AMD XC4VLX15-11SF363I
- Part No.:
- XC4VLX15-11SF363I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX15-11SF363I.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VLX15-11SF363I from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 14,579 logic cells, 1.2 Mb of block RAM, and a -11 speed grade supporting 650 MHz I/O operation. It features SelectIO™ technology, integrated DCMs for clock management, and is packaged in a 363-pin Fine-Pitch Ball Grid Array (FBGA) for high-density board designs used in wired communications infrastructure.
For engineers reviewing the XC4VLX15-11SF363I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), DCM count (4), maximum system clock frequency (650 MHz), and compliance with IEEE 1149.1 JTAG boundary-scan test standard.
Technical Context
The XC4VLX15-11SF363I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated arithmetic circuitry, and flexible interconnect. It integrates four Digital Clock Managers (DCMs) supporting phase shifting, duty cycle correction, and frequency synthesis - enabling precise clock domain crossing and jitter reduction in multi-clock systems.
Its SelectIO™ interface supports SSTL, HSTL, LVCMOS, and LVTTL standards across banks independently configured for 1.2 V to 3.3 V operation. The device includes 128 user I/O pins and supports source-synchronous interfaces such as DDR/DDR2 SDRAM controllers and Gigabit transceiver links when paired with external PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 1.2 Mb - enables on-chip data buffering, FIFOs, and lookup table storage without external memory |
| Speed Grade | -11 - guarantees timing closure up to 650 MHz I/O toggle rate under worst-case conditions |
| Digital Clock Managers | 4 DCMs - provide jitter filtering, clock multiplication/division, and phase alignment for multi-domain designs |
| User I/O Pins | 128 - supports high-bandwidth parallel interfaces including DDR2 SDRAM and parallel ADC/DAC buses |
| I/O Standards | SSTL-2, SSTL-3, HSTL-I, LVCMOS, LVTTL - allows direct interfacing with memory, processors, and legacy peripherals |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testing, programming, and debug via standard JTAG chain |
Pinout & Package
XC4VLX15-11SF363I is housed in a 363-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, designed for high signal integrity and thermal performance in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, DCMs, and JTAG interface |
| VCCO_0–VCCO_5 | I/O bank power | Independent 1.2–3.3 V supplies per I/O bank enable mixed-voltage interface design |
| PROGRAM_B | Configuration control | Active-low input that initiates FPGA reconfiguration from external PROM or processor |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1 boundary-scan signals for programming, debugging, and test access |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP slices | Provides 18×18-bit multiplier-accumulator units for real-time filtering and FFT acceleration |
| SelectIO™ technology | Enables per-bank I/O voltage and standard selection - critical for mixed-interface systems |
| Four integrated DCMs | Eliminates need for external clock synthesizers in multi-clock domain applications |
| 1.2 V core voltage | Reduces dynamic power consumption versus older 1.5 V or 1.8 V FPGA families |
| Configurable I/O drive strength | Supports 2 mA to 24 mA per pin - optimizes signal integrity and EMI for varying trace lengths |
Applications
| Wireless Baseband Processing | Industrial Protocol Gateway |
|---|---|
Use Scenario: Real-time channel coding, modulation/demodulation, and MIMO processing in 3G/LTE remote radio units. IC Role / Device Role / Timing Role: Configurable baseband processor implementing soft-core DSP pipelines and high-speed serial data framing. Use Value: 14,579 logic cells and 4 DCMs enable concurrent execution of multiple air-interface standards with deterministic latency. | Use Scenario: Bridging Modbus RTU, PROFIBUS DP, and EtherCAT in factory automation edge controllers. IC Role / Device Role / Timing Role: Protocol translation engine with dual-clock domain isolation between fieldbus and Ethernet interfaces. Use Value: 128 user I/O pins and per-bank voltage configuration allow simultaneous connection to legacy 5 V RS-485 transceivers and 3.3 V Ethernet PHYs. |
| Medical Imaging Data Acquisition | Test & Measurement Instrumentation |
Use Scenario: High-fidelity digitization and preprocessing of ultrasound echo signals before transfer to host CPU. IC Role / Device Role / Timing Role: Real-time signal conditioner and DMA controller interfacing 16-bit ADCs and DDR2 memory buffers. Use Value: 1.2 Mb block RAM provides deep sample buffering; SelectIO™ supports 2.5 V LVDS inputs from high-speed ADCs. | Use Scenario: Flexible trigger logic, pattern generation, and waveform capture in modular PXI-based oscilloscopes. IC Role / Device Role / Timing Role: Reconfigurable timing sequencer synchronizing analog front-end sampling, memory write, and PCIe data upload. Use Value: -11 speed grade ensures sub-nanosecond timing resolution in trigger path; JTAG support enables in-system firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-11FF668C | Higher logic density (24,192 CLBs), larger 668-pin FFGBA package, commercial temperature grade | Targeted at more complex designs requiring additional DSP slices and memory controllers | Choose when XC4VLX15-11SF363I resource utilization exceeds 85% or board layout allows larger footprint |
| XCV50-4BG256C | Virtex-E generation, 50K system gates, 256-pin BGA, no integrated DCMs or SelectIO™ | Limited to simpler glue logic and low-speed control tasks; lacks clock management and advanced I/O | Consider only for legacy cost-sensitive upgrades where timing margin and I/O flexibility are not required |
Compared with XC4VLX25-11FF668C and XCV50-4BG256C, the XC4VLX15-11SF363I delivers optimal balance of logic capacity, clock management, and I/O versatility in a compact 363-pin package - making it suitable for space-constrained, multi-standard interface applications where full Virtex-4 LX25 resources are unnecessary.
