AMD XC4VLX160-10FFG1513I
- Part No.:
- XC4VLX160-10FFG1513I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX160-10FFG1513I.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC4VLX160-10FFG1513I from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX family FPGA featuring 158,848 logic cells, 640 DSP48 slices, and 6.9 Mb of total block RAM. It uses a 90 nm copper process, supports multi-standard I/O up to 840 Mbps LVDS, and targets high-performance digital signal processing and embedded computing applications in aerospace and test equipment.
For engineers reviewing the XC4VLX160-10FFG1513I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), -10 speed grade timing performance, FFG1513 flip-chip BGA package compatibility, and configuration interface options (Master SelectMAP, JTAG, Serial).
Technical Context
The XC4VLX160-10FFG1513I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for arithmetic-intensive tasks, and flexible clock management using Digital Clock Managers (DCMs). It supports partial reconfiguration and includes integrated PCI Express™ Endpoint logic in select Virtex-4 variants - though not enabled in this LX160 variant.
Configuration is performed via Master SelectMAP mode using external parallel flash or serial PROM, with JTAG boundary-scan support for debugging and programming. The device requires separate VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V) supplies, each with defined decoupling and sequencing requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 158,848 - determines maximum combinational and sequential logic capacity for complex state machines or datapaths |
| DSP48 Slices | 640 - provides dedicated 18×18-bit multiplier-accumulator units for high-throughput filtering or FFT computation |
| Block RAM | 6.9 Mb - enables large on-chip data buffering, FIFOs, or coefficient storage without external memory |
| I/O Pins | 720 user I/Os - supports wide parallel interfaces, high-pin-count sensor arrays, or multi-lane communication buses |
| Speed Grade | -10 - guarantees worst-case propagation delay and setup/hold timing margins at maximum operating frequency |
| Package | FFG1513 - 1513-ball flip-chip BGA with 1.0 mm pitch, requiring controlled-depth solder paste and reflow profile |
| VCCINT | 1.2 V ±3% - core voltage supply critical for static power control and timing closure |
Pinout & Package
XC4VLX160-10FFG1513I is housed in a 1513-ball flip-chip BGA (FFG1513) package with 1.0 mm ball pitch, thermal lid, and standard JEDEC MO-251AC mechanical outline. Pin assignment follows Xilinx Virtex-4 pinout conventions, with dedicated configuration, clock, JTAG, and I/O banks grouped by voltage and electrical standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration shift register during Master SelectMAP or JTAG programming |
| DIN | Configuration data input | Serial data path for PROM-based configuration; used with CCLK in slave serial mode |
| PROGRAM_B | Active-low configuration reset | Asynchronously clears configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant testing, debugging, and in-system programming |
| IO_LxxN/IO_LxxP | Differential I/O pair | Supports LVDS, RSDS, or differential SSTL signaling with internal termination and adjustable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48 slices | 640 independent 18×18-bit multipliers with pipeline registers enable real-time FIR filter execution |
| SelectIO technology | Per-bank I/O voltage support (1.2 V to 3.3 V) allows mixed-voltage interfacing with legacy and modern peripherals |
| Digital Clock Manager (DCM) | Eight DCMs provide jitter-reduced clock synthesis, phase shifting, and 2x/4x multiplication for synchronous system timing |
| Block RAM hierarchy | 18 Kb dual-port RAM blocks organized as 36 Kb primitives support simultaneous read/write access for video frame buffers |
| Partial reconfiguration support | Enables dynamic logic swapping in operational systems-e.g., updating encryption engines without full FPGA reboot |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based radar systems with >10 GSPS ADC front-ends. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and track-before-detect algorithms with deterministic latency. Use Value: 640 DSP48 slices deliver sustained 128 GMAC/s throughput for adaptive filtering under fixed 200 MHz system clock. | Use Scenario: Automated test equipment generating and analyzing multi-gigabit serial waveforms (e.g., PCIe Gen2, SATA II). IC Role / Device Role / Timing Role: Acts as protocol-aware pattern generator and error detector with precise timing alignment across 720 I/Os. Use Value: 720 user I/Os and LVDS support up to 840 Mbps per lane enable full-width parallel stimulus capture without external multiplexing. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements time-triggered Ethernet switches and deterministic bus controllers with hardware timestamping. Use Value: Eight DCMs provide sub-nanosecond clock skew control across multiple AFDX ports for end-to-end latency compliance. | Use Scenario: Real-time reconstruction pipeline for CT and MRI scanners requiring low-latency image matrix transformation. IC Role / Device Role / Timing Role: Performs 2D/3D FFT, back-projection, and DICOM compression acceleration in dedicated logic fabric. Use Value: 6.9 Mb block RAM stores full 512×512×16-bit projection datasets for zero-wait-state processing loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-capacity FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX160-11FFG1513I | Faster -11 speed grade with tighter timing margins; identical logic resources and package | Suitable where worst-case clock frequency must exceed 500 MHz in critical paths | Select when timing closure fails at -10 grade despite optimization; higher power consumption expected |
| XC5VLX110-2FFG1136I | Virtex-5 LX110 with 110K logic cells, 256 DSP48E slices, and 4.6 Mb RAM in smaller 1136-ball BGA | Better power efficiency and enhanced clock routing but lower DSP density and memory capacity | Choose for new designs prioritizing thermal footprint and dynamic power over raw compute density |
Compared with XC4VLX160-10FFG1513I, the -11 variant offers marginally improved timing at cost of higher static power, while the XC5VLX110 trades logic and DSP scale for architectural efficiency and smaller board area - neither is pin-compatible, requiring PCB redesign.
