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AMD XC4VLX160-11FF1148I
- Part No.:
- XC4VLX160-11FF1148I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1148-BBGA, FCBGA
- Datasheet:
-
XC4VLX160-11FF1148I.pdf
- Description:
- IC FPGA 768 I/O 1148FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,652
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Product details
Overview
XC4VLX160-11FF1148I from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX FPGA featuring 160,000 logic cells, 1148-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1148) package, -11 speed grade, and industrial temperature range (-40°C to +100°C). It integrates embedded PowerPC 405 processors, RocketIO multi-gigabit transceivers, and DSP48 slices for high-performance digital signal processing in reconfigurable systems.
For engineers reviewing the XC4VLX160-11FF1148I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, transceiver count (up to 24 RocketIO GTPs), embedded processor availability, I/O voltage support (1.2V/1.5V/1.8V/2.5V/3.3V), and industrial-grade thermal performance.
Technical Context
The XC4VLX160-11FF1148I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (6,480 kbits), distributed RAM, and dedicated arithmetic resources. It supports SelectIO technology with programmable slew rate, drive strength, and on-chip termination for signal integrity across multiple I/O standards.
Its embedded PowerPC 405 RISC cores operate at up to 500 MHz, and RocketIO transceivers deliver 2.5–3.75 Gbps serial links with built-in encoding/decoding and clock data recovery. The device targets high-bandwidth, low-latency system-on-chip implementations requiring hardware/software co-design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 160,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| Block RAM | 6,480 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external SRAM |
| RocketIO GTP Transceivers | 24 × 2.5–3.75 Gbps - enables high-speed serial interfaces including PCIe Gen1, Serial RapidIO, and Aurora protocols |
| Embedded PowerPC 405 Cores | 2 × 32-bit RISC processors - supports soft-core/hard-core hybrid SoC designs with real-time firmware execution |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct interfacing with DDR2 SDRAM, ADCs, DACs, and FPGAs from other vendors |
| Speed Grade | -11 - guarantees timing closure at highest operating frequency for critical paths in industrial temperature range |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC4VLX160-11FF1148I is housed in a 1148-pin Flip-Chip Fine-Pitch BGA (FFG1148) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply voltage | 1.2 V ±3% - powers CLBs, block RAM, and interconnect; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 2.5 V ±5% - supplies configuration logic, JTAG, and auxiliary I/O circuitry |
| VCCO | I/O bank supply | Configurable per bank (1.2–3.3 V) - sets output voltage level and compatible I/O standard |
| HRCLK | High-speed clock input | Dedicated differential clock input for RocketIO transceivers; supports 100–375 MHz reference clocks |
| PROG_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| ASMBL™ Column-Based Architecture | Enables modular placement of IP blocks (e.g., PowerPC, RocketIO, DSP48) with predictable timing and reduced routing congestion |
| Triple-Mode Redundancy (TMR) | Supports radiation-tolerant design via triplicated logic and voting for aerospace and defense applications |
| ChipSync™ Source-Synchronous I/O | Provides deterministic timing for high-speed parallel interfaces such as DDR2 memory controllers with up to 400 MHz data rates |
| Partial Reconfiguration Support | Allows dynamic loading of functional modules without resetting the entire device - essential for adaptive computing and protocol gateways |
| ISE Design Suite Integration | Full toolchain support including synthesis, place-and-route, simulation, and bitstream generation using Xilinx ISE 14.7 or earlier |
Applications
| Wireless Baseband Processing | Defense Radar Signal Processing |
|---|---|
Use Scenario: Real-time FFT, channel estimation, and MIMO decoding in LTE/5G macro base stations. IC Role / Device Role / Timing Role: Configurable baseband processor implementing custom PHY-layer algorithms with deterministic latency. Use Value: 160K logic cells and 24 RocketIO transceivers enable full-stack layer-1 processing and CPRI/eCPRI fronthaul interface consolidation. | Use Scenario: Pulse-Doppler processing and beamforming in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-throughput signal conditioning and adaptive filtering engine synchronized to 100+ MHz sample clocks. Use Value: Industrial temperature rating and TMR capability ensure reliability under vibration, shock, and radiation exposure in airborne platforms. |
| Medical Imaging Data Acquisition | Industrial Machine Vision Controller |
Use Scenario: Parallel digitization and preprocessing of ultrasound echo streams from 128+ transducer elements. IC Role / Device Role / Timing Role: Time-critical front-end data aggregator with real-time beamforming and noise suppression. Use Value: ChipSync I/O and 6,480 kbits block RAM allow synchronous capture from multiple ADCs and on-the-fly image reconstruction. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera inputs and real-time defect classification. IC Role / Device Role / Timing Role: Deterministic vision pipeline orchestrator handling GigE Vision and Camera Link interfaces. Use Value: 1148-pin FFG package supports >400 user I/Os for pixel-level synchronization and FPGA-accelerated CNN inference kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX160-10FF1148I | Slower -10 speed grade; lower maximum clock frequency and longer propagation delays | Suitable for cost-sensitive industrial control where timing margin is relaxed | Select when design meets timing at -10 grade and thermal budget permits lower-speed operation |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ device with 965K logic cells, 64 GTY transceivers, and 4× higher DSP throughput | Targets next-gen 5G NR, AI inference acceleration, and 400G Ethernet where legacy Virtex-4 lacks bandwidth | Choose for new designs requiring PCIe Gen4, DDR4, or hardened AI engines - not drop-in compatible |
Compared with XC4VLX160-11FF1148I, the -10 variant trades performance for cost and power, while the XCVU9P offers generational advancement in bandwidth and compute density but requires full redesign due to architectural and packaging differences.
