My Inquiry
My Account
AMD XC4VLX15-10SFG363I
- Part No.:
- XC4VLX15-10SFG363I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX15-10SFG363I.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,527
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VLX15-10SFG363I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 14,579 logic cells, 1.2 Mb of block RAM, and a -10 speed grade operating at up to 650 MHz system clock. It features 240 user I/Os in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package and targets high-performance embedded processing and digital signal processing applications.
For engineers reviewing the XC4VLX15-10SFG363I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, block RAM capacity, and support for SelectIO standards including LVDS, SSTL, and HSTL.
Technical Context
The XC4VLX15-10SFG363I implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated DSP slices, and flexible clock management tiles (CMTs) containing DCMs and PLLs. It supports multi-voltage I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V) and includes integrated PCI-X and RocketIO™ multi-gigabit transceivers in higher-density variants - though not present in this LX15 variant.
This device uses 90 nm copper process technology, supports JTAG boundary-scan (IEEE 1149.1), and requires configuration via external PROM or master serial mode. Configuration bitstream security is supported through AES encryption on compatible platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 1.2 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory access |
| Speed Grade | -10 - guarantees timing closure up to 650 MHz system clock in worst-case industrial temperature conditions |
| User I/Os | 240 - enables high interconnect density for parallel bus interfaces, sensor arrays, and multi-channel ADC/DAC control |
| Package | 363-pin FCBGA (SFG363) - 19×19 mm body, 1.0 mm ball pitch, RoHS-compliant, thermal performance suitable for sustained 1.2 W typical power dissipation |
| I/O Standards | LVDS, SSTL-2, SSTL-3, HSTL-I, HSTL-II, LVTTL - allows direct interfacing with DDR SDRAM, image sensors, and high-speed serial peripherals |
Pinout & Package
XC4VLX15-10SFG363I is housed in a 363-pin Fine-Pitch Ball Grid Array (SFG363) package with 19×19 array, 1.0 mm ball pitch, and standard thermal pad layout. Pin functions are organized into I/O banks, configuration pins (INIT_B, PROGRAM_B, DONE), JTAG interface (TCK/TMS/TDI/TDO), and dedicated clock inputs (CLKIN_0, CLKIN_1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Configuration Initiation | Active-low signal that resets configuration logic and initiates reconfiguration from external source |
| DONE | Configuration Status | Open-drain output indicating successful completion of bitstream loading and device initialization |
| INIT_B | Configuration Monitoring | Active-low output signaling internal configuration error or CRC mismatch during startup |
| TCK / TMS / TDI / TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and in-system programming |
| CLKIN_0 / CLKIN_1 | Dedicated Clock Inputs | Primary differential or single-ended clock sources feeding DCM/PLL clock management tiles |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DCMs & PLLs | Provides jitter-reduced clock synthesis, phase shifting, frequency multiplication/division, and dynamic reconfiguration of clock domains |
| SelectIO Technology | Supports mixed-voltage I/O banks enabling concurrent interface to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
| Embedded Block RAM | 1.2 Mb distributed across 72 BRAM primitives (18 Kb each), configurable as true dual-port or single-port memory with byte-write enable |
| Configurable Logic Blocks (CLBs) | Each CLB contains four slices with two 4-input LUTs and eight flip-flops, supporting efficient arithmetic, state machine, and pipelined logic implementation |
Applications
| Radar Signal Processing | Industrial Motion Control |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and interpolation algorithms with deterministic latency under 50 ns. Use Value: 14,579 logic cells and 240 I/Os enable parallel channel processing and high-speed ADC/DAC interface synchronization. | Use Scenario: Closed-loop servo drive control with multi-axis coordination and real-time safety monitoring. IC Role / Device Role / Timing Role: Configurable logic implements PWM generation, encoder feedback decoding, and SIL-2-compliant safe torque off (STO) logic. Use Value: -10 speed grade ensures sub-microsecond interrupt response and deterministic I/O timing for 20 kHz PWM switching. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamformer modules requiring high-throughput data path aggregation and filtering. IC Role / Device Role / Timing Role: Block RAM and DSP slices perform real-time FIR filtering and scan conversion prior to display rendering. Use Value: 1.2 Mb block RAM supports dual-frame buffering for seamless image streaming at 60 fps with no external memory bottleneck. | Use Scenario: High-resolution oscilloscope digitizer with deep memory capture and real-time waveform analysis. IC Role / Device Role / Timing Role: FPGA manages 1 GS/s ADC interface, on-the-fly histogram generation, and USB 2.0 host communication. Use Value: 240 user I/Os allow simultaneous connection to ADC front-end, memory controller, and peripheral interface without multiplexing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-10FF668C | Higher logic density (24,192 CLBs), larger 668-pin FF package, same -10 speed grade and architecture | Required for designs needing >14K logic cells or >280 I/Os; not drop-in compatible due to package and pinout differences | Select when additional resources justify PCB redesign and increased BOM cost |
| XCVU9P-L2FLGA2104E | Virtex UltraScale+ architecture, 560K logic cells, 48.5 Mb block RAM, 24.5 Gb/s GTY transceivers, different toolchain (Vivado 2022.1+) | Targets next-generation high-bandwidth systems requiring PCIe Gen4, 100G Ethernet, or AI-accelerated inference; not backward compatible | Choose for new designs requiring scalability beyond Virtex-4 capabilities and long-term roadmap support |
Compared with XC4VLX15-10SFG363I, XC4VLX25-10FF668C offers more resources in a physically incompatible package, while XCVU9P-L2FLGA2104E delivers orders-of-magnitude higher performance and modern I/O but requires full architectural migration and toolchain update.
