My Inquiry
My Account
AMD XC4VLX160-11FF1513I
.jpg)
- Part No.:
- XC4VLX160-11FF1513I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX160-11FF1513I.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,158
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC4VLX160-11FF1513I from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX family FPGA featuring 160,000 logic cells, 1513-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1513) package, -11 speed grade, and industrial temperature range (-40°C to +100°C). It integrates embedded PowerPC 405 cores, high-speed serial I/O (RocketIO transceivers), and DSP48 slices for reconfigurable signal processing in telecom infrastructure and military avionics.
For engineers reviewing the XC4VLX160-11FF1513I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, validated timing parameters, package-specific thermal and routing constraints, and functionally aligned alternatives for high-reliability FPGA selection.
Technical Context
The XC4VLX160-11FF1513I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (2,048 kbits), and dedicated arithmetic units (DSP48 slices). It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 840 Mbps per I/O pair.
Its RocketIO multi-gigabit transceivers operate at 622 Mbps–3.125 Gbps with built-in encoding/decoding and clock data recovery. The device includes dual PowerPC 405 RISC processors with on-chip memory and AXI-compatible bus interfaces for embedded soft-core applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 160,000 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| Block RAM | 2,048 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external SRAM |
| Speed Grade | -11 - guarantees worst-case propagation delay of 1.1 ns for CLB-to-CLB paths at industrial temperature |
| I/O Standards | LVDS, SSTL-2, HSTL-I, GTL+ - enables direct interface to DDR2 memory, SERDES PHYs, and ASICs |
| RocketIO Transceivers | 16 channels × 3.125 Gbps - supports OC-48, 10GbE PHY layer, and CPRI fronthaul links |
| Embedded Processors | Dual PowerPC 405 - enables hard real-time control co-processing alongside programmable logic |
Pinout & Package
XC4VLX160-11FF1513I is housed in a 1513-ball Flip-Chip Fine-Pitch BGA (FFG1513) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, JTAG, and select I/O banks |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| CLKIN | Primary global clock input | Dedicated low-skew path to DCMs for system clock distribution and jitter filtering |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or CRC error detection |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores | Enables tightly coupled software-defined control with hardware acceleration in same die |
| 16 RocketIO transceivers | Eliminates need for external SerDes chips in 10G backplane and optical line card designs |
| DSP48 slices | Provides 18×18-bit multiply-accumulate capability per slice for real-time FIR filtering and FFT engines |
| SelectIO technology | Supports source-synchronous DDR interfaces up to 400 MHz with programmable drive strength and slew rate |
| DCM clock management | Delivers jitter reduction, phase shifting, and frequency synthesis without external PLL components |
Applications
| Telecom Line Cards | Military Radar Processing |
|---|---|
Use Scenario: High-speed packet classification and forwarding in 10G Ethernet line cards. IC Role / Device Role / Timing Role: Configurable packet processor with integrated RocketIO transceivers and PowerPC control plane. Use Value: Reduces component count by integrating SerDes, MAC logic, and control CPU into single XC4VLX160-11FF1513I die. | Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne AESA radar systems. IC Role / Device Role / Timing Role: Reconfigurable signal processor executing adaptive filter banks and FFTs using DSP48 slices. Use Value: Achieves deterministic latency under 200 ns for critical radar timing loops using hard-wired interconnect and DCM-synchronized clocks. |
| Medical Imaging Backend | Industrial Test Equipment |
Use Scenario: Raw sensor data aggregation and preprocessing in MRI and CT scanner backend subsystems. IC Role / Device Role / Timing Role: High-bandwidth data concentrator interfacing multiple ADCs via LVDS and buffering into DDR2 memory. Use Value: Sustains 1.6 GB/s aggregate I/O bandwidth using 480 LVDS pairs and on-chip block RAM for pipeline staging. | Use Scenario: Protocol-aware stimulus generation and response analysis in automated boundary-scan test systems. IC Role / Device Role / Timing Role: Programmable pattern generator with precise cycle-accurate timing control and JTAG TAP controller. Use Value: Enables sub-nanosecond edge placement accuracy across 500+ pins using dedicated clock routing and IODELAY primitives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FL1924I | UltraScale architecture, 2.5x higher logic density, 16.3 Gbps transceivers, no embedded PowerPC | Targets AI inference acceleration and 5G massive MIMO where software-defined radio replaces fixed-function processors | Choose when migrating legacy Virtex-4 designs to higher throughput and lower power per operation, accepting architectural rewrite effort |
| XC7VX690T-2FFG1927I | 7-series architecture, 690K logic cells, 13.1 Gbps transceivers, no PowerPC but includes MicroBlaze soft core | Suitable for PCIe Gen3 endpoint designs and video processing pipelines requiring large BRAM and DSP resources | Prefer for new designs needing long-term availability and toolchain support, with flexibility to implement control logic in MicroBlaze instead of PowerPC |
Compared with XC4VLX160-11FF1513I, the XCVU9P-2FL1924I offers higher transceiver speed and logic capacity but eliminates hard PowerPC cores, while the XC7VX690T-2FFG1927I retains strong DSP and memory resources with broader ecosystem support-both require board redesign due to non-pin-compatible packages and voltage rail changes.
