AMD XC4VLX15-10SFG363C
- Part No.:
- XC4VLX15-10SFG363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX15-10SFG363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VLX15-10SFG363C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 14,579 logic cells, 1.2 Mb of block RAM, and a maximum I/O count of 240 in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -10 speed grade (1.0 ns CLB delay), supports SelectIO™ standards up to 840 Mbps, and targets high-performance embedded processing and digital signal processing applications.
For engineers reviewing the XC4VLX15-10SFG363C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility (1.2 V to 3.3 V), embedded multiplier count (64 × 18-bit), clock management tile (CMT) configuration, and thermal performance in industrial temperature range (0°C to 85°C).
Technical Context
The XC4VLX15-10SFG363C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates twelve Digital Clock Managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis across multiple clock domains.
It supports PCI Express x1 endpoint functionality via RocketIO™ multi-gigabit transceivers (not present in this LX variant), and includes 64 embedded 18×18 multipliers optimized for DSP filtering and FFT computation. Configuration is performed via Master Serial mode using external PROM or processor-controlled JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 1.2 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage |
| I/O Pins | 240 - enables high peripheral connectivity with bank-wise voltage isolation |
| Speed Grade | -10 - guarantees 1.0 ns CLB propagation delay under worst-case industrial conditions |
| Operating Temp | 0°C to +85°C - qualified for industrial environment deployment without derating |
| Package | 363-pin FBGA (SFG363) - 19×19 mm body, 1.0 mm ball pitch, RoHS-compliant |
| Embedded Multipliers | 64 × 18-bit - accelerates MAC operations in FIR, IIR, and correlation algorithms |
Pinout & Package
XC4VLX15-10SFG363C is housed in a 363-ball Fine-Pitch BGA (SFG363) package with 19×19 array, 1.0 mm pitch, and standard ball assignment per Xilinx DS112 v2.1. Power, ground, configuration, and I/O balls are distributed across banks with independent VCCO and VREF support per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master Serial mode; requires external 50 MHz max clock |
| DIN | Configuration Data Input | Serial bitstream input for FPGA initialization; synchronous to CCLK |
| PROGRAM_B | Active-Low Reset | Forces reconfiguration and clears configuration memory; asynchronous reset input |
| INIT_B | Configuration Status Output | Open-drain indicator signaling completion or error during configuration |
| Done | Configuration Completion | Push-pull output asserting high when configuration is successfully completed |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | 64 × 18×18 multipliers with optional accumulator and pipeline register for real-time filtering |
| Digital Clock Manager (DCM) | 12 DCMs providing jitter reduction, phase shifting, and frequency synthesis without external PLL |
| SelectIO™ Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, RSDS) per I/O bank |
| Block RAM Flexibility | Configurable as 16Kb or 32Kb dual-port RAM, or 18Kb single-port RAM with byte-write enable |
| Thermal Management | Thermal pad on underside of package enables direct PCB thermal vias for industrial ambient dissipation |
Applications
| Radar Signal Processing | Industrial Motion Control |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based radar systems with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and beamforming algorithms; DCMs synchronize ADC sampling clocks and DAC reconstruction clocks. Use Value: 64 embedded multipliers enable parallel 1024-point FFT execution within 2.1 µs; 1.2 Mb block RAM stores radar frame buffers without external memory access. | Use Scenario: Closed-loop servo control in CNC machine tools requiring deterministic 100 kHz PWM update and encoder interpolation. IC Role / Device Role / Timing Role: Configurable logic implements PID controllers and quadrature decoding; SelectIO™ interfaces with 3.3 V encoders and 5 V IGBT gate drivers. Use Value: 240 I/O pins allow simultaneous connection to 8-axis encoder inputs, analog feedback channels, and safety monitoring signals; -10 speed grade ensures <15 ns logic path timing closure. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: High-speed image data aggregation from ultrasound transducer arrays before compression and display rendering. IC Role / Device Role / Timing Role: FPGA acts as PCIe endpoint bridge and DMA controller; block RAM buffers raw echo data streams from 16-channel ADCs. Use Value: 14,579 logic cells implement custom AXI4-Stream pipelines for real-time noise suppression; bank-isolated I/O supports mixed-voltage sensor interfacing (1.8 V ADC, 3.3 V display interface). | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control computers with deterministic latency and fault containment. IC Role / Device Role / Timing Role: FPGA provides protocol translation, message scheduling, and hardware CRC generation; DCMs lock to 10 MHz reference for bus timing compliance. Use Value: 12 DCMs enable independent clock domains for each bus interface; industrial temp rating ensures operation in unpressurized avionics bays (-40°C to +85°C derated). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-10FF668C | Higher logic density (24,192 CLBs), larger package (668-pin FF), +20% block RAM | Required for designs needing >18k logic cells or >160 I/Os | Select when XC4VLX15-10SFG363C resource utilization exceeds 90% in critical paths |
| XCV50-4PQ240C | Virtex-II generation, lower speed (-4 grade), no DCMs, only 50k system gates | Suitable for legacy migration where timing margin is relaxed and clock management is external | Choose only for cost-sensitive, non-timing-critical upgrades from older XCV50 designs |
Compared with XC4VLX25-10FF668C and XCV50-4PQ240C, the XC4VLX15-10SFG363C delivers optimal balance of logic resources, I/O count, and clock management capability in a compact 363-ball footprint-making it preferred for space-constrained industrial and aerospace edge-processing modules where thermal and board area are constrained.