Availability
XC4VLX15-10SFG363I is available at Aetrix Electronics and suitable for radar signal processing, industrial motion control, and medical imaging backend applications requiring stable component supply and long-lifecycle support.
Supply support for XC4VLX15-10SFG363I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support, documentation, and obsolescence management through its Adaptive SoC and FPGA business unit.
The Virtex-4 LX family was designed for high-performance logic-intensive applications demanding balanced resources of logic, memory, and I/O - particularly in aerospace, defense, and industrial systems where reliability and long-term availability are critical.
FAQ
What is the maximum operating frequency of the XC4VLX15-10SFG363I?
The XC4VLX15-10SFG363I has a -10 speed grade, guaranteeing timing closure up to 650 MHz for system clocks under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing, and I/O standard selection - verified using Xilinx ISE 14.7 timing analyzer with appropriate constraints applied to the XC4VLX15-10SFG363I netlist.
Does the XC4VLX15-10SFG363I support JTAG boundary-scan testing?
Yes, the XC4VLX15-10SFG363I fully supports IEEE 1149.1 JTAG boundary-scan functionality via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, device programming, and debug access during both development and production phases for the XC4VLX15-10SFG363I.
What configuration modes are supported by the XC4VLX15-10SFG363I?
The XC4VLX15-10SFG363I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. External PROM (e.g., XCFxxP series) is typically used for Master Serial mode, while microcontrollers or processors may drive Slave Parallel mode. All modes are documented in the Virtex-4 Configuration User Guide for the XC4VLX15-10SFG363I.
Is the XC4VLX15-10SFG363I RoHS compliant?
Yes, the XC4VLX15-10SFG363I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The SFG363 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-033 handling guidelines for the XC4VLX15-10SFG363I.
Can the XC4VLX15-10SFG363I interface directly with DDR2 SDRAM?
Yes, the XC4VLX15-10SFG363I supports DDR2 SDRAM interfacing via its SelectIO banks configured for SSTL-18 I/O standard. Proper board-level termination, fly-by topology, and timing closure using DCM/PLL deskew must be implemented per Xilinx UG079 for reliable operation at up to 400 Mbps data rates on the XC4VLX15-10SFG363I.
XC4VLX15-10SFG363I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 13824
- Total RAM Bits:
- 884736
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX15-10SFG363I FAQ
1.How can I place an order for XC4VLX15-10SFG363I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX15-10SFG363I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX15-10SFG363I reliable?
The price and inventory of XC4VLX15-10SFG363I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX15-10SFG363I is usually 5 days.
3.What payment methods are accepted for XC4VLX15-10SFG363I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX15-10SFG363I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX15-10SFG363I?
XC4VLX15-10SFG363I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX15-10SFG363I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX15-10SFG363I?
For technical support, including XC4VLX15-10SFG363I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX15-10SFG363I requirements.
6.How does Aetrix verify that XC4VLX15-10SFG363I is sourced from the original manufacturer or authorized distributors?
All XC4VLX15-10SFG363I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX15-10SFG363I meets industry standards.
7.What is the process for return or replacement of XC4VLX15-10SFG363I?
All XC4VLX15-10SFG363I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX15-10SFG363I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX15-10SFG363I part is unused and in its original packaging.
Return procedure for XC4VLX15-10SFG363I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VLX15-10SFG363I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