Availability
XC4VLX16160-11FF1513I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, medical imaging systems, and industrial test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX160-11FF1513I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.
The Virtex-4 family, including XC4VLX160-11FF1513I, was engineered for high-performance reconfigurable systems demanding integrated processing, high-speed I/O, and deterministic real-time behavior in aerospace and wired infrastructure.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC4VLX160-11FF1513I?
The XC4VLX160-11FF1513I supports PowerPC 405 cores running at up to 500 MHz under industrial temperature conditions, as confirmed by Xilinx DS112 specification table. This frequency is achievable when VCCINT is maintained at 1.2 V ±3% and ambient temperature remains within –40°C to +100°C. The XC4VLX160-11FF1513I uses dedicated clock routing and phase-aligned DCM outputs to meet core timing requirements without external clock conditioning.
Does XC4VLX160-11FF1513I support JESD204B serial interface natively?
No, XC4VLX160-11FF1513I does not support JESD204B natively. Its RocketIO transceivers operate from 622 Mbps to 3.125 Gbps and implement 8B/10B encoding, but lack the JESD204B link layer protocol engine, SYNC~ handshaking, or subclass timing alignment features. Implementing JESD204B on XC4VLX160-11FF1513I requires custom logic in the FPGA fabric, and the XC4VLX160-11FF1513I datasheet does not provide reference designs or IP for this standard.
What configuration modes are supported by XC4VLX160-11FF1513I?
The XC4VLX160-11FF1513I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It boots from external PROM via parallel or serial interface, with automatic fallback to JTAG for debugging. Configuration bitstream integrity is verified using on-chip CRC during startup, and the XC4VLX160-11FF1513I asserts INIT_B low if errors are detected, ensuring fail-safe initialization in mission-critical systems.
Is XC4VLX160-11FF1513I RoHS compliant and lead-free?
Yes, XC4VLX160-11FF1513I is RoHS-compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FFG1513 package uses matte tin finish on solder balls, and Xilinx documentation (Xilinx Packaging Specification DS127) confirms exemption from lead-based solder requirements. The XC4VLX160-11FF1513I is rated for lead-free reflow profiles up to 260°C peak temperature, with full qualification per JEDEC J-STD-020.
Can XC4VLX160-11FF1513I be used in space-grade applications?
No, XC4VLX160-11FF1513I is not qualified for space-grade use. It is rated for industrial temperature only (–40°C to +100°C) and lacks radiation-hardened design, total ionizing dose (TID) certification, or single-event effect (SEE) mitigation features. While some users have deployed XC4VLX160-11FF1513I in terrestrial high-reliability systems, the XC4VLX160-11FF1513I datasheet explicitly excludes space, nuclear, or safety-critical automotive applications without additional screening or qualification.
XC4VLX160-11FF1513I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16896
- Number of Logic Elements/Cells:
- 152064
- Total RAM Bits:
- 5308416
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX160-11FF1513I FAQ
1.How can I place an order for XC4VLX160-11FF1513I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX160-11FF1513I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX160-11FF1513I reliable?
The price and inventory of XC4VLX160-11FF1513I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX160-11FF1513I is usually 5 days.
3.What payment methods are accepted for XC4VLX160-11FF1513I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX160-11FF1513I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX160-11FF1513I?
XC4VLX160-11FF1513I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX160-11FF1513I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX160-11FF1513I?
For technical support, including XC4VLX160-11FF1513I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX160-11FF1513I requirements.
6.How does Aetrix verify that XC4VLX160-11FF1513I is sourced from the original manufacturer or authorized distributors?
All XC4VLX160-11FF1513I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX160-11FF1513I meets industry standards.
7.What is the process for return or replacement of XC4VLX160-11FF1513I?
All XC4VLX160-11FF1513I units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX160-11FF1513I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX160-11FF1513I part is unused and in its original packaging.
Return procedure for XC4VLX160-11FF1513I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC4VLX160-11FF1513I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