Availability
XC4VLX15-10SFG363C is available at Aetrix Electronics and suitable for radar signal processing, industrial motion control, medical imaging backend, and avionics data concentrator applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC4VLX15-10SFG363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio. Xilinx pioneered high-performance programmable logic for demanding compute and signal processing applications.
The Virtex-4 LX family was designed for logic-intensive, high-bandwidth applications including wired communications infrastructure, test equipment, and real-time embedded processing where deterministic timing and flexible I/O are critical.
FAQ
What is the maximum operating frequency of the XC4VLX15-10SFG363C?
The XC4VLX15-10SFG363C has a -10 speed grade, guaranteeing a maximum CLB propagation delay of 1.0 ns under worst-case industrial conditions. Actual achievable system clock frequencies depend on design topology, but internal DCM outputs can reach up to 500 MHz with proper constraints and layout. The XC4VLX15-10SFG363C supports user-defined clock networks with skew control down to ±50 ps across the die.
Does the XC4VLX15-10SFG363C support JTAG boundary-scan testing?
Yes, the XC4VLX15-10SFG363C fully complies with IEEE 1149.1 (JTAG) and supports boundary-scan testing via TCK, TMS, TDI, and TDO pins. It enables pre- and post-configuration verification of I/O pin connectivity and interconnect integrity. The XC4VLX15-10SFG363C also supports INTEST and EXTEST instructions for comprehensive board-level diagnostics.
Can the XC4VLX15-10SFG363C be configured using an SPI flash device?
No-the XC4VLX15-10SFG363C does not support native SPI master configuration. It requires Master Serial mode using a dedicated configuration PROM (e.g., XCFxxP series) or microprocessor-controlled parallel slave mode. The XC4VLX15-10SFG363C's CCLK and DIN pins are designed for synchronous serial bitstream loading, not SPI protocol framing.
What I/O standards are supported by the XC4VLX15-10SFG363C?
The XC4VLX15-10SFG363C supports SelectIO™ standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/III, and differential standards LVDS, RSDS, and BLVDS per I/O bank. Each bank has independent VCCO and VREF, allowing mixed-voltage operation. The XC4VLX15-10SFG363C does not support DDR3 or PCIe Gen2 signaling natively.
Is the XC4VLX15-10SFG363C still in active production?
The XC4VLX15-10SFG363C is discontinued by AMD (Xilinx) but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Aetrix maintains traceable inventory with full lot documentation and offers obsolescence mitigation support, including cross-reference guidance and migration path evaluation for the XC4VLX15-10SFG363C.
XC4VLX15-10SFG363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 13824
- Total RAM Bits:
- 884736
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX15-10SFG363C FAQ
1.How can I place an order for XC4VLX15-10SFG363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX15-10SFG363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX15-10SFG363C reliable?
The price and inventory of XC4VLX15-10SFG363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX15-10SFG363C is usually 5 days.
3.What payment methods are accepted for XC4VLX15-10SFG363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX15-10SFG363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX15-10SFG363C?
XC4VLX15-10SFG363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX15-10SFG363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX15-10SFG363C?
For technical support, including XC4VLX15-10SFG363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX15-10SFG363C requirements.
6.How does Aetrix verify that XC4VLX15-10SFG363C is sourced from the original manufacturer or authorized distributors?
All XC4VLX15-10SFG363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX15-10SFG363C meets industry standards.
7.What is the process for return or replacement of XC4VLX15-10SFG363C?
All XC4VLX15-10SFG363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX15-10SFG363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX15-10SFG363C part is unused and in its original packaging.
Return procedure for XC4VLX15-10SFG363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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