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AMD XC4VLX160-10FF1513I
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- Part No.:
- XC4VLX160-10FF1513I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX160-10FF1513I.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,469
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Product details
Overview
XC4VLX160-10FF1513I from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX family FPGA featuring 160,000 logic cells, 720 DSP48 slices, and 6.9 Mb of block RAM. It uses a 90 nm copper process, supports differential I/O standards including LVDS and SSTL, and targets high-performance digital signal processing in radar and baseband communications systems.
For engineers reviewing the XC4VLX160-10FF1513I datasheet, pinout, applications, or equivalent options, key selection factors include speed grade (-10), flip-chip fine-pitch BGA package (1513 pins), I/O voltage flexibility (1.2 V to 3.3 V), and support for PCI Express x4 Gen1 endpoints.
Technical Context
The XC4VLX160-10FF1513I implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and multi-gigabit transceivers (MGTs) capable of 3.125 Gbps line rates. It integrates SelectIO technology supporting single-ended and differential signaling across 18 I/O standards.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes internal clock management units (DCMs) offering phase shifting, frequency synthesis, and duty cycle correction for up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 160,000 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| DSP48 Slices | 720 - enables parallel execution of 18-bit × 18-bit multiply-accumulate operations per slice |
| Block RAM | 6.9 Mb - supports large FIFOs, coefficient storage, or frame buffers without external memory |
| Max I/O Pins | 768 - provides high interconnect density for multi-chip interface consolidation |
| Speed Grade | -10 - guarantees timing closure at 1 GHz DCM output frequency and 500 MHz system clock |
| I/O Standards | LVDS, SSTL-2, HSTL-I, PCI-X - enables direct interfacing with ADCs, DDR2 memory, and legacy bus peripherals |
| Transceiver Rate | 3.125 Gbps - supports serial protocols including Serial RapidIO and 1000BASE-X PHY layer |
Pinout & Package
The XC4VLX160-10FF1513I is housed in a 1513-pin flip-chip fine-pitch BGA (FF1513) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for CLB and routing fabric operation |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% powers configuration logic, DCMs, and select I/O banks |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V) to match connected peripheral voltage levels |
| PROGRAM_B | Active-low configuration initiator | Pulling low resets configuration state and initiates reconfiguration from PROM or host |
| DONE | Configuration status indicator | Open-drain output asserted high when bitstream loading and startup sequence complete |
| CLKIN | Primary clock input to DCM | Accepts single-ended or differential clocks up to 500 MHz for internal clock synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Hard-wired PCI Express Endpoint | Integrated PCIe v1.0 x4 endpoint logic eliminates need for external bridge IC and reduces latency |
| Multi-Gigabit Transceivers (MGTs) | 16 transceivers operating up to 3.125 Gbps enable serial backplane or optical interface implementation |
| SelectIO Technology | Supports 18 I/O standards with programmable slew rate and drive strength per pin group |
| Digital Clock Managers (DCMs) | Eight DCMs provide jitter reduction, phase alignment, and frequency multiplication/division without external PLLs |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation for adaptive computing or protocol switching |
Applications
| Radar Signal Processing | Wireless Baseband Unit |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming on airborne radar platforms. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; DCMs synchronize ADC sampling and DAC reconstruction clocks. Use Value: 720 DSP48 slices enable concurrent 1024-point FFTs at 200 MS/s, reducing latency below 5 µs per frame. | Use Scenario: LTE-Advanced macrocell baseband processing with MIMO-4×4 channel equalization. IC Role / Device Role / Timing Role: Configurable logic implements turbo decoder, FFT/IFFT engines, and CPRI interface; MGTs handle fronthaul serialization. Use Value: 6.9 Mb block RAM stores channel estimation coefficients and soft-decision metrics for dual-carrier aggregation. |
| Medical Imaging Backend | Industrial Machine Vision Controller |
Use Scenario: High-speed CT image reconstruction pipeline with iterative algebraic reconstruction techniques (ART). IC Role / Device Role / Timing Role: XC4VLX160-10FF1513I hosts real-time backprojection kernels and DICOM packetization logic; LVDS I/O connects to detector ASICs. Use Value: 768 I/O pins route 128-channel analog data streams simultaneously while maintaining sub-nanosecond skew control. | Use Scenario: Sub-millisecond defect classification on semiconductor wafer inspection systems using CNN inference acceleration. IC Role / Device Role / Timing Role: FPGA fabric runs quantized convolution engine; PCI Express x4 interface transfers ROI metadata to host CPU. Use Value: Hard PCIe endpoint achieves 2.5 GB/s sustained throughput for 4K-resolution image tile streaming without DMA bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 3.2M logic cells, 28 nm process, no native PCI Express v1.0 endpoint | Targets AI inference acceleration and 100G Ethernet; requires PCIe soft IP or external controller | Choose for higher logic density and lower static power; accept added design effort for PCIe integration |
| XC6VLX240T-2FF1156C | Virtex-6 family, 240K logic cells, -2 speed grade, 1156-pin BGA, supports DDR3 but not DDR2 | Optimized for video encoding pipelines and broadcast infrastructure with SMPTE 2082 compliance | Prefer for DDR3 memory subsystems and lower-cost thermal management; verify timing closure at -2 grade |
Compared with XC4VLX160-10FF1513I, the XCVU3P-2FFVD1760I offers 20× more logic resources but lacks native PCIe v1.0 support, while the XC6VLX240T-2FF1156C delivers higher I/O count and DDR3 compatibility at reduced speed margin-both require board redesign and toolchain migration.
