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AMD XC4VLX100-11FF1513I
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- Part No.:
- XC4VLX100-11FF1513I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX100-11FF1513I.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,938
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Product details
Overview
XC4VLX100-11FF1513I from AMD is a high-density Virtex-4 LX family FPGA featuring 97,280 logic cells, 6,144 Kbits of block RAM, and support for DDR2 memory interfaces up to 400 MHz. It integrates 320 DSP48 slices, operates at -11 speed grade (1.1 ns CLB delay), and is packaged in a 1513-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1513) with I/O voltage support of 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. It targets high-performance digital signal processing in telecom infrastructure equipment.
For engineers reviewing the XC4VLX100-11FF1513I datasheet, pinout, applications, or equivalent options, key selection considerations include logic density, embedded memory capacity, DSP slice count, I/O voltage flexibility, and thermal performance in compact form factor designs.
Technical Context
The XC4VLX100-11FF1513I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains. It supports SelectIO technology with programmable slew rate, drive strength, and on-die termination across all I/O banks.
This device includes integrated PCI Express™ Endpoint Block (v1.0a), RocketIO™ multi-gigabit transceivers operating up to 3.125 Gbps, and a PowerPC™ 405 hard processor core option in other members of the Virtex-4 family - though the XC4VLX100-11FF1513I variant does not include the PowerPC core.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 97,280 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Block RAM | 6,144 Kbits - enables large on-chip buffering for video frame storage or packet buffering without external memory |
| DSP48 Slices | 320 - provides dedicated hardware for multiply-accumulate operations in FIR filters or FFT engines |
| Max I/O Count | 768 - supports high-pin-count interface consolidation including parallel buses and multiple serial protocols |
| Speed Grade | -11 - guarantees 1.1 ns CLB propagation delay, enabling 500+ MHz system clock domain timing closure |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, Differential LVDS - allows direct interfacing with DDR2, QDR SRAM, and legacy parallel peripherals |
| Package | FFG1513 - 1513-ball flip-chip BGA with 1.0 mm pitch; requires controlled impedance PCB stack-up and thermal vias for power delivery |
Pinout & Package
XC4VLX100-11FF1513I is housed in a 1513-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG1513) package with 35 rows × 35 columns array, center power/ground ball configuration, and thermal pad under die. Pinout follows Xilinx (now AMD) Virtex-4 LX100 standard layout documented in DS112 (v2.5) and UG070 (v3.2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% required for CLB and routing fabric; decoupling critical for signal integrity |
| VCCAUX | Auxiliary supply | 2.5 V for configuration logic, JTAG, and select I/O banks; shared with transceiver auxiliary rails |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V per bank; sets output swing and input threshold for associated pins |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and internal initialization completion |
| CLKIN | Primary clock input | Dedicated global clock pin feeding DCMs; supports single-ended or differential (via IBUFGDS) signaling |
Key Features
| Feature | Design Value |
|---|---|
| Advanced SelectIO Technology | Per-bank I/O voltage control, programmable drive strength (2–24 mA), and on-die termination (25–150 Ω) reduce external component count |
| Dedicated Clock Management | Four Digital Clock Managers (DCMs) per device provide jitter reduction, frequency synthesis, and phase shifting without external PLLs |
| Embedded Memory Blocks | 18-Kbit block RAM primitives support true dual-port operation at 500+ MHz, enabling synchronous FIFOs and lookup tables |
| Multi-Gigabit Transceivers | RocketIO™ GTP transceivers operate at 622 Mbps–3.125 Gbps; XC4VLX100-11FF1513I includes 24 channels (12 pairs) |
| PCI Express Endpoint Logic | Hard IP block compliant with PCI Express Base Specification v1.0a supports x1, x2, x4 lane configurations with full link training |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channel coding/decoding and MIMO signal processing in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing Turbo decoder, Viterbi decoder, and FFT/IFFT engines synchronized to 122.88 MHz reference clock. Use Value: 97,280 logic cells and 320 DSP48 slices enable concurrent execution of multiple air-interface standards within single device footprint. | Use Scenario: Pattern generation and response analysis in automated test systems for ASIC and SoC validation. IC Role / Device Role / Timing Role: High-speed digital pattern generator with deterministic sub-nanosecond timing control across 768 I/O pins. Use Value: -11 speed grade and 1.1 ns CLB delay ensure precise setup/hold timing margins for 500+ MHz vector rates. |
| Optical Transport Networking | Avionics Data Concentrators |
