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AMD XC4VLX100-11FFG1513C
- Part No.:
- XC4VLX100-11FFG1513C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX100-11FFG1513C.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,027
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Product details
Overview
XC4VLX100-11FFG1513C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA featuring 98,304 logic cells, 6.4 Mb of block RAM, and 320 DSP48 slices. It uses a 90 nm copper process, supports differential I/O standards including LVDS and SSTL, and operates at -11 speed grade with commercial temperature range (0°C to 85°C). It is deployed in high-bandwidth digital signal processing systems such as radar baseband processors.
For engineers reviewing the XC4VLX100-11FFG1513C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (1048 user I/Os), package type (FFG1513 flip-chip BGA), configuration interface (SelectMAP, JTAG, serial PROM), and supported transceiver protocols (RocketIO GTP).
Technical Context
The XC4VLX100-11FFG1513C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and block RAM organized in 18-kb dual-port modules. It integrates RocketIO GTP transceivers capable of 2.5–3.75 Gbps line rates and supports PCI Express x4 Gen1 endpoints via hard IP cores.
Configuration is performed via Master SelectMAP mode using external parallel PROM or through JTAG boundary-scan. The device includes internal DCI (Digitally Controlled Impedance) for on-die termination and supports multi-voltage I/O banks (1.2 V to 3.3 V) with independent bank voltage control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 98,304 - provides scalable fabric for complex RTL implementations including multi-channel FFT engines or packet classification logic |
| Block RAM | 6.4 Mb - enables large on-chip buffering for video frame stores or protocol stack state tables |
| DSP Slices | 320 × DSP48 - delivers 320 parallel 18×18-bit multiply-accumulate operations per clock cycle |
| I/O Count | 1048 user I/Os - supports high-pin-count interfaces such as DDR2 memory controllers and parallel camera sensor buses |
| Transceiver Speed | 2.5–3.75 Gbps - enables serial links compliant with SATA, Serial RapidIO, and CPRI v4.0 |
| Speed Grade | -11 - guarantees timing closure for designs operating at up to 500 MHz system clock with critical path constraints |
| Package | FFG1513 - 1513-ball flip-chip BGA with 1.0 mm pitch, supporting high-density PCB routing and thermal dissipation via thermal ball array |
Pinout & Package
The XC4VLX100-11FFG1513C is housed in a 1513-ball flip-chip BGA (FFG1513) package with 1.0 mm ball pitch, thermal balls arranged in central array, and I/O banks distributed across four sides. Pin functions are defined per bank voltage and I/O standard assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V nominal; powers CLB, block RAM, and DSP logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V nominal; supplies configuration logic, clock management tiles, and JTAG circuitry |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V); sets output swing and input threshold for associated I/O pins |
| CCLK | Configuration clock | Input-only during Master SelectMAP configuration; drives internal configuration shift register |
| DIN | Configuration data input | Serial or parallel data input during SelectMAP or slave serial configuration modes |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 slices | Hardwired 18×18 multiplier + 48-bit accumulator per slice, enabling deterministic latency for real-time filtering |
| RocketIO GTP transceivers | Integrated 2.5–3.75 Gbps serial transceivers with built-in 8B/10B encoder/decoder and elastic buffer |
| Digital Clock Manager (DCM) | Provides jitter reduction, frequency synthesis (×2 to ×32), and phase shifting (±180°) without external PLL components |
| Internal DCI termination | On-die series or parallel termination matching 30–60 Ω, eliminating need for external resistors on source-synchronous buses |
| SelectMAP configuration | Parallel configuration interface supporting up to 32-bit wide data bus and 100 MHz clock for fast bitstream loading |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; RocketIO links transmit processed data to host processor over Serial RapidIO. Use Value: 320 DSP48 slices enable concurrent multi-channel processing; 6.4 Mb block RAM buffers full chirp sequences for coherent integration. | Use Scenario: High-throughput image reconstruction pipeline in CT scanner backends handling 128-slice raw projection data. IC Role / Device Role / Timing Role: XC4VLX100-11FFG1513C implements FPGA-accelerated filtered back-projection and DICOM compression before PCIe transfer. Use Value: 1048 I/Os support parallel ADC interfaces and DDR2 memory controller; -11 speed grade ensures sub-5 ns timing margins on 200 MHz pixel clocks. |
| Wireless Baseband Unit | Industrial Protocol Gateway |
Use Scenario: LTE-Advanced macrocell baseband unit performing layer-1 PHY processing including channel coding, OFDM modulation, and MIMO detection. IC Role / Device Role / Timing Role: Configurable logic implements Turbo decoder and FFT/IFFT engines; RocketIO GTP connects to remote radio head via CPRI. Use Value: 98,304 logic cells accommodate dual-sector PHY stacks; GTP transceivers meet CPRI v4.0 3.072 Gbps line rate requirement. | Use Scenario: Multi-protocol industrial gateway bridging EtherCAT, PROFINET, and Modbus TCP in factory automation controllers. IC Role / Device Role / Timing Role: XC4VLX100-11FFG1513C hosts soft-core microblaze processors and protocol accelerators with deterministic real-time response. Use Value: Independent I/O banks allow simultaneous 2.5 V EtherCAT PHY and 3.3 V Ethernet MAC interfaces; DCI supports precise impedance matching on 100 Mbps differential buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 1.1 million LUTs, 33.6 Gb/s GTY transceivers, 0.85 V core voltage | Supports PCIe Gen4, 100G Ethernet, and AI inference acceleration; not pin-compatible | Choose for new designs requiring >5× logic density and advanced transceivers; migration requires full RTL and PCB redesign |
| XC5VLX110T-2FF1136C | Virtex-5 LX family, 110K logic cells, 6.48 Mb block RAM, 24 RocketIO GTX transceivers (3.75 Gbps) | Same generation I/O compatibility; lacks integrated PCI Express endpoint hard IP | Consider for drop-in replacement where existing PCB supports FF1136 package and design fits within 110K cell limit |
Compared with XC4VLX100-11FFG1513C, the XCVU3P offers vastly higher bandwidth and logic capacity but demands new board layout and toolchain migration, while the XC5VLX110T provides incremental upgrade path with compatible I/O standards and similar transceiver performance-though it requires package change and lacks hardened PCIe blocks.
