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AMD XC4VLX200-11FFG1513C
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- Part No.:
- XC4VLX200-11FFG1513C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1513-BBGA, FCBGA
- Datasheet:
-
XC4VLX200-11FFG1513C.pdf
- Description:
- IC FPGA 960 I/O 1513FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,849
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Product details
Overview
XC4VLX200-11FFG1513C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 200,000 logic cells, 1,200 I/O pins, and a -11 speed grade. It features 9,216 Kbits of block RAM, 640 DSP48 slices, and operates at 1.2 V core voltage. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC4VLX200-11FFG1513C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, logic density, embedded memory depth, DSP slice count, and thermal performance in compact PCB layouts.
Technical Context
The XC4VLX200-11FFG1513C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48 slices for multiply-accumulate operations, and distributed/Block RAM resources. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, RSDS, BLVDS).
It integrates clock management tiles with DCMs (Digital Clock Managers) offering phase shifting, frequency synthesis, and duty cycle correction. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 200,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| I/O Pins | 1,200 - supports high-bandwidth interface aggregation (e.g., multiple DDR2 controllers, PCI Express lanes) |
| Block RAM | 9,216 Kbits - enables large on-chip data buffering and FIFOs without external memory |
| DSP48 Slices | 640 - delivers 1.6 GMAC/s peak arithmetic throughput for real-time filtering and FFT acceleration |
| Speed Grade | -11 - guarantees timing closure at 500 MHz system clock in worst-case industrial temperature conditions |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Package | FFG1513 - 1513-pin Fine-Pitch Flip-Chip BGA, 35 mm × 35 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC4VLX200-11FFG1513C is housed in a 1513-pin Fine-Pitch Flip-Chip BGA (FFG1513) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal and electrical performance is optimized for high-density routing and controlled impedance PCB stackups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for CLBs, DSP slices, and internal routing; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration logic, DCMs, and SelectIO banks; shared across multiple I/O banks |
| VCCO | I/O Output Power | Bank-specific voltage (1.2–3.3 V) setting output drive strength and interface standard compliance |
| PROGRAM_B | Configuration Initiation | Active-low asynchronous reset that clears configuration memory and initiates reload from external source |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness for user logic execution |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test and programming interface supporting in-system configuration and debug |
Key Features
| Feature | Design Value |
|---|---|
| Advanced SelectIO Technology | Supports 21 I/O standards with programmable slew rate, drive strength, and on-die termination for signal integrity optimization |
| Dedicated DSP48 Slices | Hardwired 18×18 multipliers with pre-adders and pipeline registers enabling deterministic 1-cycle MAC latency |
| Digital Clock Managers (DCMs) | Provides jitter reduction, phase alignment, and frequency multiplication/division without external PLL components |
| Block RAM with ECC | Optional single-bit error correction per 36-bit word enhances reliability in mission-critical control applications |
| Multi-Standard Configuration Interface | Enables flexible deployment via Master/Slave SelectMAP, Serial PROM, or microprocessor-controlled parallel loading |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable compute fabric executing time-critical FIR filters, FFTs, and CFAR detection algorithms. Use Value: 640 DSP48 slices deliver sustained 1.6 GMAC/s throughput, enabling sub-microsecond latency response to fast-moving targets. | Use Scenario: High-speed image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Hardware-accelerated coprocessor offloading GPU/CPU for back-projection and denoising kernels. Use Value: 9,216 Kbits of block RAM buffers full-slice projection data, eliminating DDR2 round-trip latency during reconstruction loops. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O consolidation in flight control units. IC Role / Device Role / Timing Role: Protocol-aware interface bridge with deterministic timing control and built-in CRC generation/checking. Use Value: 1,200 I/O pins support concurrent multi-protocol transceivers, reducing board-level gate count and interconnect complexity. | Use Scenario: Pattern generation and response analysis in ATE platforms for SoC validation. IC Role / Device Role / Timing Role: Programmable stimulus engine synchronized to 500 MHz system clock with sub-cycle timing resolution. Use Value: -11 speed grade ensures setup/hold timing margins under worst-case voltage and temperature, critical for 2 Gbps pattern rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 384K logic cells, 20nm process, integrated 100G Ethernet MAC | Targets newer designs requiring higher bandwidth, lower power, and hardened IP; not backward compatible | Select when migrating to 20nm node with need for hardened transceivers and PCIe Gen4 support |
| XC5VLX330-2FF1738C | Virtex-5 LX family, 330K logic cells, -2 speed grade, 1738-pin FFG package | Higher logic density but slower timing performance; larger footprint and different pinout | Consider only for legacy upgrades where additional logic resources are needed and timing budget allows relaxation |
Compared with XC4VLX200-11FFG1513C, the XCVU3P-2FFVD1760E offers superior density and integration but requires new PCB design and toolchain migration, while the XC5VLX330-2FF1738C provides more logic cells at the cost of reduced speed grade and incompatible packaging-neither is pin-compatible.