Use Scenario: Forward error correction (FEC) and OTU frame mapping in 10G/40G optical line cards. IC Role / Device Role / Timing Role: Protocol-aware packet processor handling OTU2/OTU3 framing, GFP encapsulation, and Reed-Solomon encoding at line rate. Use Value: 6,144 Kbits of block RAM provides deep buffering for OTU frame alignment and latency compensation. | Use Scenario: ARINC 664 (AFDX) endpoint switching and time-triggered Ethernet bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic switch fabric managing up to 64 virtual links with guaranteed bandwidth and bounded latency. Use Value: Per-bank I/O voltage support (1.8 V/2.5 V/3.3 V) enables direct interface with mixed-voltage avionics sensors and actuators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVB2104I | UltraScale+ architecture; 1,182K logic cells; 48.8 Mb block RAM; no RocketIO but includes GTY transceivers (up to 32.75 Gbps) | Targets next-gen 100G+ coherent optics and AI inference acceleration where higher throughput and lower power/GHz are critical | Not pin-compatible; requires new PCB layout and toolchain migration to Vivado 2020.2+ |
| XC5VLX110-2FF1136C | Virtex-5 LX110; 110,592 logic cells; 6,480 Kbits block RAM; RocketIO GTP up to 3.75 Gbps; same FFG1136 package footprint but different ball map | Offers higher logic density and faster transceivers than XC4VLX100, suited for upgraded backplane interconnects requiring PCIe Gen2 | Not drop-in; I/O bank assignment and power rail routing differ significantly despite similar pin count |
Compared with XC4VLX100-11FF1513I, XCVU3P-2FFVB2104I delivers 12× more logic and modern transceivers but demands full system redesign, while XC5VLX110-2FF1136C extends the Virtex-4 roadmap with modest density gain yet retains similar design flow and tooling compatibility.
Availability
XC4VLX100-11FF1513I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX100-11FF1513I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and software tools for heterogeneous compute acceleration.
The Virtex-4 family was originally designed by Xilinx for high-performance logic-intensive applications demanding high-speed serial connectivity, embedded processing capability, and flexible I/O interfacing in telecommunications and military-aerospace systems.
FAQ
What is the maximum operating junction temperature for XC4VLX100-11FF1513I?
The XC4VLX100-11FF1513I has a maximum allowable junction temperature of 100°C under continuous operation, as specified in the Virtex-4 DC and Switching Characteristics datasheet (DS112). Thermal design must ensure adequate heat dissipation via PCB copper pour, thermal vias, and optional heatsink attachment to maintain reliability over lifetime.
Does XC4VLX100-11FF1513I support JTAG boundary-scan testing?
Yes, XC4VLX100-11FF1513I fully supports IEEE 1149.1 (JTAG) boundary-scan testing through dedicated TCK, TMS, TDI, and TDO pins. The device implements a 4-bit instruction register and supports SAMPLE/PRELOAD, EXTEST, and INTEST instructions for board-level interconnect verification and in-system programming.
Can XC4VLX100-11FF1513I be configured using Master Serial mode?
Yes, XC4VLX100-11FF1513I supports Master Serial configuration mode using an external PROM (e.g., XCFxx series) connected to the dedicated configuration interface pins. In this mode, the FPGA drives the configuration clock (CCLK) and reads the bitstream serially from the PROM upon power-up or PROGRAM_B assertion.
What configuration memory technology does XC4VLX100-11FF1513I use?
XC4VLX100-11FF1513I uses SRAM-based configuration memory, meaning its logic and routing configuration is volatile and must be reloaded after each power cycle. Configuration is typically performed via external PROM, processor-controlled slave parallel/serial mode, or JTAG download using iMPACT or Vivado Hardware Manager.
Is XC4VLX100-11FF1513I RoHS compliant?
Yes, XC4VLX100-11FF1513I is RoHS compliant and lead-free, meeting Directive 2011/65/EU requirements. The FFG1513 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.
XC4VLX100-11FF1513I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12288
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4423680
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX100-11FF1513I FAQ
1.How can I place an order for XC4VLX100-11FF1513I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX100-11FF1513I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX100-11FF1513I reliable?
The price and inventory of XC4VLX100-11FF1513I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX100-11FF1513I is usually 5 days.
3.What payment methods are accepted for XC4VLX100-11FF1513I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX100-11FF1513I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX100-11FF1513I?
XC4VLX100-11FF1513I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX100-11FF1513I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX100-11FF1513I?
For technical support, including XC4VLX100-11FF1513I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX100-11FF1513I requirements.
6.How does Aetrix verify that XC4VLX100-11FF1513I is sourced from the original manufacturer or authorized distributors?
All XC4VLX100-11FF1513I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX100-11FF1513I meets industry standards.
7.What is the process for return or replacement of XC4VLX100-11FF1513I?
All XC4VLX100-11FF1513I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX100-11FF1513I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX100-11FF1513I part is unused and in its original packaging.
Return procedure for XC4VLX100-11FF1513I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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