Availability
XC4VLX100-11FFG1513C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and wireless baseband units requiring stable component supply across extended production lifecycles.
Supply support for XC4VLX100-11FFG1513C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-4 family was originally designed by Xilinx for high-performance logic, DSP, and serial connectivity in infrastructure equipment-targeting applications demanding both computational density and multi-gigabit serial I/O.
FAQ
What is the maximum supported transceiver line rate for XC4VLX100-11FFG1513C?
The XC4VLX100-11FFG1513C integrates RocketIO GTP transceivers rated for 2.5–3.75 Gbps operation. This supports protocols including CPRI v4.0 at 3.072 Gbps, SATA II at 3.0 Gbps, and Serial RapidIO at 3.125 Gbps. Line rate selection is configured per transceiver channel using IBERT or custom logic.
Does XC4VLX100-11FFG1513C support PCI Express Gen1 endpoints?
Yes, XC4VLX100-11FFG1513C includes hardened PCI Express Gen1 endpoint logic supporting x1, x2, and x4 configurations. The implementation complies with PCI Express Base Specification v1.1 and requires no external PHY. Configuration is handled via dedicated PCIe block registers and AXI-style user interface.
What configuration modes are supported by XC4VLX100-11FFG1513C?
XC4VLX100-11FFG1513C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Master SelectMAP allows parallel loading at up to 100 MHz; JTAG is used for debugging and programming; Serial PROM mode uses Xilinx Platform Flash devices with automatic boot after power-up.
How many I/O banks does XC4VLX100-11FFG1513C have, and what voltage ranges do they support?
XC4VLX100-11FFG1513C has 24 user-configurable I/O banks. Each bank supports independent VCCO voltages from 1.2 V to 3.3 V, enabling mixed-voltage interfaces such as 1.8 V DDR2 memory and 3.3 V legacy peripherals on the same device. Bank-specific I/O standards include LVCMOS, LVTTL, SSTL, and LVDS.
Is XC4VLX100-11FFG1513C still in active production?
No, XC4VLX100-11FFG1513C is discontinued by AMD (Xilinx). However, Aetrix Electronics maintains legacy inventory and provides long-term supply assurance through authorized redistribution channels, including traceable date-code-matched stock and lifecycle management support for ongoing production programs.
XC4VLX100-11FFG1513C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12288
- Number of Logic Elements/Cells:
- 110592
- Total RAM Bits:
- 4423680
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX100-11FFG1513C FAQ
1.How can I place an order for XC4VLX100-11FFG1513C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX100-11FFG1513C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX100-11FFG1513C reliable?
The price and inventory of XC4VLX100-11FFG1513C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX100-11FFG1513C is usually 5 days.
3.What payment methods are accepted for XC4VLX100-11FFG1513C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX100-11FFG1513C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX100-11FFG1513C?
XC4VLX100-11FFG1513C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX100-11FFG1513C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX100-11FFG1513C?
For technical support, including XC4VLX100-11FFG1513C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX100-11FFG1513C requirements.
6.How does Aetrix verify that XC4VLX100-11FFG1513C is sourced from the original manufacturer or authorized distributors?
All XC4VLX100-11FFG1513C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX100-11FFG1513C meets industry standards.
7.What is the process for return or replacement of XC4VLX100-11FFG1513C?
All XC4VLX100-11FFG1513C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX100-11FFG1513C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX100-11FFG1513C part is unused and in its original packaging.
Return procedure for XC4VLX100-11FFG1513C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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