10FFG1513C requires bitstream partitioning and floorplanning during implementation to ensure timing isolation between static and dynamic regions.
What thermal management guidance applies to XC4VLX100-10FFG1513C in continuous operation?
XC4VLX100-10FFG1513C has a maximum junction temperature of 100°C and requires a thermal solution achieving ≤ 1.8°C/W θJA under typical 12 W power dissipation. Recommended practices include 4-layer PCB with internal ground/power planes, 12+ thermal vias under the package center, and a 25 mm² copper pad connected to inner planes. XC4VLX100-10FFG1513C thermal lid must remain unobstructed and compatible with standard heat sink mounting pressure (25–45 psi).
Can XC4VLX100-10FFG1513C be configured via SPI flash memory?
Yes, XC4VLX100-10FFG1513C supports master serial configuration from industry-standard SPI flash devices (e.g., Micron N25Q series) using the dedicated CCLK, DIN, and INIT_B pins. Configuration mode is set via MODE pins (M2:M0 = 001). XC4VLX100-10FFG1513C requires a minimum 20 MHz CCLK for reliable SPI read cycles and supports dual-boot images with fallback addressing.
Is there a pin-compatible replacement for XC4VLX100-10FFG1513C in newer Virtex families?
No, XC4VLX100-10FFG1513C has no pin-compatible replacement in Virtex-5 or Virtex-6 families due to differing ball maps, power pin allocations, and I/O bank arrangements. Migration requires PCB redesign and logic re-implementation. XC4VLX100-10FFG1513C remains supported under AMD's long-term availability program for legacy systems where hardware stability is critical.
XC4VLX100-10FFG1513C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12288
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4423680
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX100-10FFG1513C FAQ
1.How can I place an order for XC4VLX100-10FFG1513C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX100-10FFG1513C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX100-10FFG1513C reliable?
The price and inventory of XC4VLX100-10FFG1513C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX100-10FFG1513C is usually 5 days.
3.What payment methods are accepted for XC4VLX100-10FFG1513C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX100-10FFG1513C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX100-10FFG1513C?
XC4VLX100-10FFG1513C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX100-10FFG1513C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX100-10FFG1513C?
For technical support, including XC4VLX100-10FFG1513C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX100-10FFG1513C requirements.
6.How does Aetrix verify that XC4VLX100-10FFG1513C is sourced from the original manufacturer or authorized distributors?
All XC4VLX100-10FFG1513C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX100-10FFG1513C meets industry standards.
7.What is the process for return or replacement of XC4VLX100-10FFG1513C?
All XC4VLX100-10FFG1513C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX100-10FFG1513C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX100-10FFG1513C part is unused and in its original packaging.
Return procedure for XC4VLX100-10FFG1513C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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