Availability
XC4VLX200-11FFG1513C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, avionics data concentration, and high-speed automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC4VLX200-11FFG1513C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms spanning FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-4 LX family was designed for high-performance logic-intensive applications demanding scalable I/O, embedded memory, and DSP capability in aerospace, defense, and industrial systems.
FAQ
What is the maximum operating frequency of the XC4VLX200-11FFG1513C?
The XC4VLX200-11FFG1513C has a -11 speed grade, guaranteeing reliable operation up to 500 MHz for system clocks under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design placement, routing, and resource utilization-but the -11 rating ensures timing closure for critical paths meeting this target.
Does the XC4VLX200-11FFG1513C support JTAG boundary scan?
Yes, the XC4VLX200-11FFG1513C fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and structural testing without requiring external test fixtures or probe access.
What configuration modes does the XC4VLX200-11FFG1513C support?
The XC4VLX200-11FFG1513C supports Master SelectMAP, Slave SelectMAP, Serial PROM, and JTAG configuration modes. It can be initialized by an external microprocessor, loaded from parallel flash, or programmed directly through the JTAG interface-providing flexibility for field updates and production programming.
Is block RAM in the XC4VLX200-11FFG1513C capable of error correction?
Yes, the XC4VLX200-11FFG1513C block RAM supports optional single-bit error correction (SEC) per 36-bit word. When enabled, it detects and corrects single-bit errors transparently, improving data integrity in safety-critical applications such as avionics and medical devices.
What I/O standards are supported by the XC4VLX200-11FFG1513C?
The XC4VLX200-11FFG1513C supports 21 SelectIO standards including LVCMOS, LVTTL, SSTL-2, SSTL-3, HSTL-I, HSTL-II, LVDS, RSDS, and BLVDS. Each I/O bank is independently configurable for voltage, drive strength, slew rate, and on-die termination to match interface requirements.
XC4VLX200-11FFG1513C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 1513-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 22272
- Number of Logic Elements/Cells:
- 200448
- Total RAM Bits:
- 6193152
- Number of I/O:
- 960
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1513-FCBGA (40x40)
XC4VLX200-11FFG1513C FAQ
1.How can I place an order for XC4VLX200-11FFG1513C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX200-11FFG1513C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX200-11FFG1513C reliable?
The price and inventory of XC4VLX200-11FFG1513C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX200-11FFG1513C is usually 5 days.
3.What payment methods are accepted for XC4VLX200-11FFG1513C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX200-11FFG1513C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX200-11FFG1513C?
XC4VLX200-11FFG1513C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX200-11FFG1513C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX200-11FFG1513C?
For technical support, including XC4VLX200-11FFG1513C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX200-11FFG1513C requirements.
6.How does Aetrix verify that XC4VLX200-11FFG1513C is sourced from the original manufacturer or authorized distributors?
All XC4VLX200-11FFG1513C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX200-11FFG1513C meets industry standards.
7.What is the process for return or replacement of XC4VLX200-11FFG1513C?
All XC4VLX200-11FFG1513C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX200-11FFG1513C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX200-11FFG1513C part is unused and in its original packaging.
Return procedure for XC4VLX200-11FFG1513C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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