AMD XC4VLX200-11FF1513C

Overview

XC4VLX200-11FF1513C from AMD (formerly Xilinx) is a high-capacity Virtex-4 LX FPGA featuring 200,000 logic cells, 1,200 DSP slices, and 8.4 Mb of block RAM. It uses a 90 nm copper process, supports DDR2 memory interfaces up to 400 MHz, and operates at -11 speed grade with commercial temperature range (0°C to 85°C). It is deployed in high-performance digital signal processing systems requiring deterministic latency and parallel hardware acceleration.

For engineers reviewing the XC4VLX200-11FF1513C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (1,104 user I/Os), differential signaling support (LVDS, RSDS), embedded PowerPC 405 cores, clock management tile (CMT) capabilities, and compliance with IEEE 1149.1 JTAG boundary-scan.

Technical Context

The XC4VLX200-11FF1513C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and integrated PowerPC 405 hard processor cores. It includes 24 multi-gigabit transceivers supporting serial protocols up to 3.125 Gbps and dual-clock domain management via Digital Clock Managers (DCMs).

Its SelectIO technology supports 21 I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and RSDS. The device integrates 24 CMTs-each containing two DCMs-for precise clock synthesis, phase shifting, and jitter reduction across multiple clock domains.

Key Specifications

Pinout & Package

XC4VLX200-11FF1513C is housed in a 1513-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal performance is enhanced by an integrated thermal lid and copper heat spreader.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC4VLX200-11FF1513C, the XC5VLX330-2FF1738C extends logic capacity and retains PowerPC compatibility, while the XCVU3P-2FFVD1760E replaces PowerPC with ARM Cortex-A53 clusters and adds hardened 100G Ethernet MACs-making it suitable for next-generation infrastructure where legacy firmware migration is feasible.

Availability

XC4VLX200-11FF1513C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and high-speed test equipment requiring stable component supply across long-lifecycle programs.

Supply support for XC4VLX200-11FF1513C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, AI, and embedded markets.

The Virtex-4 family was originally designed by Xilinx for high-performance, system-level integration in compute-intensive embedded applications demanding both programmable logic and embedded processing.

FAQ

What is the maximum supported DDR2 memory interface speed for XC4VLX200-11FF1513C?

The XC4VLX200-11FF1513C supports DDR2 SDRAM interfaces up to 400 MHz data rate (200 MHz clock frequency) using its dedicated memory controller logic and I/O timing calibration. This capability is verified in Xilinx UG070 and applies specifically to the -11 speed grade under commercial temperature conditions with proper PCB layout and termination.

Does XC4VLX200-11FF1513C include embedded processor cores?

Yes, XC4VLX200-11FF1513C integrates two hard-core PowerPC 405 RISC processors running at up to 500 MHz. These are not soft cores-they are silicon-embedded, fully pipelined, and share L2 cache. Their presence enables real-time control, boot management, and host communication without external microcontrollers.

What JTAG standard does XC4VLX200-11FF1513C comply with?

XC4VLX200-11FF1513C complies with IEEE Std 1149.1-2001 (JTAG Boundary-Scan) for configuration, debugging, and in-system verification. Its TDI, TDO, TMS, and TCK pins implement full boundary-scan functionality, including EXTEST, SAMPLE/PRELOAD, and IDCODE instructions as defined in the Virtex-4 Configuration User Guide (UG071).

Can XC4VLX200-11FF1513C be used in automotive applications?

No, XC4VLX200-11FF1513C is specified only for commercial temperature range (0°C to 85°C) and lacks AEC-Q100 qualification, automotive-grade screening, or extended temperature support. It is not recommended for under-hood or safety-critical automotive ECUs, though it may be used in non-safety lab/test environments with external thermal management.

What configuration modes are supported by XC4VLX200-11FF1513C?

XC4VLX200-11FF1513C supports Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. The default mode is Master Serial using external PROM or flash memory. Mode selection is controlled by M[2:0] pins at power-up, and all modes are documented in Xilinx UG071 with timing and voltage requirements.