Availability
XC4VLX15-11SF363I is available at Aetrix Electronics and suitable for wired communications infrastructure, industrial protocol gateways, and medical imaging subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC4VLX15-11SF363I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Virtex-4 LX family - including XC4VLX15-11SF363I - was engineered for high-performance logic-intensive applications demanding advanced clocking, mixed-voltage I/O, and predictable timing closure in communications and instrumentation systems.
FAQ
What is the operating temperature range for XC4VLX15-11SF363I?
The XC4VLX15-11SF363I is specified for industrial temperature operation from –40 °C to +100 °C junction temperature. This rating applies to the "I" suffix variant and ensures reliable functionality in harsh environments such as outdoor telecom cabinets and factory-floor controllers. Thermal design must maintain junction temperature within this range using appropriate PCB copper area, airflow, or heatsinking. The XC4VLX15-11SF363I datasheet defines derating curves for power dissipation versus ambient temperature.
Does XC4VLX15-11SF363I support configuration via SPI flash memory?
No, the XC4VLX15-11SF363I does not support native SPI flash configuration. It requires master serial or slave selectMAP configuration modes using x8 or x16 parallel PROMs (e.g., XCFxxP series) or microprocessor-controlled parallel loading. Configuration bitstreams are loaded through dedicated CCLK, DIN, and INIT_B pins. While external SPI-to-parallel bridge ICs can be used, the XC4VLX15-11SF363I itself lacks on-die SPI interface logic for direct flash boot.
How many Digital Clock Managers (DCMs) are integrated into XC4VLX15-11SF363I?
The XC4VLX15-11SF363I integrates exactly four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty cycle correction, and frequency multiplication/division. These DCMs are distributed across the die to minimize skew and support multiple synchronous clock domains - a capability confirmed in the Virtex-4 Family User Guide and essential for applications like multi-rate serial link bridging where the XC4VLX15-11SF363I is commonly deployed.
Can XC4VLX15-11SF363I interface directly with DDR2 SDRAM?
Yes, the XC4VLX15-11SF363I supports direct DDR2 SDRAM interfacing using its SelectIO™ pins and built-in DCMs for clock forwarding and phase alignment. It meets JEDEC DDR2 specifications for setup/hold timing when implemented with proper PCB layout and termination. Reference designs and IP cores (e.g., Xilinx MIG v1.7) are validated for use with the XC4VLX15-11SF363I, enabling reliable 400–800 Mbps data rates without external PHYs.
Is XC4VLX15-11SF363I pin-compatible with other Virtex-4 LX devices in the same package?
No, the XC4VLX15-11SF363I is not pin-compatible with other Virtex-4 LX devices in the 363-pin FBGA package. Although the XC4VLX25-10SF363I shares the same package footprint, differences in I/O banking structure, power pin allocation, and configuration pin placement prevent direct substitution. Board-level compatibility requires verification against each device's specific pinout table in the Virtex-4 Packaging and Pinout Specification document.
XC4VLX15-11SF363I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 13824
- Total RAM Bits:
- 884736
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX15-11SF363I FAQ
1.How can I place an order for XC4VLX15-11SF363I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX15-11SF363I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX15-11SF363I reliable?
The price and inventory of XC4VLX15-11SF363I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX15-11SF363I is usually 5 days.
3.What payment methods are accepted for XC4VLX15-11SF363I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX15-11SF363I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX15-11SF363I?
XC4VLX15-11SF363I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX15-11SF363I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX15-11SF363I?
For technical support, including XC4VLX15-11SF363I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX15-11SF363I requirements.
6.How does Aetrix verify that XC4VLX15-11SF363I is sourced from the original manufacturer or authorized distributors?
All XC4VLX15-11SF363I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX15-11SF363I meets industry standards.
7.What is the process for return or replacement of XC4VLX15-11SF363I?
All XC4VLX15-11SF363I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX15-11SF363I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX15-11SF363I part is unused and in its original packaging.
Return procedure for XC4VLX15-11SF363I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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