Availability
XC4VLX160-10FF1513I is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband units, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC4VLX160-10FF1513I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support through its Adaptive SoC business unit. The company specializes in programmable logic devices for high-performance computing and signal processing.
The Virtex-4 LX family was designed for compute-intensive digital signal processing applications requiring deterministic latency, high I/O bandwidth, and hardware-accelerated arithmetic-particularly in defense electronics and telecommunications infrastructure.
FAQ
What is the maximum operating junction temperature for XC4VLX160-10FF1513I?
The XC4VLX160-10FF1513I has a maximum operating junction temperature of 100°C, validated under worst-case voltage and frequency conditions. This rating applies to industrial-grade (-I) speed grade devices and supports conduction-cooled chassis designs in radar and avionics enclosures. Thermal derating curves are provided in Xilinx DS204 v2.11, and heatsink selection must account for 1513-ball FF package thermal resistance (θJA = 5.2°C/W typical).
Does XC4VLX160-10FF1513I support JTAG boundary-scan testing?
Yes, XC4VLX160-10FF1513I fully complies with IEEE 1149.1 (JTAG) standard and supports boundary-scan testing via TDI, TDO, TMS, and TCK pins. The device implements mandatory INTEST and SAMPLE/PRELOAD instructions, and supports BSDL file version 1.4 for automated test pattern generation. JTAG is used for both configuration and post-configuration diagnostics in deployed XC4VLX160-10FF1513I systems.
Can XC4VLX160-10FF1513I be configured using SPI flash memory?
No, XC4VLX160-10FF1513I does not support native SPI flash configuration. It requires Master Serial mode with x8 or x16 parallel PROM (e.g., XCF128X) or processor-controlled Slave SelectMAP configuration. While third-party SPI-to-parallel bridge ICs exist, Xilinx documentation explicitly excludes SPI flash as a direct configuration source for the XC4VLX160-10FF1513I due to timing constraints in the 90 nm architecture.
What clocking resources are available on XC4VLX160-10FF1513I?
XC4VLX160-10FF1513I integrates eight Digital Clock Managers (DCMs), each supporting input frequency ranges from 12 MHz to 500 MHz. Each DCM provides two independent clock outputs with phase shift, duty cycle correction, and frequency synthesis (×2 to ×32 or ÷2 to ÷128). No PLLs are embedded-the DCMs are the sole on-die clock conditioning resource for XC4VLX160-10FF1513I.
Is partial reconfiguration supported on XC4VLX160-10FF1513I?
Yes, XC4VLX160-10FF1513I supports partial reconfiguration through the ICAP (Internal Configuration Access Port) interface and dedicated configuration logic. This capability allows dynamic replacement of logic modules while the rest of the design remains operational-enabling adaptive filtering in radar or protocol switching in CPRI fronthaul. Implementation requires Xilinx ISE 12.4 or later and specific floorplanning constraints.
XC4VLX160-10FF1513I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16896
- Number of Logic Elements/Cells:
- 152064
- Total RAM Bits:
- 5308416
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX160-10FF1513I FAQ
1.How can I place an order for XC4VLX160-10FF1513I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX160-10FF1513I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX160-10FF1513I reliable?
The price and inventory of XC4VLX160-10FF1513I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX160-10FF1513I is usually 5 days.
3.What payment methods are accepted for XC4VLX160-10FF1513I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX160-10FF1513I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX160-10FF1513I?
XC4VLX160-10FF1513I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX160-10FF1513I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX160-10FF1513I?
For technical support, including XC4VLX160-10FF1513I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX160-10FF1513I requirements.
6.How does Aetrix verify that XC4VLX160-10FF1513I is sourced from the original manufacturer or authorized distributors?
All XC4VLX160-10FF1513I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX160-10FF1513I meets industry standards.
7.What is the process for return or replacement of XC4VLX160-10FF1513I?
All XC4VLX160-10FF1513I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX160-10FF1513I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX160-10FF1513I part is unused and in its original packaging.
Return procedure for XC4VLX160-10FF1513I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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