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AMD XC4VLX25-10SF363C
- Part No.:
- XC4VLX25-10SF363C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 363-FBGA, FCBGA
- Datasheet:
-
XC4VLX25-10SF363C.pdf
- Description:
- IC FPGA 240 I/O 363FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,743
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Product details
Overview
XC4VLX25-10SF363C from AMD (formerly Xilinx) is a Virtex-4 LX family FPGA with 24,576 logic cells, 1.2 Mb of block RAM, and 192 DSP48 slices. It features a 363-pin Fine-Pitch Ball Grid Array (FBGA) package, operates at -10 speed grade (1.0 ns CLB delay), and targets high-performance logic and digital signal processing in wired infrastructure and test equipment.
For engineers reviewing the XC4VLX25-10SF363C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (240 user I/Os), voltage supply requirements (1.2 V core / 2.5 V I/O), thermal profile (junction temperature range: 0°C to 85°C), and configuration interface compatibility (JTAG, Master SelectMAP).
Technical Context
The XC4VLX25-10SF363C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated routing resources. It supports multi-voltage I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and includes integrated clock management tiles with DCMs for phase alignment and frequency synthesis.
This device uses 90 nm copper process technology and supports configuration via serial PROM, parallel slave mode, or JTAG boundary-scan. Its embedded PowerPC 405 cores are not present in the LX25 variant-only logic, memory, and DSP resources are implemented.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,576 - total programmable logic capacity for combinatorial and sequential logic implementation |
| Block RAM | 1,244,160 bits (1.2 Mb) - distributed across 192 x 64-bit dual-port RAM blocks for data buffering and FIFOs |
| DSP Slices | 192 - each performs 18×18-bit signed multiplication plus accumulate in one cycle for real-time filtering |
| User I/O Pins | 240 - configurable as single-ended or differential standards including LVDS, SSTL, HSTL |
| Speed Grade | -10 - guarantees maximum CLB propagation delay ≤1.0 ns under specified voltage/temperature conditions |
| Core Voltage | 1.2 V ±3% - strict regulation required; impacts dynamic power and timing closure |
| Operating Temp | 0°C to +85°C - commercial-grade thermal envelope suitable for controlled-environment systems |
Pinout & Package
XC4VLX25-10SF363C is housed in a 363-pin Fine-Pitch Ball Grid Array (FBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal pad on underside requires proper PCB thermal via design.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered and decoupled close to device; powers CLBs, RAM, and interconnect |
| VCCO_0–VCCO_15 | I/O bank power | Each bank independently configurable for 1.2–3.3 V; sets I/O standard voltage level |
| IO_Lx_y | Configurable I/O | Supports multiple standards per bank; differential pairs require adjacent pins |
| CCLK | Configuration clock | Drives internal configuration logic during master mode; max 50 MHz operation |
| DONE | Configuration status | Open-drain output pulled high when configuration completes successfully |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant boundary scan and debug access |
Key Features
| Feature | Design Value |
|---|---|
| ASMBL™ Architecture | Hierarchical tile-based layout enabling predictable timing and scalable floorplanning |
| Dedicated Clock Routing | Global and regional clock networks with low skew (<150 ps) for synchronous system design |
| Multi-Voltage I/O Banks | 16 independent banks support mixed-voltage interfaces without level shifters |
| DCM Clock Management | Two Digital Clock Managers per device provide jitter reduction, phase shifting, and frequency synthesis |
| SelectIO™ Technology | Supports 21 I/O standards including LVDS, RSDS, and SSTL-2/3 for interface flexibility |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channel coding, modulation/demodulation, and MIMO signal processing in 3G/LTE base stations. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom PHY-layer algorithms with deterministic latency. Use Value: 192 DSP48 slices enable concurrent execution of 16×16-bit complex multiply-accumulate operations at >150 MHz. | Use Scenario: High-precision pattern generation and response analysis in automated test equipment (ATE) for ASIC validation. IC Role / Device Role / Timing Role: Reconfigurable timing engine synchronizing multi-channel digital stimulus and capture subsystems. Use Value: 240 user I/Os with sub-nanosecond timing control support 32-bit wide parallel test vectors at 200+ MHz. |
| Industrial Imaging Systems | Avionics Data Concentrators |
Use Scenario: Pixel-level image preprocessing, color correction, and compression in machine vision cameras. IC Role / Device Role / Timing Role: Real-time pipeline accelerator interfacing with CMOS image sensors and DDR2 memory. Use Value: 1.2 Mb block RAM enables dual-frame buffering for seamless streaming at 60 fps with 12-bit depth. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging with protocol translation in flight control computers. IC Role / Device Role / Timing Role: Deterministic I/O controller managing time-critical avionics data routing and integrity checking. Use Value: Multi-voltage I/O banks allow direct connection to legacy 5 V and modern 3.3 V avionics peripherals without external translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC4VLX25-11FF668C | Higher speed grade (-11), 668-pin FFGBA package, 320 user I/Os, larger die area | Supports higher clock frequencies and more complex designs requiring additional I/O or routing resources | Choose when timing closure fails at -10 grade or board layout accommodates larger footprint |
| XCVU9P-L2FLGA2104E | UltraScale+ architecture, 920K logic cells, 48.8 Mb BRAM, 2,592 DSP slices, 2104-pin package | Targets AI inference acceleration, 5G NR baseband, and high-throughput packet processing | Choose for new designs requiring >10× logic density, PCIe Gen4, or DDR4 memory interfaces |
Compared with XC4VLX25-10SF363C, the XC4VLX25-11FF668C offers tighter timing margins in the same architecture but demands PCB redesign, while the XCVU9P-L2FLGA2104E delivers orders-of-magnitude resource scaling at significantly higher power and cost-making it unsuitable for drop-in replacement but viable for next-generation upgrades.