Availability
XC4VLX160-10FFG1513I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC4VLX160-10FFG1513I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-4 family was designed for high-performance logic, DSP, and connectivity applications in defense, aerospace, and instrumentation - emphasizing deterministic timing, radiation tolerance, and long-term obsolescence management.
FAQ
What is the maximum supported I/O standard voltage for XC4VLX160-10FFG1513I?
XC4VLX160-10FFG1513I supports I/O bank voltages from 1.2 V to 3.3 V, including LVCMOS, LVTTL, SSTL, HSTL, and differential standards like LVDS and RSDS. Each of its 24 I/O banks is independently configurable for voltage and standard, enabling mixed-interface designs without level-shifting components. This flexibility is confirmed in Xilinx DS112 v2.5 and applicable to XC4VLX160-10FFG1513I specifically.
Does XC4VLX160-10FFG1513I include built-in PCI Express endpoint logic?
No, XC4VLX160-10FFG1513I does not integrate hard PCI Express endpoint logic. That capability is exclusive to the Virtex-4 FX family (e.g., XC4FX100), which includes PowerPC processors and dedicated PCIe blocks. The XC4VLX160-10FFG1513I belongs to the LX series focused on logic and DSP density, requiring soft IP or external PHYs for PCIe implementation.
What configuration modes are supported by XC4VLX160-10FFG1513I?
XC4VLX160-10FFG1513I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP uses an external parallel PROM and internal oscillator; JTAG enables boundary-scan and programming via standard debug probes. All modes are documented in the Virtex-4 Configuration User Guide (UG071), applicable to XC4VLX160-10FFG1513I.
Is XC4VLX160-10FFG1513I qualified for extended temperature operation?
Yes, the "I" suffix in XC4VLX160-10FFG1513I denotes Industrial temperature grade (-40°C to +100°C junction), validated per Xilinx qualification standards. This rating applies to the full device - core, I/O, and configuration circuitry - and is specified in the Virtex-4 DC and Switching Characteristics datasheet (DS111) for XC4VLX160-10FFG1513I.
How many Digital Clock Managers (DCMs) are available in XC4VLX160-10FFG1513I?
XC4VLX160-10FFG1513I contains eight Digital Clock Managers (DCMs), each supporting frequency synthesis, phase shifting, duty cycle correction, and clock doubling. These DCMs are distributed across the die to minimize global clock skew and are fully accessible in all design tools targeting XC4VLX160-10FFG1513I, as verified in the Virtex-4 Architecture documentation.
XC4VLX160-10FFG1513I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16896
- Number of Logic Elements/Cells:
- 152064
- Total RAM Bits:
- 5308416
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX160-10FFG1513I FAQ
1.How can I place an order for XC4VLX160-10FFG1513I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX160-10FFG1513I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX160-10FFG1513I reliable?
The price and inventory of XC4VLX160-10FFG1513I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX160-10FFG1513I is usually 5 days.
3.What payment methods are accepted for XC4VLX160-10FFG1513I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX160-10FFG1513I transactions.
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XC4VLX160-10FFG1513I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX160-10FFG1513I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX160-10FFG1513I?
For technical support, including XC4VLX160-10FFG1513I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX160-10FFG1513I requirements.
6.How does Aetrix verify that XC4VLX160-10FFG1513I is sourced from the original manufacturer or authorized distributors?
All XC4VLX160-10FFG1513I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX160-10FFG1513I meets industry standards.
7.What is the process for return or replacement of XC4VLX160-10FFG1513I?
All XC4VLX160-10FFG1513I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX160-10FFG1513I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX160-10FFG1513I part is unused and in its original packaging.
Return procedure for XC4VLX160-10FFG1513I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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