Availability
XC4VLX160-11FF1148I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX160-11FF1148I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support legacy Virtex families through its Adaptive SoC and FPGA business unit.
The Virtex-4 LX family was designed for high-performance, logic-intensive system-on-chip applications demanding embedded processing, high-speed serial connectivity, and large on-chip memory resources.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC4VLX160-11FF1148I?
The XC4VLX160-11FF1148I integrates two hard-core PowerPC 405 RISC processors rated for operation up to 500 MHz under industrial temperature conditions. This frequency is guaranteed by the -11 speed grade and validated across the full -40°C to +100°C range. The actual achievable clock depends on system-level timing constraints, bus arbitration, and memory interface latency. XC4VLX160-11FF1148I supports both symmetric and asymmetric multiprocessing configurations.
Does XC4VLX160-11FF1148I support partial reconfiguration?
Yes, XC4VLX160-11FF1148I supports partial reconfiguration through Xilinx ISE tools and the ICAP (Internal Configuration Access Port). This enables dynamic module swapping without resetting the entire device, critical for protocol adaptation and runtime optimization. XC4VLX160-11FF1148I requires careful floorplanning and use of RLOC attributes to isolate reconfigurable regions. Bitstream compatibility across partial reconfigurations must be verified per design.
What I/O standards are supported by XC4VLX160-11FF1148I?
XC4VLX160-11FF1148I supports LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, and differential standards including LVDS, RSDS, and BLVDS. Each I/O bank is independently configurable for voltage (1.2V–3.3V) and standard. XC4VLX160-11FF1148I does not support newer standards like MIPI or LPDDR4. Bank-specific termination and slew rate control are programmable per pin group.
Is XC4VLX160-11FF1148I RoHS compliant?
Yes, XC4VLX160-11FF1148I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FFG1148 package uses matte tin finish on solder balls. XC4VLX160-11FF1148I conforms to EU Directive 2011/65/EU and is marked with the RoHS symbol in official Xilinx documentation.
What configuration modes does XC4VLX160-11FF1148I support?
XC4VLX160-11FF1148I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Master SelectMAP enables direct boot from external PROM or flash memory; Slave SelectMAP allows host processor-controlled configuration. XC4VLX160-11FF1148I also supports fallback configuration and dual-PROM mode for redundancy. Configuration data integrity is verified via CRC check during startup.
XC4VLX160-11FF1148I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1148-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16896
- Number of Logic Elements/Cells:
- 152064
- Total RAM Bits:
- 5308416
- Number of I/O:
- 768
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1148-FCPBGA (35x35)
XC4VLX160-11FF1148I FAQ
1.How can I place an order for XC4VLX160-11FF1148I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX160-11FF1148I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX160-11FF1148I reliable?
The price and inventory of XC4VLX160-11FF1148I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX160-11FF1148I is usually 5 days.
3.What payment methods are accepted for XC4VLX160-11FF1148I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX160-11FF1148I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX160-11FF1148I?
XC4VLX160-11FF1148I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX160-11FF1148I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX160-11FF1148I?
For technical support, including XC4VLX160-11FF1148I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX160-11FF1148I requirements.
6.How does Aetrix verify that XC4VLX160-11FF1148I is sourced from the original manufacturer or authorized distributors?
All XC4VLX160-11FF1148I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX160-11FF1148I meets industry standards.
7.What is the process for return or replacement of XC4VLX160-11FF1148I?
All XC4VLX160-11FF1148I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX160-11FF1148I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX160-11FF1148I part is unused and in its original packaging.
Return procedure for XC4VLX160-11FF1148I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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