Availability
XC4VLX25-10SF363C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial test instrumentation, and avionics subsystems requiring stable component supply across extended production lifecycles.
Supply support for XC4VLX25-10SF363C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now leads development of adaptive computing platforms. Xilinx pioneered FPGA technology and introduced the Virtex series as its flagship high-performance product line.
The Virtex-4 LX family-including XC4VLX25-10SF363C-was engineered for demanding logic-intensive applications where deterministic timing, high I/O bandwidth, and embedded DSP capability are critical.
FAQ
What is the maximum operating frequency of the XC4VLX25-10SF363C?
The XC4VLX25-10SF363C has a -10 speed grade, guaranteeing a maximum CLB propagation delay of ≤1.0 ns under nominal 1.2 V core voltage and 85°C junction temperature. Actual achievable system clock frequency depends on design complexity and routing; typical synchronous logic paths reach 300–400 MHz in well-optimized implementations using the XC4VLX25-10SF363C.
Does the XC4VLX25-10SF363C support JTAG configuration?
Yes, the XC4VLX25-10SF363C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. Its TCK, TMS, TDI, and TDO pins enable configuration via JTAG chain, and the device can also be configured through Master SelectMAP or serial PROM modes. The XC4VLX25-10SF363C does not require external configuration controllers when using JTAG.
What I/O standards are supported by the XC4VLX25-10SF363C?
The XC4VLX25-10SF363C supports 21 SelectIO™ standards across its 16 I/O banks, including LVDS, RSDS, SSTL-2, SSTL-3, HSTL-I/II, and PCI-X. Each bank is independently powered, allowing mixed-voltage operation-for example, 2.5 V SSTL-2 on Bank 0 and 1.8 V HSTL on Bank 1-without external level shifters. This capability is integral to the XC4VLX25-10SF363C's interface flexibility.
Is the XC4VLX25-10SF363C RoHS compliant?
Yes, the XC4VLX25-10SF363C is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC JS709D requirements. It uses matte tin finish on solder balls and halogen-free molding compound. Compliance documentation, including Certificate of Conformance, is available upon request for the XC4VLX25-10SF363C.
Can the XC4VLX25-10SF363C be reconfigured in-system?
Yes, the XC4VLX25-10SF363C supports in-system reconfiguration (ISR) via JTAG or SelectMAP interface, enabling partial or full bitstream reload without power cycling. This allows field-upgradable functionality and dynamic hardware adaptation-critical for applications like protocol conversion or feature-on-demand in telecom gear using the XC4VLX25-10SF363C.
XC4VLX25-10SF363C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-4 LX
- Package/Case:
- 363-FBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2688
- Number of Logic Elements/Cells:
- 24192
- Total RAM Bits:
- 1327104
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 363-FCBGA (17x17)
XC4VLX25-10SF363C FAQ
1.How can I place an order for XC4VLX25-10SF363C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC4VLX25-10SF363C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC4VLX25-10SF363C reliable?
The price and inventory of XC4VLX25-10SF363C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC4VLX25-10SF363C is usually 5 days.
3.What payment methods are accepted for XC4VLX25-10SF363C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC4VLX25-10SF363C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC4VLX25-10SF363C?
XC4VLX25-10SF363C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC4VLX25-10SF363C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC4VLX25-10SF363C?
For technical support, including XC4VLX25-10SF363C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC4VLX25-10SF363C requirements.
6.How does Aetrix verify that XC4VLX25-10SF363C is sourced from the original manufacturer or authorized distributors?
All XC4VLX25-10SF363C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC4VLX25-10SF363C meets industry standards.
7.What is the process for return or replacement of XC4VLX25-10SF363C?
All XC4VLX25-10SF363C units undergo pre-shipment inspection (PSI). If there is an issue with XC4VLX25-10SF363C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC4VLX25-10SF363C part is unused and in its original packaging.
Return procedure for XC4VLX25-10SF363C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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