AMD XC4VLX200-10FFG1513I

Overview

XC4VLX200-10FFG1513I from AMD (formerly Xilinx) is a high-density Virtex-4 LX FPGA with 200,000 logic cells, 1513-pin Flip-Chip BGA package, -10 speed grade, and industrial temperature range (-40°C to +100°C). It integrates embedded PowerPC 405 processors, DSP slices, and high-speed serial I/O for reconfigurable system-on-chip applications in radar signal processing and high-end test equipment.

For engineers reviewing the XC4VLX200-10FFG1513I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (1040 user I/Os), embedded processor availability, differential signaling support (LVDS, RSDS), and industrial-grade thermal performance.

Technical Context

The XC4VLX200-10FFG1513I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (7,168 kbits), and dedicated DSP48 slices for arithmetic-intensive tasks. It supports multi-gigabit transceivers (up to 3.125 Gbps) and includes SelectIO technology for interfacing with DDR2 SDRAM, QDR SRAM, and PCI Express endpoints.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption and dual-boot capability enabled through on-chip PROM support. The device uses 90 nm copper process technology and operates at core voltage of 1.2 V ±3%.

Key Specifications

Pinout & Package

XC4VLX200-10FFG1513I is housed in a 1513-ball Flip-Chip BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-frequency designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC4VLX200-10FFG1513I, the XC4VLX160-11FF1513I trades logic density for speed grade within identical packaging, while the XCVU3P-2FFVD1760I delivers architectural advancement at the cost of layout compatibility-making it suitable only for greenfield deployments.

Availability

XC4VLX200-10FFG1513I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and industrial motion control requiring stable component supply across extended product lifecycles.

Supply support for XC4VLX200-10FFG1513I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Virtex-4 product support for industrial and aerospace customers requiring long-term reliability and documentation continuity.

The Virtex-4 family was designed for high-performance reconfigurable computing in signal-intensive applications where programmable logic, embedded processors, and high-speed I/O must operate cohesively under demanding thermal and timing constraints.

FAQ

What is the maximum operating frequency of the XC4VLX200-10FFG1513I's internal clock networks?

The XC4VLX200-10FFG1513I supports internal clock frequencies up to 500 MHz when driven by its Digital Clock Manager (DCM), with guaranteed timing closure for critical paths at the -10 speed grade. This applies to global clock nets routed through the dedicated clock spine; local routing may limit actual achievable frequency depending on fanout and placement.

Does the XC4VLX200-10FFG1513I support JTAG boundary-scan testing?

Yes, the XC4VLX200-10FFG1513I fully complies with IEEE 1149.1 (JTAG) standard and includes dedicated TDI, TDO, TMS, and TCK pins for boundary-scan testing, configuration, and debug. The JTAG interface also enables in-system programming and partial reconfiguration verification without requiring external configuration PROMs.

Can the XC4VLX200-10FFG1513I interface directly with DDR2 SDRAM?

Yes, the XC4VLX200-10FFG1513I supports DDR2 SDRAM interfaces up to 400 MHz data rate using its SelectIO technology and dedicated memory controller primitives. It provides programmable I/O delays, differential DQS strobes, and on-die termination control required for robust DDR2 timing compliance in industrial memory subsystems.

What configuration modes does the XC4VLX200-10FFG1513I support?

The XC4VLX200-10FFG1513I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and configuration bitstreams can be loaded from external PROM, flash memory, or host processor via parallel or serial bus.

Is the XC4VLX200-10FFG1513I RoHS compliant and lead-free?

Yes, the XC4VLX200-10FFG1513I is RoHS-compliant and manufactured with lead-free (Pb-free) flip-chip BGA packaging per J-STD-020 moisture sensitivity level 3. The device meets EU Directive 2011/65/EU and carries appropriate marking for industrial use in environmentally regulated markets.