AMD XC4VLX160-10FF1513C

Overview

XC4VLX160-10FF1513C from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX family FPGA featuring 160,000 logic cells, 720 DSP48 slices, and 6.9 Mb of block RAM. It uses a 90 nm copper process, supports DDR2 memory interfaces up to 400 MHz, and operates at -10 speed grade with commercial temperature range (0°C to 85°C). It is deployed in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC4VLX160-10FF1513C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (1040 user I/Os), voltage compatibility (1.2 V core / 1.8–3.3 V I/O), configuration interface (SelectMAP, JTAG, serial), and thermal design for 1513-pin Flip-Chip Fine-Pitch BGA packaging.

Technical Context

The XC4VLX160-10FF1513C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and flexible clock management using Digital Clock Managers (DCMs). It supports multi-standard I/O banks with programmable drive strength, slew rate, and termination.

Configuration is performed via Master SelectMAP mode using external PROM or microprocessor, or through JTAG boundary-scan. The device includes internal startup sequence control, power-on reset, and brown-out detection to ensure reliable initialization under varying supply conditions.

Key Specifications

Pinout & Package

XC4VLX160-10FF1513C is housed in a 1513-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1513) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Pin assignment follows Xilinx's standardized Virtex-4 pinout architecture with dedicated configuration, clock, JTAG, and I/O bank groups.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-capacity reconfigurable logic applications.

Compared with XC4VLX160-10FF1513C, the XCVU3P offers greater scalability and protocol integration but requires migration to Vivado and new layout, while XC5VLX330T delivers more LUTs at lower core voltage yet sacrifices DSP slice count and embedded processor capability critical for radar and imaging workloads.

Availability

XC4VLX160-10FF1513C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC4VLX160-10FF1513C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support, documentation, and obsolescence management through its Adaptive SoC business unit.

The Virtex-4 LX family was designed specifically for high-performance logic-intensive applications demanding balanced resources-logic, memory, and DSP-with predictable timing and robust I/O flexibility.

FAQ

What is the maximum supported DDR2 memory interface speed for XC4VLX160-10FF1513C?

The XC4VLX160-10FF1513C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using ChipSync technology. This capability is verified in Xilinx UG070 and confirmed in timing reports for -10 speed grade devices operating within commercial temperature range. The XC4VLX160-10FF1513C achieves this with calibrated input delay and source-synchronous capture aligned to DQS strobes.

Does XC4VLX160-10FF1513C include an embedded processor core?

Yes, the XC4VLX160-10FF1513C includes an optional hard PowerPC 405 RISC processor core as part of the Virtex-4 LX160 die. This core is factory-configurable and supports boot-from-Flash execution, interrupt handling, and AXI bus connectivity. Its presence distinguishes XC4VLX160-10FF1513C from lower-density LX variants and enables true system-on-chip implementations without soft-core overhead.

What configuration modes are supported by XC4VLX160-10FF1513C?

The XC4VLX160-10FF1513C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Master SelectMAP is most common for standalone operation using external PROM, while JTAG is used for debugging and in-system programming. All modes are electrically and logically defined in Xilinx DS112 and validated for the FF1513 package variant of XC4VLX160-10FF1513C.

Is XC4VLX160-10FF1513C still in active production?

No, XC4VLX160-10FF1513C was discontinued by Xilinx in 2011 and is now classified as obsolete. However, Aetrix Electronics maintains traceable inventory of original-specification units sourced from authorized channels and supports long-term supply through lifecycle management programs aligned with AMD/Xilinx obsolescence notices.

What thermal management guidance applies to XC4VLX160-10FF1513C?

XC4VLX160-10FF1513C requires a thermal solution capable of dissipating up to 12.5 W typical power under worst-case switching activity. Xilinx XPE v11.1 calculates junction-to-board thermal resistance (Ψ_JB) of 3.2°C/W and recommends a 25 mm² copper thermal pad with ≥4 thermal vias beneath the package. The XC4VLX160-10FF1513C thermal lid must be in direct contact with a heatsink or cold plate for commercial-grade operation.